Infineon Technologies, Austria
Industry: Company
DescriptionInfineon Technologies Austria is a group subsidiary of Infineon Technologies. It employs 3785 people in around 60 countries with a large proportion in research. In 2017 the company made a turnover of €2.5 billion. Its headquarters are in Villach, Austria. Founded: 1970 Parent organization: Infineon Technologies Subsidiary: Infineon Technologies It-Services Gmbh
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Infineon Technologies, Austria Employees
Employee
Years
Job
Industry
Manfred Preitnegger Manfred Preitnegger's Infineon Technologies, Austria Experience 1997 - 2009
Job Managing Director bei Lantiq
Industry Semiconductors
Experience
Lantiq September 2013 - Present
Infineon Technologies Austria 1997 - 2009
Skills
Semiconductors, IC, SoC, Semiconductor Industry, Embedded Systems, Analog, Embedded Software, EDA, Wireless, Electronics, Product Marketing, RF, Product Management, Device Drivers, WiFi, R&D, Simulations, Halbleiter, Integrierte Schaltkreise, Halbleiterindustrie
Education
Technische Universität Wien 1972 — 1980
Dipl.-Ing., Elektrotechnik und Elektronik
Lantiq September 2013 - Present
Infineon Technologies Austria 1997 - 2009
Skills
Semiconductors, IC, SoC, Semiconductor Industry, Embedded Systems, Analog, Embedded Software, EDA, Wireless, Electronics, Product Marketing, RF, Product Management, Device Drivers, WiFi, R&D, Simulations, Halbleiter, Integrierte Schaltkreise, Halbleiterindustrie
Education
Technische Universität Wien 1972 — 1980
Dipl.-Ing., Elektrotechnik und Elektronik
David Laforet David Laforet's Infineon Technologies, Austria Experience April 2011 - Present
Job Technology Development Engineer
Industry Semiconductors
Experience
Infineon Technologies, Austria April 2011 - Present
International Rectifier, UK November 2009 - March 2011
Qimonda, Germany August 2005 - July 2009
Infineon Technologies, USA July 2001 - July 2005
Atmel Corporation, France March 1996 - June 2001
Skills
Semiconductors, R&D, Process Integration, JMP, Photolithography, Yield, SPC, Project Management, Microelectronics, Technical Project..., Silicon, DRAM, Semiconductor Industry, CMOS, Process Engineering, Characterization
Education
Université Claude Bernard Lyon 1 1988 — 1994
Master of Science, Integrated Electronic Devices
Infineon Technologies, Austria April 2011 - Present
International Rectifier, UK November 2009 - March 2011
Qimonda, Germany August 2005 - July 2009
Infineon Technologies, USA July 2001 - July 2005
Atmel Corporation, France March 1996 - June 2001
Skills
Semiconductors, R&D, Process Integration, JMP, Photolithography, Yield, SPC, Project Management, Microelectronics, Technical Project..., Silicon, DRAM, Semiconductor Industry, CMOS, Process Engineering, Characterization
Education
Université Claude Bernard Lyon 1 1988 — 1994
Master of Science, Integrated Electronic Devices
Liana Musat Liana Musat's Infineon Technologies, Austria Experience August 2009 - January 2011
Job Dipl.Ing. at Infineon Technologies
Industry Automotive
Experience
Infineon Technologies September 2011 - August 2015
KAI – Kompetenzzentrum Automobil- und Industrie- Elektronik GmbH February 2011 - August 2011
Infineon Technologies Austria August 2009 - January 2011
Infineon Technologies Romania February 2008 - July 2009
Skills
Simulations, Mixed Signal, IC, Semiconductors, Functional Verification, SoC, VHDL, Cadence, Embedded Systems, CMOS, Integrated Circuit..., Verilog
Education
Carinthia University of Applied Sciences 2009 — 2011
Master of Science, Integrated Systems and Circuit Design
Universitatea „Politehnica” din București 2004 — 2009
Diplomat engineer, Applied Electronics – Information Engineering
Infineon Technologies September 2011 - August 2015
KAI – Kompetenzzentrum Automobil- und Industrie- Elektronik GmbH February 2011 - August 2011
Infineon Technologies Austria August 2009 - January 2011
Infineon Technologies Romania February 2008 - July 2009
Skills
Simulations, Mixed Signal, IC, Semiconductors, Functional Verification, SoC, VHDL, Cadence, Embedded Systems, CMOS, Integrated Circuit..., Verilog
Education
Carinthia University of Applied Sciences 2009 — 2011
Master of Science, Integrated Systems and Circuit Design
Universitatea „Politehnica” din București 2004 — 2009
Diplomat engineer, Applied Electronics – Information Engineering
Peter Raggam Peter Raggam's Infineon Technologies, Austria Experience December 2004 - February 2014
Job Head of Product Management NFC Reader Solutions
Industry Semiconductors
Experience
NXP Semiconductors Austria March 2014 - Present
Infineon Technologies Austria December 2004 - February 2014
Philips Semiconductors 1995 - 2004
Skills
NFC, RFID, Antenna Design, Antennas, RF, Smart Cards, Standardization, IC, Development Management, Semiconductors, Analog, RFID+, Embedded Systems, Systems Engineering, Payment Systems, Cryptography, Mixed Signal, Embedded Software
Education
Technische Universität Graz 1987 — 1997
Graduate, Electronics and Communication Engineering
HTL Bulme Graz 1982 — 1987
Matura, Electrical Engineering
NXP Semiconductors Austria March 2014 - Present
Infineon Technologies Austria December 2004 - February 2014
Philips Semiconductors 1995 - 2004
Skills
NFC, RFID, Antenna Design, Antennas, RF, Smart Cards, Standardization, IC, Development Management, Semiconductors, Analog, RFID+, Embedded Systems, Systems Engineering, Payment Systems, Cryptography, Mixed Signal, Embedded Software
Education
Technische Universität Graz 1987 — 1997
Graduate, Electronics and Communication Engineering
HTL Bulme Graz 1982 — 1987
Matura, Electrical Engineering
Peter Mikl Peter Mikl's Infineon Technologies, Austria Experience October 1999 - August 2003
Job Teacher at a technical college (HTL) in Villach
Industry Information Technology and Services
Experience
HTL Villach September 2003 - Present
Infineon Technologies Austria October 1999 - August 2003
Infineon Technologies 2000 - 2003
Genesis PC-Handels¬gesellschaft October 1997 - October 1999
Skills
IT Service Management, Information Technology, Project Management, Training, Software Development
Education
Universität Wien 2010 — 2012
Bachelor of Arts (B.A.), Development Economics and International Development
Technische Universität Graz 1988 — 1996
Master of Science (M.Sc.), Information Technology
HTL Villach September 2003 - Present
Infineon Technologies Austria October 1999 - August 2003
Infineon Technologies 2000 - 2003
Genesis PC-Handels¬gesellschaft October 1997 - October 1999
Skills
IT Service Management, Information Technology, Project Management, Training, Software Development
Education
Universität Wien 2010 — 2012
Bachelor of Arts (B.A.), Development Economics and International Development
Technische Universität Graz 1988 — 1996
Master of Science (M.Sc.), Information Technology
Phani Peri's Infineon Technologies, Austria Experience January 2015 - Present
Job Sr Design Engineer at Infineon Technologies
Industry Automotive
Experience
Infineon Technologies Austria January 2015 - Present
Infineon Technologies Austria September 2013 - December 2014
Infineon Technologies July 2010 - August 2013
Skills
SystemVerilog, Specman, Functional Verification, NCSim, RTL design, VHDL, Verilog, SoC, ASIC, VLSI, C, Debugging, ModelSim, ARM, EDA, FPGA, Hardware Architecture
Education
Carnegie Mellon University 2006 — 2008
Master's Degree, Computer Engineering, 3.5
Osmania University 2001 — 2005
Bachelor of Science (BS), Electronics Instrumentation, University Topper
Infineon Technologies Austria January 2015 - Present
Infineon Technologies Austria September 2013 - December 2014
Infineon Technologies July 2010 - August 2013
Skills
SystemVerilog, Specman, Functional Verification, NCSim, RTL design, VHDL, Verilog, SoC, ASIC, VLSI, C, Debugging, ModelSim, ARM, EDA, FPGA, Hardware Architecture
Education
Carnegie Mellon University 2006 — 2008
Master's Degree, Computer Engineering, 3.5
Osmania University 2001 — 2005
Bachelor of Science (BS), Electronics Instrumentation, University Topper
Ajesh Ajayakumar's Infineon Technologies, Austria Experience April 2012 - Present
Job Process Integration Engineer at Infineon technologies Austria
Industry Semiconductors
Experience
Infineon technologies Austria April 2012 - Present
IMTEK,University of Freiburg December 2011 - April 2012
Robert Bosch May 2011 - November 2011
Robert Bosch October 2010 - February 2011
IMTEK,University of Freiburg July 2010 - December 2010
Skills
MEMS, Semiconductor..., Thin Films, LPCVD, PECVD, poly SiC, Wire bond testing, Ellipsometry, Photolithography, Wet Etching, four point measurement, wafer bow, Scanning Electron..., Solidworks, COMSOL 3.5, Matlab, Materials Science, Clean Rooms, Soldering, Sensors, mask layout, C++, Microsoft Office, Microsystems, Microfluidics, Interferometry, Control System Design, Publications, Electronics, Instrumentation, Measurements, COMSOL, Control Systems Design, Process Integration, Semiconductors, Silicon, CMOS, Characterization, CVD, Microelectronics
Education
Albert-Ludwigs-Universität Freiburg im Breisgau 2009 — 2011
MSc, Microsystems Engineering
College of Engineering, Trivandrum 2005 — 2009
BTech, Applied Electronics and Instrumentation Engineering
Infineon technologies Austria April 2012 - Present
IMTEK,University of Freiburg December 2011 - April 2012
Robert Bosch May 2011 - November 2011
Robert Bosch October 2010 - February 2011
IMTEK,University of Freiburg July 2010 - December 2010
Skills
MEMS, Semiconductor..., Thin Films, LPCVD, PECVD, poly SiC, Wire bond testing, Ellipsometry, Photolithography, Wet Etching, four point measurement, wafer bow, Scanning Electron..., Solidworks, COMSOL 3.5, Matlab, Materials Science, Clean Rooms, Soldering, Sensors, mask layout, C++, Microsoft Office, Microsystems, Microfluidics, Interferometry, Control System Design, Publications, Electronics, Instrumentation, Measurements, COMSOL, Control Systems Design, Process Integration, Semiconductors, Silicon, CMOS, Characterization, CVD, Microelectronics
Education
Albert-Ludwigs-Universität Freiburg im Breisgau 2009 — 2011
MSc, Microsystems Engineering
College of Engineering, Trivandrum 2005 — 2009
BTech, Applied Electronics and Instrumentation Engineering
Karl Pilch's Infineon Technologies, Austria Experience March 2012 - Present
Job Senior Engineer Wafer Thinning at Infineon Technologies Austria
Industry Semiconductors
Experience
Infineon Technologies Austria March 2012 - Present
Infineon Technologies Austria November 2010 - February 2012
Universität Innsbruck February 2010 - October 2010
Tiroler Landesregierung February 2010 - October 2010
University of Toronto March 2009 - November 2009
University of Innsbruck July 2005 - February 2009
Skills
Semiconductor Process..., Wafer surface/thickness..., Wet Spin-Etch Processes, Thin-Wafer Carrier..., Wet Chemical Etching, Advanced Process Control, Statistics, 8D Problem Solving, FMEA, Cornerstone, PL/SQL, Mathematical Modeling, Optics, Spectroscopy, Physics, Science
Education
Leopold-Franzens Universität Innsbruck / University of Innsbruck 2005 — 2009
Doctor of Philosophy (PhD), Experimental Physics, Quantum Optics
Leopold-Franzens Universität Innsbruck 1999 — 2005
Mag. rer. nat., Physics
Infineon Technologies Austria March 2012 - Present
Infineon Technologies Austria November 2010 - February 2012
Universität Innsbruck February 2010 - October 2010
Tiroler Landesregierung February 2010 - October 2010
University of Toronto March 2009 - November 2009
University of Innsbruck July 2005 - February 2009
Skills
Semiconductor Process..., Wafer surface/thickness..., Wet Spin-Etch Processes, Thin-Wafer Carrier..., Wet Chemical Etching, Advanced Process Control, Statistics, 8D Problem Solving, FMEA, Cornerstone, PL/SQL, Mathematical Modeling, Optics, Spectroscopy, Physics, Science
Education
Leopold-Franzens Universität Innsbruck / University of Innsbruck 2005 — 2009
Doctor of Philosophy (PhD), Experimental Physics, Quantum Optics
Leopold-Franzens Universität Innsbruck 1999 — 2005
Mag. rer. nat., Physics
Cristian Ionascu's Infineon Technologies, Austria Experience January 2015 - Present
Job Analog Design Lead / Analog and Mixed Signal Design Engineer at Infineon Technologies Austria
Industry Semiconductors
Experience
Infineon Technologies Austria January 2015 - Present
Infineon Technologies Austria August 2011 - December 2014
Micronas October 2010 - August 2011
Infineon Technologies Romania May 2008 - October 2010
Infineon Technologies Romania February 2006 - May 2008
AsicArt May 2003 - January 2006
Electronics and Telecommunications Faculty, Iasi Romania October 2000 - January 2006
AsicArt February 2001 - May 2003
Skills
Analog, Mixed Signal, Silicon, Analog Design, IC, CMOS, Semiconductors, Simulation, SoC, ASIC, EDA, VHDL, Verilog, Electronics, CAD, Sensors, Analog Circuit Design, Low-power Design, Circuit Design, Simulations, TCL, Integrated Circuit..., NCSim, LVS, Physical Design, Floorplanning, Power Management, Spectre, FPGA, VLSI, Physical Verification
Education
2000 — 2001
Master Diploma
1995 — 2000
Bachelor-Diploma Engineer
Infineon Technologies Austria January 2015 - Present
Infineon Technologies Austria August 2011 - December 2014
Micronas October 2010 - August 2011
Infineon Technologies Romania May 2008 - October 2010
Infineon Technologies Romania February 2006 - May 2008
AsicArt May 2003 - January 2006
Electronics and Telecommunications Faculty, Iasi Romania October 2000 - January 2006
AsicArt February 2001 - May 2003
Skills
Analog, Mixed Signal, Silicon, Analog Design, IC, CMOS, Semiconductors, Simulation, SoC, ASIC, EDA, VHDL, Verilog, Electronics, CAD, Sensors, Analog Circuit Design, Low-power Design, Circuit Design, Simulations, TCL, Integrated Circuit..., NCSim, LVS, Physical Design, Floorplanning, Power Management, Spectre, FPGA, VLSI, Physical Verification
Education
2000 — 2001
Master Diploma
1995 — 2000
Bachelor-Diploma Engineer
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