Quantum Leap Packaging
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Quantum Leap Packaging Employees
Employee
Years
Job
Industry
Carolyn Gallagher Carolyn Gallagher's Quantum Leap Packaging Experience January 2004 - January 2006
Job Administrative Assistant at Presidio Networking Solutions
Industry Computer Networking
Experience
TomTom January 2014 - February 2014
Discovery Labware, Inc. l A Corning Subsidiary July 2013 - December 2013
The Cadmus Group, Inc. July 2013 - July 2013
iGATE Technologies, Inc. (formerly Patni Americas, Inc.) November 2010 - August 2012
Thermo Fisher Scientific January 2008 - November 2010
Tufts Health Plan January 2006 - December 2007
Quantum Leap Packaging January 2004 - January 2006
Skills
Microsoft Office..., Invoicing, Concur, Peoplesoft, Global Travel..., Sharepoint, PeopleSoft, SharePoint, Spreadsheets, Accounts Payable, Access, Executive..., Executive Support, Office Administration, Office Management, Calendaring, Data Entry, Telephone Skills, Time Management, Administrative..., Office Equipment, Confidentiality, Filing, Microsoft Excel, Microsoft Office, Travel Arrangements, Calendars, Human Resources, Payroll, Expenses, Microsoft Office 2007, Process Scheduler, Lotus Notes, Expense Reports, Recruiting, Training, QuickBooks, Microsoft Word, PowerPoint, Software Documentation, Fax, Management, Internet Explorer, Accounts Receivable, Invoice Processing, File Management, Adobe Acrobat, Travel Planning, Microsoft Publisher, Outlook
Education
Northeastern University
Bachelor of Science (B.S.), Marketing
TomTom January 2014 - February 2014
Discovery Labware, Inc. l A Corning Subsidiary July 2013 - December 2013
The Cadmus Group, Inc. July 2013 - July 2013
iGATE Technologies, Inc. (formerly Patni Americas, Inc.) November 2010 - August 2012
Thermo Fisher Scientific January 2008 - November 2010
Tufts Health Plan January 2006 - December 2007
Quantum Leap Packaging January 2004 - January 2006
Skills
Microsoft Office..., Invoicing, Concur, Peoplesoft, Global Travel..., Sharepoint, PeopleSoft, SharePoint, Spreadsheets, Accounts Payable, Access, Executive..., Executive Support, Office Administration, Office Management, Calendaring, Data Entry, Telephone Skills, Time Management, Administrative..., Office Equipment, Confidentiality, Filing, Microsoft Excel, Microsoft Office, Travel Arrangements, Calendars, Human Resources, Payroll, Expenses, Microsoft Office 2007, Process Scheduler, Lotus Notes, Expense Reports, Recruiting, Training, QuickBooks, Microsoft Word, PowerPoint, Software Documentation, Fax, Management, Internet Explorer, Accounts Receivable, Invoice Processing, File Management, Adobe Acrobat, Travel Planning, Microsoft Publisher, Outlook
Education
Northeastern University
Bachelor of Science (B.S.), Marketing
Bill DiNardo Bill DiNardo's Quantum Leap Packaging Experience 2001 - 2002
Job Business Development Consultant
Industry Electrical/Electronic Manufacturing
Experience
Self Employed Independent March 2013 - Present
Platronics Seals August 2010 - February 2013
Groton Biosystems November 2003 - August 2010
Quantum Leap Packaging 2001 - 2002
Tech-Ceram Corporation September 1988 - June 2000
Skills
Product Management, Product Development, Technology Transfer, Semiconductors, Biotechnology, Manufacturing, Start-ups, Process Engineering, Electronics, Continuous Improvement, Strategic Planning, Strategy, Purchasing, Supply Chain Management, Leadership, Cross-functional Team..., Contract Negotiation, R&D, Business Development, Six Sigma, Salesforce.com, Engineering, Medical Devices
Education
Southern New Hampshire University 1980 — 1983
MBA, Business Administration
Self Employed Independent March 2013 - Present
Platronics Seals August 2010 - February 2013
Groton Biosystems November 2003 - August 2010
Quantum Leap Packaging 2001 - 2002
Tech-Ceram Corporation September 1988 - June 2000
Skills
Product Management, Product Development, Technology Transfer, Semiconductors, Biotechnology, Manufacturing, Start-ups, Process Engineering, Electronics, Continuous Improvement, Strategic Planning, Strategy, Purchasing, Supply Chain Management, Leadership, Cross-functional Team..., Contract Negotiation, R&D, Business Development, Six Sigma, Salesforce.com, Engineering, Medical Devices
Education
Southern New Hampshire University 1980 — 1983
MBA, Business Administration
Jim LaCasse Jim LaCasse's Quantum Leap Packaging Experience September 2004 - September 2006
Job President & CEO at NexPlanar Corporation
Industry Semiconductors
Experience
NexPlanar Corporation April 2007 - Present
NexPlanar Corporation April 2007 - Present
Inpria Corporation October 2011 - Present
Quantum Leap Packaging September 2004 - September 2006
Sumitomo Chemical (Sumika Electronic Materials) September 2001 - September 2004
Prism Support September 2000 - September 2001
Arch Chemicals June 1999 - September 2000
Fujifilm Olin Co. Ltd (Fujifilm Arch Co. Ltd) May 1995 - September 2000
Olin Corporation September 1996 - June 1999
OCG (JV Olin/Ciba Geigy) January 1991 - June 1996
Education
Claremont Graduate University - Peter F. Drucker and Masatoshi Ito Graduate School of Management
MBA, International Finance/Management Strategy
Claremont Graduate University - Peter F. Drucker and Masatoshi Ito Graduate School of Management
MA, Industrial Marketing/Management
Le Moyne College
BS, Labor Relations, Physics
NexPlanar Corporation April 2007 - Present
NexPlanar Corporation April 2007 - Present
Inpria Corporation October 2011 - Present
Quantum Leap Packaging September 2004 - September 2006
Sumitomo Chemical (Sumika Electronic Materials) September 2001 - September 2004
Prism Support September 2000 - September 2001
Arch Chemicals June 1999 - September 2000
Fujifilm Olin Co. Ltd (Fujifilm Arch Co. Ltd) May 1995 - September 2000
Olin Corporation September 1996 - June 1999
OCG (JV Olin/Ciba Geigy) January 1991 - June 1996
Education
Claremont Graduate University - Peter F. Drucker and Masatoshi Ito Graduate School of Management
MBA, International Finance/Management Strategy
Claremont Graduate University - Peter F. Drucker and Masatoshi Ito Graduate School of Management
MA, Industrial Marketing/Management
Le Moyne College
BS, Labor Relations, Physics
Mark A. Torgrimson Mark A. Torgrimson's Quantum Leap Packaging Experience October 2007 - February 2009
Job manufacturing engineering designer at Senior Aerospace Metal Bellows
Industry Mechanical or Industrial Engineering
Experience
Senior Aerospace Metal Bellows October 2011 - Present
Interplex Engineered Products July 2010 - October 2011
unemployed February 2009 - 2010
Quantum Leap Packaging October 2007 - February 2009
Handy and Harman Electronic Materials 2005 - 2007
Interplex Metal Logic Inc. 1998 - 2005
Skills
Machine Tools, Manufacturing, Machining, Stamping, Injection Molding, Product Design
Education
University of Minnesota-Twin Cities 1983 — 1985
Senior Aerospace Metal Bellows October 2011 - Present
Interplex Engineered Products July 2010 - October 2011
unemployed February 2009 - 2010
Quantum Leap Packaging October 2007 - February 2009
Handy and Harman Electronic Materials 2005 - 2007
Interplex Metal Logic Inc. 1998 - 2005
Skills
Machine Tools, Manufacturing, Machining, Stamping, Injection Molding, Product Design
Education
University of Minnesota-Twin Cities 1983 — 1985
Fabiola Wells Fabiola Wells's Quantum Leap Packaging Experience November 2007 - January 2009
Job Manufacturing Engineer at Cobham Defense Electronic Systems
Industry Electrical/Electronic Manufacturing
Experience
Cobham Defense Electronic Systems May 2010 - Present
Quantum Leap Packaging November 2007 - January 2009
Kyocera America Inc. April 2006 - November 2007
Kyocera America Inc. January 2001 - April 2006
Education
University of California, San Diego 2009 — 2010
Professional Dual Certificate, Occupational Health and Safety, General Industry and Construction.
San Diego State University-California State University 2007 — 2007
Lean Six Sigma Black Belt Certificated
University of San Diego 2005 — 2005
Lean Enterprise Certificated
Instituto Tecnológico de Tijuana 1995 — 2000
Bachelor in Science, Industrial Engineering
University of California, San Diego
Certificate, EM385-1-1
Cobham Defense Electronic Systems May 2010 - Present
Quantum Leap Packaging November 2007 - January 2009
Kyocera America Inc. April 2006 - November 2007
Kyocera America Inc. January 2001 - April 2006
Education
University of California, San Diego 2009 — 2010
Professional Dual Certificate, Occupational Health and Safety, General Industry and Construction.
San Diego State University-California State University 2007 — 2007
Lean Six Sigma Black Belt Certificated
University of San Diego 2005 — 2005
Lean Enterprise Certificated
Instituto Tecnológico de Tijuana 1995 — 2000
Bachelor in Science, Industrial Engineering
University of California, San Diego
Certificate, EM385-1-1
Lisa Hamel Lisa Hamel's Quantum Leap Packaging Experience May 2007 - February 2009
Job Sr Manager of CI at Cobham
Industry Electrical/Electronic Manufacturing
Experience
Cobham Defense Electronic Systems May 2009 - Present
Quantum Leap Packaging May 2007 - February 2009
Kyocera 2005 - 2007
Kyocera America Inc September 2002 - April 2005
Kyocera America Inc July 1998 - September 2002
Tech-Ceram 1987 - 1998
Ceramics Process Systems 1984 - 1987
Brush Wellman 1980 - 1984
Skills
Lean Manufacturing, Continuous Improvement, Engineering Management, Six Sigma, Manufacturing, Design of Experiments, Operations Management, Process Engineering, Cross-functional Team..., Program Management, Process Improvement, 5S, Root Cause Analysis, Semiconductors, SPC, Operational Excellence, Kaizen, FMEA, Product Development, Electronics, Engineering, Team Management, Coaching, Mentoring, Ceramic Processing, Leadership, TQM, ISO, Manufacturing...
Education
Kennedy-Western University 2001 — 2005
BS Engineering
University of Massachusetts Lowell 1982 — 1986
BSME
United States Military Academy at West Point 1978 — 1980
Triton Regional High School
Cobham Defense Electronic Systems May 2009 - Present
Quantum Leap Packaging May 2007 - February 2009
Kyocera 2005 - 2007
Kyocera America Inc September 2002 - April 2005
Kyocera America Inc July 1998 - September 2002
Tech-Ceram 1987 - 1998
Ceramics Process Systems 1984 - 1987
Brush Wellman 1980 - 1984
Skills
Lean Manufacturing, Continuous Improvement, Engineering Management, Six Sigma, Manufacturing, Design of Experiments, Operations Management, Process Engineering, Cross-functional Team..., Program Management, Process Improvement, 5S, Root Cause Analysis, Semiconductors, SPC, Operational Excellence, Kaizen, FMEA, Product Development, Electronics, Engineering, Team Management, Coaching, Mentoring, Ceramic Processing, Leadership, TQM, ISO, Manufacturing...
Education
Kennedy-Western University 2001 — 2005
BS Engineering
University of Massachusetts Lowell 1982 — 1986
BSME
United States Military Academy at West Point 1978 — 1980
Triton Regional High School
Steve Belisle Steve Belisle's Quantum Leap Packaging Experience March 2008 - February 2009
Job Sr. Process engineer at iQLP LLC
Industry Plastics
Experience
iQLP LLC October 2012 - Present
Interplex Engineered Products August 2009 - June 2012
Quantum Leap Packaging March 2008 - February 2009
Dorel Juvenile Group May 1995 - August 2007
Dorel Juvenile Group 1995 - 2007
Davol, Inc. June 1992 - May 1995
Skills
Product Development, Injection Molding, Manufacturing, Project Management, Plastics, Molding, Engineering, Materials, Kaizen, Manufacturing..., Product Design, Design of Experiments, Supply Chain, Machine Tools, Polymers, SPC, Manufacturing..., FMEA, Materials Science, Design for Manufacturing, Continuous Improvement, Lean Manufacturing
Education
University of Massachusetts at Lowell 1974 — 1978
Bachelor of Science (BSc), Plastics Engineering
iQLP LLC October 2012 - Present
Interplex Engineered Products August 2009 - June 2012
Quantum Leap Packaging March 2008 - February 2009
Dorel Juvenile Group May 1995 - August 2007
Dorel Juvenile Group 1995 - 2007
Davol, Inc. June 1992 - May 1995
Skills
Product Development, Injection Molding, Manufacturing, Project Management, Plastics, Molding, Engineering, Materials, Kaizen, Manufacturing..., Product Design, Design of Experiments, Supply Chain, Machine Tools, Polymers, SPC, Manufacturing..., FMEA, Materials Science, Design for Manufacturing, Continuous Improvement, Lean Manufacturing
Education
University of Massachusetts at Lowell 1974 — 1978
Bachelor of Science (BSc), Plastics Engineering
Brian Burgess's Quantum Leap Packaging Experience January 2006 - January 2009
Job Senior Design Engineer at Atrium Medical
Industry Medical Devices
Experience
Atrium Medical January 2012 - Present
Rockwell Automation June 2011 - January 2012
Cobham Tactical Communications & Surveillance February 2010 - March 2011
Accellent June 2009 - September 2009
Quantum Leap Packaging January 2006 - January 2009
Quantum Leap Packaging September 2004 - December 2006
Bell Labs Lucent Technologies 2000 - 2002
Lucent Technologies 1999 - 2000
Lucent Technologies 1996 - 1999
AT&T Network Systems 1988 - 1996
Education
University of Massachusetts Lowell 2003 — 2004
Certificate, Plastics Engineering Technology
Brigham Young University 1985 — 1990
MS CIM, Computer Integrated Manufacturing
University of Lowell 1980 — 1984
BSME, Mechanical Engineering
Atrium Medical January 2012 - Present
Rockwell Automation June 2011 - January 2012
Cobham Tactical Communications & Surveillance February 2010 - March 2011
Accellent June 2009 - September 2009
Quantum Leap Packaging January 2006 - January 2009
Quantum Leap Packaging September 2004 - December 2006
Bell Labs Lucent Technologies 2000 - 2002
Lucent Technologies 1999 - 2000
Lucent Technologies 1996 - 1999
AT&T Network Systems 1988 - 1996
Education
University of Massachusetts Lowell 2003 — 2004
Certificate, Plastics Engineering Technology
Brigham Young University 1985 — 1990
MS CIM, Computer Integrated Manufacturing
University of Lowell 1980 — 1984
BSME, Mechanical Engineering
Kent Siderwitch's Quantum Leap Packaging Experience June 2004 - January 2009
Job Quality Consultant at Advanced Programs, Inc.
Industry Electrical/Electronic Manufacturing
Experience
Advanced Programs, Inc. May 2010 - Present
Quantum Leap Packaging June 2004 - January 2009
Lucent Technologies 1980 - 2003
Skills
FMEA, Engineering Management, Continuous Improvement, SQL, Failure Analysis, MS Project, Kaizen, Training, Root Cause Analysis, Engineering, Strategic Planning, Start-ups, Manufacturing..., ISO, Manufacturing, Process Improvement, Troubleshooting, Semiconductors
Education
University of Massachusetts Lowell 1975 — 1981
Andover High School 1973 — 1975
Science and Technology
Advanced Programs, Inc. May 2010 - Present
Quantum Leap Packaging June 2004 - January 2009
Lucent Technologies 1980 - 2003
Skills
FMEA, Engineering Management, Continuous Improvement, SQL, Failure Analysis, MS Project, Kaizen, Training, Root Cause Analysis, Engineering, Strategic Planning, Start-ups, Manufacturing..., ISO, Manufacturing, Process Improvement, Troubleshooting, Semiconductors
Education
University of Massachusetts Lowell 1975 — 1981
Andover High School 1973 — 1975
Science and Technology
Mark Torgrimsom's Quantum Leap Packaging Experience Sr. Tooling EngineerQuantum Leap PackagingOctober 2007 - Present
Job Tooling Engineer at Quantum Leap Packaging
Industry Mechanical or Industrial Engineering
Experience
Quantum Leap Packaging Sr. Tooling EngineerQuantum Leap PackagingOctober 2007 - Present
Handy and Harman Electronic materials August 2005 - July 2007
Education
University of Minnesota-Twin Cities
Mechanical Engineering
Quantum Leap Packaging Sr. Tooling EngineerQuantum Leap PackagingOctober 2007 - Present
Handy and Harman Electronic materials August 2005 - July 2007
Education
University of Minnesota-Twin Cities
Mechanical Engineering
Bill DiNardo's Quantum Leap Packaging Experience 2001 - 2002
Job President and CEO at Groton Biosystems
Industry Biotechnology
Experience
Groton Biosystems November 2002 - Present
Quantum Leap Packaging 2001 - 2002
Tech-Ceram Corporation January 1986 - June 1999
Education
Southern New Hampshire University 1980 — 1985
MBA, Business Administration
Southern New Hampshire University
BS, Marketing
Groton Biosystems November 2002 - Present
Quantum Leap Packaging 2001 - 2002
Tech-Ceram Corporation January 1986 - June 1999
Education
Southern New Hampshire University 1980 — 1985
MBA, Business Administration
Southern New Hampshire University
BS, Marketing
Ronald Brosas's Quantum Leap Packaging Experience September 2007 - February 2009
Job Manufacturing Engineer at Cobham Defense Electronic Systems
Industry Defense & Space
Experience
Cobham Sensor Systems, San Diego CA 2009 - Present
Component Surfaces, Inc April 2009 - November 2009
Quantum Leap Packaging September 2007 - February 2009
Kyocera America, Inc May 2004 - February 2007
Kyocera America, Inc. 1995 - 2007
Skills
Six Sigma, Product Development, Manufacturing, Lean Manufacturing, Semiconductors, Design for Manufacturing, Design of Experiments, Engineering Management, Manufacturing..., Materials, SPC
Education
University of Santo Tomas 1990 — 1995
BSEE, Electrical Engineering
Cobham Sensor Systems, San Diego CA 2009 - Present
Component Surfaces, Inc April 2009 - November 2009
Quantum Leap Packaging September 2007 - February 2009
Kyocera America, Inc May 2004 - February 2007
Kyocera America, Inc. 1995 - 2007
Skills
Six Sigma, Product Development, Manufacturing, Lean Manufacturing, Semiconductors, Design for Manufacturing, Design of Experiments, Engineering Management, Manufacturing..., Materials, SPC
Education
University of Santo Tomas 1990 — 1995
BSEE, Electrical Engineering
Donald Welling's Quantum Leap Packaging Experience September 2002 - September 2005
Job Director of Engineering
Industry Medical Devices
Experience
Accellent 2005 - Present
Quantum Leap Packaging September 2002 - September 2005
Alcatel-Lucent 2000 - 2002
Microtouch systems 1999 - 2001
Lutron Electronics 1994 - 1999
Skills
Finite Element Analysis, Engineering, Quality Management, Process Simulation, Process Engineering, FDA, Injection Molding, Manufacturing..., FMEA, Design of Experiments, 5S, Value Stream Mapping, Medical Devices, Process Improvement, SPC, Systems Engineering, Solidworks, Product Development, Design Control, Six Sigma, Root Cause Analysis, GD&T, Manufacturing, Design for Manufacturing, ISO 13485, Quality Assurance, ISO 14971, Quality System, Kaizen, Product Management, Contract Manufacturing, R&D, Continuous Improvement, Validation, Engineering Management, Pro Engineer, Lean Manufacturing, Electronics, Biomedical Engineering, Mechanical Engineering, Program Management, Minitab, CAPA, Machining, Product Design, Cross-functional Team..., Plastics, MS Project, Manufacturing..., Operations Management
Education
Penn State University 1990 — 1994
BSME, Mechanical Engineering
Accellent 2005 - Present
Quantum Leap Packaging September 2002 - September 2005
Alcatel-Lucent 2000 - 2002
Microtouch systems 1999 - 2001
Lutron Electronics 1994 - 1999
Skills
Finite Element Analysis, Engineering, Quality Management, Process Simulation, Process Engineering, FDA, Injection Molding, Manufacturing..., FMEA, Design of Experiments, 5S, Value Stream Mapping, Medical Devices, Process Improvement, SPC, Systems Engineering, Solidworks, Product Development, Design Control, Six Sigma, Root Cause Analysis, GD&T, Manufacturing, Design for Manufacturing, ISO 13485, Quality Assurance, ISO 14971, Quality System, Kaizen, Product Management, Contract Manufacturing, R&D, Continuous Improvement, Validation, Engineering Management, Pro Engineer, Lean Manufacturing, Electronics, Biomedical Engineering, Mechanical Engineering, Program Management, Minitab, CAPA, Machining, Product Design, Cross-functional Team..., Plastics, MS Project, Manufacturing..., Operations Management
Education
Penn State University 1990 — 1994
BSME, Mechanical Engineering
Danilo Lai's Quantum Leap Packaging Experience August 2008 - May 2009
Job Project Manager Latin America (Senior Management)
Industry Mechanical or Industrial Engineering
Experience
Sumitomo Drive Technologies January 2014 - Present
Sumitomo Machinery Corp. of America January 2011 - December 2013
Sumitomo Machinery Corp. of America September 2009 - December 2010
Quantum Leap Packaging August 2008 - May 2009
iRobot January 2007 - May 2007
Fraunhofer USA May 2006 - January 2007
Skills
5S, AutoCAD, Bearings, CAD, Continuous Improvement, Cross-functional Team..., Engineering, Finite Element Analysis, Integration, Inventor, Leadership, Lean Manufacturing, Logistics, Manufacturing, Manufacturing..., Materials, Mechanical Engineering, Pricing, Process Improvement, Procurement, Product Development, Product Management, Project Engineering, Six Sigma, Solidworks, Supply Chain, Supply Chain Management, Testing, Project Management
Education
Tufts University 2007 — 2009
M.S., Mechanical Engineering
Boston University 2003 — 2007
B.S., Manufacturing Engineering
Graded
Sumitomo Drive Technologies January 2014 - Present
Sumitomo Machinery Corp. of America January 2011 - December 2013
Sumitomo Machinery Corp. of America September 2009 - December 2010
Quantum Leap Packaging August 2008 - May 2009
iRobot January 2007 - May 2007
Fraunhofer USA May 2006 - January 2007
Skills
5S, AutoCAD, Bearings, CAD, Continuous Improvement, Cross-functional Team..., Engineering, Finite Element Analysis, Integration, Inventor, Leadership, Lean Manufacturing, Logistics, Manufacturing, Manufacturing..., Materials, Mechanical Engineering, Pricing, Process Improvement, Procurement, Product Development, Product Management, Project Engineering, Six Sigma, Solidworks, Supply Chain, Supply Chain Management, Testing, Project Management
Education
Tufts University 2007 — 2009
M.S., Mechanical Engineering
Boston University 2003 — 2007
B.S., Manufacturing Engineering
Graded
Henri Asselin's Quantum Leap Packaging Experience October 2006 - October 2007
Job Engineering Manager at Lake Region Medical (formerly Accellent)
Industry Medical Devices
Experience
Lake Region Medical (Formerly Accellent) January 2012 - Present
Accellent June 2010 - January 2012
Accellent October 2007 - June 2010
Quantum Leap Packaging October 2006 - October 2007
Corning Life Sciences October 1999 - October 2006
Precision Tool & Die November 1995 - October 1999
Johnson & Johnson September 1994 - November 1995
Skills
Injection Molding, Plastic Part Design, Medical Devices, Plastics, Design for Manufacturing, ISO 13485, Molding, Plastics Engineering, Design Control, Manufacturing, Cross-functional Team..., Product Development, GD, Value Stream Mapping, Product Launch
Education
University of Massachusetts Lowell 1997 — 2006
MS, Plastics Engineering, Concentration in Design
University of Massachusetts Lowell 1990 — 1994
BS, Plastics Engineering
University of Michigan
Certificate, Lean Product Development
Lowell High School 1986 — 1990
Lake Region Medical (Formerly Accellent) January 2012 - Present
Accellent June 2010 - January 2012
Accellent October 2007 - June 2010
Quantum Leap Packaging October 2006 - October 2007
Corning Life Sciences October 1999 - October 2006
Precision Tool & Die November 1995 - October 1999
Johnson & Johnson September 1994 - November 1995
Skills
Injection Molding, Plastic Part Design, Medical Devices, Plastics, Design for Manufacturing, ISO 13485, Molding, Plastics Engineering, Design Control, Manufacturing, Cross-functional Team..., Product Development, GD, Value Stream Mapping, Product Launch
Education
University of Massachusetts Lowell 1997 — 2006
MS, Plastics Engineering, Concentration in Design
University of Massachusetts Lowell 1990 — 1994
BS, Plastics Engineering
University of Michigan
Certificate, Lean Product Development
Lowell High School 1986 — 1990
Anthony Carito's Quantum Leap Packaging Experience 2006 - 2007
Job Quality Control Technician
Industry Aviation & Aerospace
Experience
BAE Systems July 2013 - October 2013
Meggitt Avionics February 2013 - June 2013
Paradigm Technology March 2012 - July 2012
Applied Materials April 2011 - March 2012
Sig Sauer September 2012 - 2012
Azure Dynamics January 2011 - March 2011
Keystone Dental Inc. March 2010 - July 2010
Goodrich ISR Systems October 2007 - March 2010
Hardric Laboratories January 2007 - 2007
Quantum Leap Packaging 2006 - 2007
Skills
CMM , Brown & Sharp ,..., IPC 610 , IPC 620..., Calibration control, Geometric Dimensioning..., ISO auditor, ESD control, PC, Inspection, ISO, Medical Devices, Product Development, Auditing, Engineering, Testing, Aerospace, Electronics, Quality Control, Manufacturing, SPC, Calibration, Root Cause Analysis, Quality System
Education
Merrimack College
Mechanical Engineering Related Technologies
BAE Systems July 2013 - October 2013
Meggitt Avionics February 2013 - June 2013
Paradigm Technology March 2012 - July 2012
Applied Materials April 2011 - March 2012
Sig Sauer September 2012 - 2012
Azure Dynamics January 2011 - March 2011
Keystone Dental Inc. March 2010 - July 2010
Goodrich ISR Systems October 2007 - March 2010
Hardric Laboratories January 2007 - 2007
Quantum Leap Packaging 2006 - 2007
Skills
CMM , Brown & Sharp ,..., IPC 610 , IPC 620..., Calibration control, Geometric Dimensioning..., ISO auditor, ESD control, PC, Inspection, ISO, Medical Devices, Product Development, Auditing, Engineering, Testing, Aerospace, Electronics, Quality Control, Manufacturing, SPC, Calibration, Root Cause Analysis, Quality System
Education
Merrimack College
Mechanical Engineering Related Technologies
Kenneth Swiga Onyango's Quantum Leap Packaging Experience 2006 - 2007
Job Process and Development Engineer at Greater Boston
Industry Mechanical or Industrial Engineering
Experience
Greater Boston 2010 - Present
Quantum Leap Packaging 2006 - 2007
Barry Controls 2000 - 2004
Skills
Lean Manufacturing, Injection Molding, Engineering, SPC, Product Development, Manufacturing, Kaizen, Plastics, Design of Experiments, FMEA, Six Sigma, Continuous Improvement, Design for Manufacturing, Manufacturing..., 5S, Root Cause Analysis, Process Engineering, DMAIC, Manufacturing..., Quality System
Education
UMass Lowell 1994 — 2000
Bachelor of Science (BS), Plastics Engineering
UMass Lowell 1994 — 2000
Bachelor of Science (BS), Plastics Engineering
St. Marys School
International Baccalaureate, College/University Preparatory and Advanced High School/Secondary Diploma Program
Greater Boston 2010 - Present
Quantum Leap Packaging 2006 - 2007
Barry Controls 2000 - 2004
Skills
Lean Manufacturing, Injection Molding, Engineering, SPC, Product Development, Manufacturing, Kaizen, Plastics, Design of Experiments, FMEA, Six Sigma, Continuous Improvement, Design for Manufacturing, Manufacturing..., 5S, Root Cause Analysis, Process Engineering, DMAIC, Manufacturing..., Quality System
Education
UMass Lowell 1994 — 2000
Bachelor of Science (BS), Plastics Engineering
UMass Lowell 1994 — 2000
Bachelor of Science (BS), Plastics Engineering
St. Marys School
International Baccalaureate, College/University Preparatory and Advanced High School/Secondary Diploma Program