Winbond Company
Industry: Corporation
DescriptionWinbond Electronics Corporation is a Taiwan-based corporation founded in 1987 that produces semiconductors and several types of integrated circuits, most notably Dynamic RAM, Static RAM, microcontrollers, and personal computer ICs, namely Super I/O chips. Headquarters: Taiwan Founded: 1987 Subsidiaries: Nuvoton, Winbond Electronics Corporation America,
Winbond List of Employees There's an exhaustive list of past and present employees! Get comprehensive information on the number of employees at Winbond. You can filter them based on skills, years of employment, job, education, department, and prior employment.
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Winbond Employees
Employee
Years
Job
Industry
Jock Ochiltree Jock Ochiltree's Winbond Experience 1999 - 2000
Job Realtor at Davidson Realty
Industry Real Estate
Experience
Davidson Realty, Inc December 2006 - Present
Cafe St George & JJ's Heritage Cafe June 2005 - January 2011
Georgia Tech Savannah 2005 - 2011
Various Semiconductor Companies 1970 - 2005
Theta Microelectronics 2004 - 2004
Capital Valley Ventures 2002 - 2004
ShareWave 2000 - 2001
Winbond 1999 - 2000
Silver Creek Valley CC 1990 - 2000
Information Storage Devices 1996 - 1999
Skills
Real Estate, Short Sales, Foreclosures, New Home Sales, Single Family Homes, First Time Home Buyers, Relocation, Sellers, REO, Investment Properties, Condos, Residential Homes, Listings, Buyer Representation, Home, Referrals, Small Business, Investors, Luxury, Selling, Real Estate Transactions, Property, Rentals, Home Staging, Resellers, Seniors, Townhomes, Sales, Buyers, Investments, Commercial Real Estate, FHA, Real Estate Financing, Real Estate Development, Real Estate Economics, Brokerage, Leases
Education
Santa Clara University 1977 — 1981
MBA
Arizona State University 1970 — 1974
MS, Electrical Engineering
Georgia Institute of Technology 1965 — 1970
BEE, Electrical Engineering
Davidson Realty, Inc December 2006 - Present
Cafe St George & JJ's Heritage Cafe June 2005 - January 2011
Georgia Tech Savannah 2005 - 2011
Various Semiconductor Companies 1970 - 2005
Theta Microelectronics 2004 - 2004
Capital Valley Ventures 2002 - 2004
ShareWave 2000 - 2001
Winbond 1999 - 2000
Silver Creek Valley CC 1990 - 2000
Information Storage Devices 1996 - 1999
Skills
Real Estate, Short Sales, Foreclosures, New Home Sales, Single Family Homes, First Time Home Buyers, Relocation, Sellers, REO, Investment Properties, Condos, Residential Homes, Listings, Buyer Representation, Home, Referrals, Small Business, Investors, Luxury, Selling, Real Estate Transactions, Property, Rentals, Home Staging, Resellers, Seniors, Townhomes, Sales, Buyers, Investments, Commercial Real Estate, FHA, Real Estate Financing, Real Estate Development, Real Estate Economics, Brokerage, Leases
Education
Santa Clara University 1977 — 1981
MBA
Arizona State University 1970 — 1974
MS, Electrical Engineering
Georgia Institute of Technology 1965 — 1970
BEE, Electrical Engineering
Jessie Chuang's Winbond Experience 1995 - 1996
Job CoFounder at Classroom Aid Inc.
Industry E-Learning
Experience
Classroom Aid Inc. July 2010 - Present
Expense Reduction Analysts December 2004 - December 2009
United Microelectronics Corporation (UMC) 1994 - 2004
Winbond 1995 - 1996
Taipei CHeng Yuan middle school 1991 - 1992
Skills
Program Management, Project Management, Business Development, Strategic Planning, Team Building, Business Strategy, Product Management, Cross-functional Team..., Salesforce.com, Coaching, SaaS, Strategy, Management, Start-ups, Leadership, Data Analysis, Consulting, Business Planning, CRM, Business Process..., Research, Entrepreneurship, Executive Management, E-commerce, Competitive Analysis, Analysis, Strategic Partnerships, New Business Development, Team Management, Lead Generation, Outsourcing, Change Management, Product Marketing, Market Research, Cloud Computing, Analytics, Educational Technology
Education
National Chiao Tung University 1992 — 1994
Master's degree, Electrical and Electronics Engineering
National Taiwan Normal University 1987 — 1991
Bachelor of Science (BS), Physics
Classroom Aid Inc. July 2010 - Present
Expense Reduction Analysts December 2004 - December 2009
United Microelectronics Corporation (UMC) 1994 - 2004
Winbond 1995 - 1996
Taipei CHeng Yuan middle school 1991 - 1992
Skills
Program Management, Project Management, Business Development, Strategic Planning, Team Building, Business Strategy, Product Management, Cross-functional Team..., Salesforce.com, Coaching, SaaS, Strategy, Management, Start-ups, Leadership, Data Analysis, Consulting, Business Planning, CRM, Business Process..., Research, Entrepreneurship, Executive Management, E-commerce, Competitive Analysis, Analysis, Strategic Partnerships, New Business Development, Team Management, Lead Generation, Outsourcing, Change Management, Product Marketing, Market Research, Cloud Computing, Analytics, Educational Technology
Education
National Chiao Tung University 1992 — 1994
Master's degree, Electrical and Electronics Engineering
National Taiwan Normal University 1987 — 1991
Bachelor of Science (BS), Physics
Anna Lissa Yandoc's Winbond Experience July 1994 - January 2009
Job Accounts Payable Specialist at Xactly Corporation
Industry Computer Software
Experience
Xactly Corporation July 2013 - Present
Xactly Corporation January 2010 - Present
Winbond July 1994 - January 2009
WINBOND/NUVOTON TECHNOLOGY CORP. AMERICA January 1994 - January 2009
COMPUTER SELECTION BUSINESS CENTER January 1990 - January 1994
Skills
Revenue Recognition, General Ledger, Account Reconciliation, Accounts Payable, Forecasting, Data Entry, Process Improvement, Fixed Assets, Financial Statements, Salesforce.com, PowerPoint, Invoicing, Customer Satisfaction
Education
University of Phoenix 2012 — 2014
Mission College
A.S, Accounting
University of Phoenix
B. S, Accounting
Xactly Corporation July 2013 - Present
Xactly Corporation January 2010 - Present
Winbond July 1994 - January 2009
WINBOND/NUVOTON TECHNOLOGY CORP. AMERICA January 1994 - January 2009
COMPUTER SELECTION BUSINESS CENTER January 1990 - January 1994
Skills
Revenue Recognition, General Ledger, Account Reconciliation, Accounts Payable, Forecasting, Data Entry, Process Improvement, Fixed Assets, Financial Statements, Salesforce.com, PowerPoint, Invoicing, Customer Satisfaction
Education
University of Phoenix 2012 — 2014
Mission College
A.S, Accounting
University of Phoenix
B. S, Accounting
Tracy Chou Tracy Chou's Winbond Experience June 2006 - August 2006
Job Software Engineer at Pinterest
Industry Computer Software
Experience
Pinterest November 2011 - Present
United States Digital Service February 2015 - Present
Quora April 2010 - October 2011
Rocket Fuel Inc. June 2009 - August 2009
Facebook June 2008 - September 2008
Google July 2007 - September 2007
Stanford University April 2007 - June 2007
Winbond June 2006 - August 2006
Skills
Python, Machine Learning, Algorithms, Git, Software Development, User Experience, Testing, Distributed Systems, Data Analysis, MySQL, Linux, Programming, Visual Basic, JavaScript
Education
Stanford University 2008 — 2010
MS, Computer Science
Stanford University 2005 — 2009
BS, Electrical Engineering
Peking University 2008 — 2008
Bing Overseas Studies Program
St. Francis High School 2001 — 2005
Pinterest November 2011 - Present
United States Digital Service February 2015 - Present
Quora April 2010 - October 2011
Rocket Fuel Inc. June 2009 - August 2009
Facebook June 2008 - September 2008
Google July 2007 - September 2007
Stanford University April 2007 - June 2007
Winbond June 2006 - August 2006
Skills
Python, Machine Learning, Algorithms, Git, Software Development, User Experience, Testing, Distributed Systems, Data Analysis, MySQL, Linux, Programming, Visual Basic, JavaScript
Education
Stanford University 2008 — 2010
MS, Computer Science
Stanford University 2005 — 2009
BS, Electrical Engineering
Peking University 2008 — 2008
Bing Overseas Studies Program
St. Francis High School 2001 — 2005
Frank Wei-Yuan Shih's Winbond Experience July 2014 - September 2014
Job Quality and Reliability Engineer at Microchip Technology
Industry Electrical/Electronic Manufacturing
Experience
Microchip Technology June 2015 - Present
University of California, San Diego September 2014 - April 2015
Winbond July 2014 - September 2014
National Chiao Tung University June 2009 - March 2012
Skills
Characterization, Semiconductors, Nanotechnology, Design of Experiments, Chemical, Polymer Chemistry, Organic Synthesis, Inorganic Synthesis, Nanofabrication, Flash Memory, DRAM, Atomic Force Microscopy, Kelvin Probe Force..., Scanning Probe..., Probe Station, AFM
Education
University of California, San Diego 2013 — 2015
Master of Science (MS), Materials Science and Engineering, 3.6
National Chiao Tung University 2008 — 2012
Bachelor of Science (BS), Applied Chemistry, 3.4
Microchip Technology June 2015 - Present
University of California, San Diego September 2014 - April 2015
Winbond July 2014 - September 2014
National Chiao Tung University June 2009 - March 2012
Skills
Characterization, Semiconductors, Nanotechnology, Design of Experiments, Chemical, Polymer Chemistry, Organic Synthesis, Inorganic Synthesis, Nanofabrication, Flash Memory, DRAM, Atomic Force Microscopy, Kelvin Probe Force..., Scanning Probe..., Probe Station, AFM
Education
University of California, San Diego 2013 — 2015
Master of Science (MS), Materials Science and Engineering, 3.6
National Chiao Tung University 2008 — 2012
Bachelor of Science (BS), Applied Chemistry, 3.4
Yang-Hua Wu's Winbond Experience March 2011 - June 2011
Job Quality Engineer at Danfoss Power Solutions
Industry Mechanical or Industrial Engineering
Experience
Danfoss Power Solutions December 2014 - Present
Iowa State University December 2012 - December 2013
Iowa State University January 2012 - December 2012
Winbond March 2011 - June 2011
Skills
JMP, Minitab, Statistics, Operations Research, Optimization, Stochastic Programming, Power Systems, Algorithms, Semiconductor Industry, Mathematical Modeling, Manufacturing, Cribmaster, Indysoft, SAP
Education
Iowa State University 2011 — 2014
Master of Science (MS), Industrial Engineering Minor in Statistics
National Cheng Kung University 2007 — 2009
Master of Science (MS), Industrial and information management
First Taichung High School
Danfoss Power Solutions December 2014 - Present
Iowa State University December 2012 - December 2013
Iowa State University January 2012 - December 2012
Winbond March 2011 - June 2011
Skills
JMP, Minitab, Statistics, Operations Research, Optimization, Stochastic Programming, Power Systems, Algorithms, Semiconductor Industry, Mathematical Modeling, Manufacturing, Cribmaster, Indysoft, SAP
Education
Iowa State University 2011 — 2014
Master of Science (MS), Industrial Engineering Minor in Statistics
National Cheng Kung University 2007 — 2009
Master of Science (MS), Industrial and information management
First Taichung High School
Chris Dingley's Winbond Experience 1996 - 1997
Job Vice President Global Sales IoT at Echelon
Industry Semiconductors
Experience
eConais 2013 - March 2014
Exar Corporation April 2011 - November 2012
Micrel Semiconductor July 2009 - April 2011
Micrel Semiconductor June 2004 - July 2009
Micrel Semiconductor 1997 - June 2004
Winbond 1996 - 1997
General Instrument (Vishay) 1991 - 1996
General Instrument (Vishay) 1986 - 1991
Skills
International Business..., Multicultural Teams, Sales Management, Business Development, Sales Operations, International Sales, Mixed Signal, Account Management, New Business Development, Demand Generation, Forecasting, Business Strategy, Program Management, Leadership, Negotiation, Team Building, Channel, Strategic Planning, Team Leadership, Semiconductors, Product Marketing, Sales, Product Management, Cross-functional Team..., Consumer Electronics, Supply Chain Management, Start-ups, Key Account Management, Strategy, Channel Partners, Product Development, Technical Marketing, Sales Process, Management, Cloud Computing, Manufacturing, Pricing, Wireless
Education
Arizona State University 1980 — 1984
Marketing
Arizona State University 1978 — 1980
Associate of Science (A.S.), Electronics Engineering Technology
eConais 2013 - March 2014
Exar Corporation April 2011 - November 2012
Micrel Semiconductor July 2009 - April 2011
Micrel Semiconductor June 2004 - July 2009
Micrel Semiconductor 1997 - June 2004
Winbond 1996 - 1997
General Instrument (Vishay) 1991 - 1996
General Instrument (Vishay) 1986 - 1991
Skills
International Business..., Multicultural Teams, Sales Management, Business Development, Sales Operations, International Sales, Mixed Signal, Account Management, New Business Development, Demand Generation, Forecasting, Business Strategy, Program Management, Leadership, Negotiation, Team Building, Channel, Strategic Planning, Team Leadership, Semiconductors, Product Marketing, Sales, Product Management, Cross-functional Team..., Consumer Electronics, Supply Chain Management, Start-ups, Key Account Management, Strategy, Channel Partners, Product Development, Technical Marketing, Sales Process, Management, Cloud Computing, Manufacturing, Pricing, Wireless
Education
Arizona State University 1980 — 1984
Marketing
Arizona State University 1978 — 1980
Associate of Science (A.S.), Electronics Engineering Technology
Yi-Ting Yeh Yi-Ting Yeh's Winbond Experience September 2005 - June 2006
Job Director of Data at Apropose, Inc.
Industry Internet
Experience
Apropose, Inc. March 2014 - Present
Serendipity Now October 2013 - February 2014
Adobe June 2008 - September 2008
Winbond September 2005 - June 2006
ITRI September 2004 - June 2005
Key Technology Corporation (KTC) September 2004 - June 2005
Laboratory for Reliable Computing (LaRC), NTHU February 2004 - June 2005
Skills
C++, C, Python, Matlab, Research, Algorithms, Computer Science, Machine Learning, Programming
Education
Stanford University 2006 — 2013
Doctor of Philosophy (PhD), Electrical Engineering (Computer Graphics Lab)
National Tsing Hua University 2004 — 2005
Master of Science (MS), Electrical Engineering
National Tsing Hua University 2000 — 2004
Bachelor of Science (BS), Electrical Engineering
Apropose, Inc. March 2014 - Present
Serendipity Now October 2013 - February 2014
Adobe June 2008 - September 2008
Winbond September 2005 - June 2006
ITRI September 2004 - June 2005
Key Technology Corporation (KTC) September 2004 - June 2005
Laboratory for Reliable Computing (LaRC), NTHU February 2004 - June 2005
Skills
C++, C, Python, Matlab, Research, Algorithms, Computer Science, Machine Learning, Programming
Education
Stanford University 2006 — 2013
Doctor of Philosophy (PhD), Electrical Engineering (Computer Graphics Lab)
National Tsing Hua University 2004 — 2005
Master of Science (MS), Electrical Engineering
National Tsing Hua University 2000 — 2004
Bachelor of Science (BS), Electrical Engineering
Shao-Hua Wu's Winbond Experience June 2014 - August 2014
Job Research Assistant at University of Southern California
Industry Nanotechnology
Experience
University of Southern California August 2014 - Present
Winbond June 2014 - August 2014
University of Southern California January 2014 - May 2014
University of Southern California August 2013 - December 2013
University of Southern California January 2013 - July 2013
National Chiao Tung University October 2009 - December 2010
Skills
CVD, Matlab, Simulations, Numerical Simulation, Semiconductors, Graphene, TEM, MAMATLAB/Simulink, Labview, Photonics, C++, Characterization, Microsoft Office, Java, C, Python, Numerical Analysis, Electron Beam..., PECVD
Education
University of Southern California 2012 — 2014
Master of Science (MS), Electrical and Electronics Engineering, 3.9/4.0
National Chiao Tung University 2007 — 2011
Bachelor's Degree, Electrophysics, 89/100
University of Southern California
Doctor of Philosophy (Ph.D.), Electrical and Electronics Engineering
University of Southern California August 2014 - Present
Winbond June 2014 - August 2014
University of Southern California January 2014 - May 2014
University of Southern California August 2013 - December 2013
University of Southern California January 2013 - July 2013
National Chiao Tung University October 2009 - December 2010
Skills
CVD, Matlab, Simulations, Numerical Simulation, Semiconductors, Graphene, TEM, MAMATLAB/Simulink, Labview, Photonics, C++, Characterization, Microsoft Office, Java, C, Python, Numerical Analysis, Electron Beam..., PECVD
Education
University of Southern California 2012 — 2014
Master of Science (MS), Electrical and Electronics Engineering, 3.9/4.0
National Chiao Tung University 2007 — 2011
Bachelor's Degree, Electrophysics, 89/100
University of Southern California
Doctor of Philosophy (Ph.D.), Electrical and Electronics Engineering
Ken Wen's Winbond Experience January 2004 - January 2005
Job Founder at Shark Tank Taiwan
Industry Consumer Goods
Experience
Shark Tank Taiwan July 2014 - Present
Ko-Kang, LLC September 2013 - Present
Saus, LLC January 2010 - Present
ONGUARD by K2W, LLC January 2008 - September 2013
Sayagle, Inc. March 2010 - March 2012
WGBH June 2009 - October 2009
Nike July 2008 - June 2009
Law Offices of Shen-Shin Lu January 2008 - July 2008
City Sports January 2007 - February 2008
Winbond January 2004 - January 2005
Skills
Marketing Strategy, Marketing Management, Marketing Communications, Advertising, Marketing, Project Management, Business Development, Corporate Finance, Business Strategy, Product Management, E-commerce, Product Development, Social Media, Sales, Brand Management, Analytics, Consumer Electronics, Start-ups, New Business Development, Strategic Planning, Social Networking, Direct Marketing, SEO, International Marketing, Brand Development, B2B, Sales Management, Entrepreneurship, Strategy
Education
Harvard Law School 2009 — 2010
Mediation and Negotiation
Boston University 2008 — 2010
Masters in Innovation & Technology, Business
Shark Tank Taiwan July 2014 - Present
Ko-Kang, LLC September 2013 - Present
Saus, LLC January 2010 - Present
ONGUARD by K2W, LLC January 2008 - September 2013
Sayagle, Inc. March 2010 - March 2012
WGBH June 2009 - October 2009
Nike July 2008 - June 2009
Law Offices of Shen-Shin Lu January 2008 - July 2008
City Sports January 2007 - February 2008
Winbond January 2004 - January 2005
Skills
Marketing Strategy, Marketing Management, Marketing Communications, Advertising, Marketing, Project Management, Business Development, Corporate Finance, Business Strategy, Product Management, E-commerce, Product Development, Social Media, Sales, Brand Management, Analytics, Consumer Electronics, Start-ups, New Business Development, Strategic Planning, Social Networking, Direct Marketing, SEO, International Marketing, Brand Development, B2B, Sales Management, Entrepreneurship, Strategy
Education
Harvard Law School 2009 — 2010
Mediation and Negotiation
Boston University 2008 — 2010
Masters in Innovation & Technology, Business
Cristina Defoe Cristina Defoe's Winbond Experience 1998 - 2000
Job
Industry Semiconductors
Experience
Lumileds September 2012 - Present
Alien Technology 2004 - 2006
Chartered Semiconductor 2000 - 2004
Winbond 1998 - 2000
Education
California State University-East Bay
Bachelor of Science, Computer Engineering
University of Phoenix
Bachelor of Science, Business Management
Lumileds September 2012 - Present
Alien Technology 2004 - 2006
Chartered Semiconductor 2000 - 2004
Winbond 1998 - 2000
Education
California State University-East Bay
Bachelor of Science, Computer Engineering
University of Phoenix
Bachelor of Science, Business Management
Chung-Ti Hsu Chung-Ti Hsu's Winbond Experience January 2008 - June 2008
Job Staff Engineer at Qualcomm
Industry Higher Education
Experience
Qualcomm April 2015 - Present
Qualcomm January 2014 - Present
Northeastern University September 2009 - December 2013
Nuvoton Technology July 2008 - July 2009
Winbond January 2008 - June 2008
Winbond October 2006 - December 2007
Winbond October 2003 - October 2006
Skills
ESD Failure Analysis, ESD Protection Circuit..., Latch-up Failure..., Transient Latch-up Test, Curve Tracer, Cadence Virtuoso, HSPICE, TCAD, Semiconductor Process, Integrated Circuit..., IC, Power Electronics, Matlab, C, Assembly Language, Simulations, Circuit Design, SPICE, Testing, Power Management, Failure Analysis, Microcontroller..., Microcontrollers, Pspice, Orcad, MPPT controller for...
Education
Northeastern University 2009 — 2014
Doctor of Philosophy (Ph.D.), Power Electronics
National Chiao Tung University 2001 — 2003
MS, EE
National Chiao Tung University 1997 — 2001
BS, EE
Ching-Shin Primary School
Taipei Municipal Jianguo High School
Qualcomm April 2015 - Present
Qualcomm January 2014 - Present
Northeastern University September 2009 - December 2013
Nuvoton Technology July 2008 - July 2009
Winbond January 2008 - June 2008
Winbond October 2006 - December 2007
Winbond October 2003 - October 2006
Skills
ESD Failure Analysis, ESD Protection Circuit..., Latch-up Failure..., Transient Latch-up Test, Curve Tracer, Cadence Virtuoso, HSPICE, TCAD, Semiconductor Process, Integrated Circuit..., IC, Power Electronics, Matlab, C, Assembly Language, Simulations, Circuit Design, SPICE, Testing, Power Management, Failure Analysis, Microcontroller..., Microcontrollers, Pspice, Orcad, MPPT controller for...
Education
Northeastern University 2009 — 2014
Doctor of Philosophy (Ph.D.), Power Electronics
National Chiao Tung University 2001 — 2003
MS, EE
National Chiao Tung University 1997 — 2001
BS, EE
Ching-Shin Primary School
Taipei Municipal Jianguo High School
Amy Kung Amy Kung's Winbond Experience August 2006 - December 2007
Job Seeking opportunities in the San Francisco Bay Area
Industry Biotechnology
Experience
GenPro Consulting, Inc. March 2012 - February 2015
GenPro Consulting, Inc. February 2011 - March 2012
Kaiser Foundation Health Plan July 2009 - May 2010
Winbond August 2006 - December 2007
Skills
Healthcare Management, Hospitals, Healthcare Information..., Data Analysis, Healthcare, Project Management, EHR, HIPAA, Microsoft Excel, Analysis, Managed Care, Healthcare Consulting, Public Health, Microsoft Office, Leadership, Strategic Planning, Quality Improvement, Program Management, Process Improvement, Revenue Cycle, CRM, project
Education
University of Southern California 2008 — 2010
MHA, Health Administration
University of Washington 2004 — 2006
Bachelor of Arts, Economics
GenPro Consulting, Inc. March 2012 - February 2015
GenPro Consulting, Inc. February 2011 - March 2012
Kaiser Foundation Health Plan July 2009 - May 2010
Winbond August 2006 - December 2007
Skills
Healthcare Management, Hospitals, Healthcare Information..., Data Analysis, Healthcare, Project Management, EHR, HIPAA, Microsoft Excel, Analysis, Managed Care, Healthcare Consulting, Public Health, Microsoft Office, Leadership, Strategic Planning, Quality Improvement, Program Management, Process Improvement, Revenue Cycle, CRM, project
Education
University of Southern California 2008 — 2010
MHA, Health Administration
University of Washington 2004 — 2006
Bachelor of Arts, Economics
Julie Crisafulli Julie Crisafulli's Winbond Experience 1985 - 1999
Job Realtor at Coldwell Banker Residential Brokerage
Industry Real Estate
Experience
Coldwell Banker Residential Brokerage September 2011 - Present
Keller Williams Realty August 2007 - September 2011
Winbond 1985 - 1999
Skills
Sellers, Relocation, Real Estate, Buyer Representation, First Time Home Buyers, Single Family Homes, New Home Sales, Short Sales, Investors, Townhomes, REO, Investment Properties
Education
University of California, Santa Barbara 1989 — 1992
BA, Economics
Coldwell Banker Residential Brokerage September 2011 - Present
Keller Williams Realty August 2007 - September 2011
Winbond 1985 - 1999
Skills
Sellers, Relocation, Real Estate, Buyer Representation, First Time Home Buyers, Single Family Homes, New Home Sales, Short Sales, Investors, Townhomes, REO, Investment Properties
Education
University of California, Santa Barbara 1989 — 1992
BA, Economics
Byron Singh's Winbond Experience May 2007 - August 2007
Job Cofounder CTO at RentLingo
Industry Internet
Experience
RentLingo 2013 - Present
Android Application January 2009 - 2012
Nuvoton Technology August 2008 - May 2011
Winbond May 2007 - August 2007
Skills
Programming, Product Design, Electrical Engineering, Hardware Design, Start-up Operations, Mobile Applications, Hardware Architecture, Web Development, IC, Start-ups, Hardware, Microcontrollers
Education
Stanford University 2011 — 2012
Masters, Engineering
Cornell University 2004 — 2008
BS, Electrical Engineering
RentLingo 2013 - Present
Android Application January 2009 - 2012
Nuvoton Technology August 2008 - May 2011
Winbond May 2007 - August 2007
Skills
Programming, Product Design, Electrical Engineering, Hardware Design, Start-up Operations, Mobile Applications, Hardware Architecture, Web Development, IC, Start-ups, Hardware, Microcontrollers
Education
Stanford University 2011 — 2012
Masters, Engineering
Cornell University 2004 — 2008
BS, Electrical Engineering
Yao-Ching Liu Yao-Ching Liu's Winbond Experience 1987 - 1990
Job
Industry Semiconductors
Experience
Nuvoton September 2004 - Present
Fortemedia June 2003 - September 2004
Pluris May 2000 - July 2002
Allayer September 1998 - May 2000
IDT February 1996 - September 1998
Winbond 1987 - 1990
Quasel 1986 - 1987
Skills
SoC, Ethernet, ASIC, USB, IP, ARM, Semiconductors, DSP, Embedded Systems, IC, FPGA, Microprocessors, Verilog, RTL design, C, VHDL, Perl, C++, Matlab, Architecture, Digital Signal..., Timing Closure, Static Timing Analysis, VLSI, Primetime, Bluetooth, Integrated Circuit..., Information Technology, Low-power Design, Functional Verification, Debugging, RTL Design
Education
University of Miami 1993 — 1995
PhD, ECE
Texas A&M University 1992 — 1992
PhD student, Computer Science
Bradley University 1990 — 1991
MS, CS
National Chiao Tung University 1980 — 1984
BS, Applied Mathematics
Nuvoton September 2004 - Present
Fortemedia June 2003 - September 2004
Pluris May 2000 - July 2002
Allayer September 1998 - May 2000
IDT February 1996 - September 1998
Winbond 1987 - 1990
Quasel 1986 - 1987
Skills
SoC, Ethernet, ASIC, USB, IP, ARM, Semiconductors, DSP, Embedded Systems, IC, FPGA, Microprocessors, Verilog, RTL design, C, VHDL, Perl, C++, Matlab, Architecture, Digital Signal..., Timing Closure, Static Timing Analysis, VLSI, Primetime, Bluetooth, Integrated Circuit..., Information Technology, Low-power Design, Functional Verification, Debugging, RTL Design
Education
University of Miami 1993 — 1995
PhD, ECE
Texas A&M University 1992 — 1992
PhD student, Computer Science
Bradley University 1990 — 1991
MS, CS
National Chiao Tung University 1980 — 1984
BS, Applied Mathematics
Al Kordesch Al Kordesch's Winbond Experience 1997 - 2001
Job Semiconductor CMOS Device Modeling
Industry Semiconductors
Experience
Altera November 2012 - Present
Silterra Malaysia January 2001 - May 2009
Silterra 2001 - 2007
Winbond 1997 - 2001
IMP Inc. 1982 - 1997
Skills
CMOS, Device Physics, Process Simulation, Test Automation, Layout Tools, Flash Memory, Circuit Simulation, ESD, RF, Device Characterization, ESD control, Simulations, Semiconductors, Process Integration, Physics, Characterization, Low-power Design, IC, Cadence, SPICE, ASIC, LVS, Mixed Signal, DRC, Spectre, Analog
Education
Case Western Reserve University 1977 — 1979
MSEE, Electrical Engineering
Carnegie Mellon University 1967 — 1971
BS, Physics
Altera November 2012 - Present
Silterra Malaysia January 2001 - May 2009
Silterra 2001 - 2007
Winbond 1997 - 2001
IMP Inc. 1982 - 1997
Skills
CMOS, Device Physics, Process Simulation, Test Automation, Layout Tools, Flash Memory, Circuit Simulation, ESD, RF, Device Characterization, ESD control, Simulations, Semiconductors, Process Integration, Physics, Characterization, Low-power Design, IC, Cadence, SPICE, ASIC, LVS, Mixed Signal, DRC, Spectre, Analog
Education
Case Western Reserve University 1977 — 1979
MSEE, Electrical Engineering
Carnegie Mellon University 1967 — 1971
BS, Physics
Christina Jean Christina Jean's Winbond Experience June 2012 - August 2012
Job Product Engineer at OmniVision Technologies
Industry Semiconductors
Experience
OmniVision Technologies, Inc. July 2013 - Present
Winbond June 2012 - August 2012
University of Southern California (Solid State Processing and Integrated Circuits Laboratory) January 2012 - April 2012
National Chung Hsing University (Deposition Lab) July 2010 - January 2011
National Chung Hsing University (Deposition Lab) December 2008 - July 2009
Fu Jen Catholic University July 2008 - August 2008
Skills
Materials Science, Photoshop, Photolithography, Process Integration, Sputtering, Thin Films, UV/Vis, Physical Vapor..., X-Ray Diffraction (XRD), Scanning Electron..., Four-Point Probe, UV-Vis Spectrophotometer, Transmission Electron..., Microsoft Office (Word,..., Origin 6.0, Chemical Vapor..., Data Analysis, Reporting & Analysis, Troubleshooting
Education
University of Southern California 2011 — 2013
Master's degree, Materials Science
National Chung Hsing University 2006 — 2010
Bachelor's degree, Materials Science and Engineering
OmniVision Technologies, Inc. July 2013 - Present
Winbond June 2012 - August 2012
University of Southern California (Solid State Processing and Integrated Circuits Laboratory) January 2012 - April 2012
National Chung Hsing University (Deposition Lab) July 2010 - January 2011
National Chung Hsing University (Deposition Lab) December 2008 - July 2009
Fu Jen Catholic University July 2008 - August 2008
Skills
Materials Science, Photoshop, Photolithography, Process Integration, Sputtering, Thin Films, UV/Vis, Physical Vapor..., X-Ray Diffraction (XRD), Scanning Electron..., Four-Point Probe, UV-Vis Spectrophotometer, Transmission Electron..., Microsoft Office (Word,..., Origin 6.0, Chemical Vapor..., Data Analysis, Reporting & Analysis, Troubleshooting
Education
University of Southern California 2011 — 2013
Master's degree, Materials Science
National Chung Hsing University 2006 — 2010
Bachelor's degree, Materials Science and Engineering
Jesse (BoHung) Wu Jesse (BoHung) Wu's Winbond Experience May 2000 - December 2003
Job Software Engineering Manager at VUDU
Industry Computer Software
Experience
VUDU, a Wal-Mart Company July 2010 - Present
Syniverse Technologies October 2009 - June 2010
VeriSign December 2007 - October 2009
Buongiorno April 2005 - December 2007
Improvista September 2004 - April 2005
ITRI July 2004 - August 2004
Winbond May 2000 - December 2003
Skills
Android, Google TV, BREW, Software Project..., JIRA, Software Engineering, Software Development, Connected Devices, Streaming Media, Interactive Media, Mobile Devices, SMS, Multimedia Messaging..., SoC, Embedded Systems, Embedded Software, Integration, MMSC, Distributed Systems, Cross-functional Team..., Programming, MySQL, Wireless, Business Services, Java, Linux, Project Management, C, J2ME, Mobile Applications, Agile Project Management, Scrum, TCP/IP, Quality Assurance, XML, Testing, Product Management, C++, Cloud Computing, Agile Methodologies, Perl, JavaScript, Program Management, Unix, Software Design, Python
Education
The University of Edinburgh 1998 — 1999
MSCS, Embedded System Design
The University of Manchester 1997 — 1998
MSCS, Artificial Intelligence
VUDU, a Wal-Mart Company July 2010 - Present
Syniverse Technologies October 2009 - June 2010
VeriSign December 2007 - October 2009
Buongiorno April 2005 - December 2007
Improvista September 2004 - April 2005
ITRI July 2004 - August 2004
Winbond May 2000 - December 2003
Skills
Android, Google TV, BREW, Software Project..., JIRA, Software Engineering, Software Development, Connected Devices, Streaming Media, Interactive Media, Mobile Devices, SMS, Multimedia Messaging..., SoC, Embedded Systems, Embedded Software, Integration, MMSC, Distributed Systems, Cross-functional Team..., Programming, MySQL, Wireless, Business Services, Java, Linux, Project Management, C, J2ME, Mobile Applications, Agile Project Management, Scrum, TCP/IP, Quality Assurance, XML, Testing, Product Management, C++, Cloud Computing, Agile Methodologies, Perl, JavaScript, Program Management, Unix, Software Design, Python
Education
The University of Edinburgh 1998 — 1999
MSCS, Embedded System Design
The University of Manchester 1997 — 1998
MSCS, Artificial Intelligence
Rick Calle Rick Calle's Winbond Experience 1990 - 1992
Job Senior Director Product Management & Business Development at Qualcomm
Industry Computer Software
Experience
Qualcomm 2014 - Present
Cornell University 2011 - 2015
nūc corporation 2011 - 2014
iKoa Corporation 2006 - 2011
NeoMagic 2002 - 2006
ArtX, Incorporated (purchased by ATI) 1999 - 2000
NeoMagic 1994 - 1999
S3, Inc (Consultant) 1992 - 1994
Winbond 1990 - 1992
AMD 1984 - 1990
Skills
Wireless, Semiconductors, Start-ups, Cloud Computing, Consumer Electronics, Product Management, Product Strategy, Product Marketing, Competitive Analysis, Mobile Devices, Product Launch, Strategic Partnerships, New Business Development, Algorithms, Embedded Systems, Entrepreneurship, Business Development, Digital Signal..., Go-to-market Strategy, IC, SoC, Mobile Communications, Mobile Technology, Mobile Applications, SaaS, Cross-functional Team..., Product Development, Leadership, Enterprise Software, Strategy, Processors, System Architecture
Education
Cornell University
BSEE, Engineering
University of California, Berkeley, Haas School of Business
Berkeley Executive Program
Qualcomm 2014 - Present
Cornell University 2011 - 2015
nūc corporation 2011 - 2014
iKoa Corporation 2006 - 2011
NeoMagic 2002 - 2006
ArtX, Incorporated (purchased by ATI) 1999 - 2000
NeoMagic 1994 - 1999
S3, Inc (Consultant) 1992 - 1994
Winbond 1990 - 1992
AMD 1984 - 1990
Skills
Wireless, Semiconductors, Start-ups, Cloud Computing, Consumer Electronics, Product Management, Product Strategy, Product Marketing, Competitive Analysis, Mobile Devices, Product Launch, Strategic Partnerships, New Business Development, Algorithms, Embedded Systems, Entrepreneurship, Business Development, Digital Signal..., Go-to-market Strategy, IC, SoC, Mobile Communications, Mobile Technology, Mobile Applications, SaaS, Cross-functional Team..., Product Development, Leadership, Enterprise Software, Strategy, Processors, System Architecture
Education
Cornell University
BSEE, Engineering
University of California, Berkeley, Haas School of Business
Berkeley Executive Program
Hank Cheng's Winbond Experience June 2011 - August 2011
Job Sr. System Design Engineer at SanDisk
Industry Semiconductors
Experience
SanDisk March 2015 - Present
SanDisk September 2012 - March 2015
Winbond June 2011 - August 2011
Skills
Verilog, SATA, RTL design, Failure Analysis, ModelSim, SSD, DRAM, Cadence Virtuoso, CMOS, ASIC, Interfaces, Controllers, Scripting, Digital Circuit Design, Reliability Test, Perl, Databases, Debugging, Data Analysis
Education
University of Southern California 2010 — 2012
Master of Science (M.S.), Electrical and Electronics Engineering- VLSI Circuit Design
UCSC Silicon Valley Extension
SanDisk March 2015 - Present
SanDisk September 2012 - March 2015
Winbond June 2011 - August 2011
Skills
Verilog, SATA, RTL design, Failure Analysis, ModelSim, SSD, DRAM, Cadence Virtuoso, CMOS, ASIC, Interfaces, Controllers, Scripting, Digital Circuit Design, Reliability Test, Perl, Databases, Debugging, Data Analysis
Education
University of Southern California 2010 — 2012
Master of Science (M.S.), Electrical and Electronics Engineering- VLSI Circuit Design
UCSC Silicon Valley Extension
YiHsuan Shane Chen, PMP, NPDP, CBAP's Winbond Experience February 2004 - June 2004
Job MBA Candidate at USC Marshall School of Business
Industry Information Technology and Services
Experience
HTC March 2011 - March 2014
HTC September 2006 - March 2011
HTC June 2004 - September 2006
Winbond February 2004 - June 2004
Air Defense Missile Command July 2002 - January 2004
Skills
Project Management, New product Development, Business Analysis, Management, Customer Service, Operations Management, Strategic Planning, Program Management, Design for Manufacturing, Process Improvement, DFMEA, APQP, PPAP
Education
University of Southern California 2015 — 2016
Master of Business Administration (MBA)
National Central University 2000 — 2002
Industrial Management, Master of Business Administration (MBA)
National Tsing Hua University 1996 — 2000
Industrial Engineering, Bachelor of Science (BS)
HTC March 2011 - March 2014
HTC September 2006 - March 2011
HTC June 2004 - September 2006
Winbond February 2004 - June 2004
Air Defense Missile Command July 2002 - January 2004
Skills
Project Management, New product Development, Business Analysis, Management, Customer Service, Operations Management, Strategic Planning, Program Management, Design for Manufacturing, Process Improvement, DFMEA, APQP, PPAP
Education
University of Southern California 2015 — 2016
Master of Business Administration (MBA)
National Central University 2000 — 2002
Industrial Management, Master of Business Administration (MBA)
National Tsing Hua University 1996 — 2000
Industrial Engineering, Bachelor of Science (BS)
Anne Marie Wright's Winbond Experience 1998 - 1999
Job Presenter at Younique
Industry Real Estate
Experience
Younique September 2014 - Present
PMZ Real Estate October 2006 - Present
InnoPath April 2006 - September 2006
Openwave Systems September 2005 - April 2006
American Funding and Financial 2005 - 2005
Scios 2004 - 2005
Cushman & Wakefield 2003 - 2003
Advanced Micro Devices (AMD) 2000 - 2001
Portal Software 2000 - 2000
Winbond 1998 - 1999
Skills
Recruiting, Negotiation, Marketing, Sales, Human Resources, Real Estate, Selling, Buyer Representation, Short Sales, Property Management, Single Family Homes, Sellers, Property, Investors, SFR, Customer Service, Foreclosures, 1031 Exchanges, REO, Referrals, Contract Negotiation, Buyers, Condos, Investment Properties, First Time Home Buyers, Real Property, Listings, Mortgage Lending, Residential Homes, HUD, Move Up Buyers, e-PRO, Relocation, New Home Sales, Team Building, ABR, Real Estate Financing, New Homes, Real Estate Transactions, Income Properties
Education
California State University-Sacramento 2006 — 2006
License, Real Estate
University of California, Santa Cruz
HR Management Certificate, HR Management Certificate
Younique September 2014 - Present
PMZ Real Estate October 2006 - Present
InnoPath April 2006 - September 2006
Openwave Systems September 2005 - April 2006
American Funding and Financial 2005 - 2005
Scios 2004 - 2005
Cushman & Wakefield 2003 - 2003
Advanced Micro Devices (AMD) 2000 - 2001
Portal Software 2000 - 2000
Winbond 1998 - 1999
Skills
Recruiting, Negotiation, Marketing, Sales, Human Resources, Real Estate, Selling, Buyer Representation, Short Sales, Property Management, Single Family Homes, Sellers, Property, Investors, SFR, Customer Service, Foreclosures, 1031 Exchanges, REO, Referrals, Contract Negotiation, Buyers, Condos, Investment Properties, First Time Home Buyers, Real Property, Listings, Mortgage Lending, Residential Homes, HUD, Move Up Buyers, e-PRO, Relocation, New Home Sales, Team Building, ABR, Real Estate Financing, New Homes, Real Estate Transactions, Income Properties
Education
California State University-Sacramento 2006 — 2006
License, Real Estate
University of California, Santa Cruz
HR Management Certificate, HR Management Certificate
JaeHyeong(James) Kim's Winbond Experience November 1999 - January 2002
Job High Speed IO Design
Industry Semiconductors
Experience
GSI August 2009 - Present
Contour Semiconductor August 2007 - June 2009
Sony Electronics February 2002 - July 2007
Winbond November 1999 - January 2002
Hynix Semiconductor March 1988 - October 1999
Skills
Analog, Semiconductors, Integrated Circuit..., Electrical Engineering, SRAM, DRAM, Circuit Design, CMOS, IC, Simulations, Mixed Signal, Phase change Memory, Memory
Education
Korea University 1993 — 1995
Master's Degree, Semiconductor Electronics
Korea University 1984 — 1988
BS, Electrical Engineering
GSI August 2009 - Present
Contour Semiconductor August 2007 - June 2009
Sony Electronics February 2002 - July 2007
Winbond November 1999 - January 2002
Hynix Semiconductor March 1988 - October 1999
Skills
Analog, Semiconductors, Integrated Circuit..., Electrical Engineering, SRAM, DRAM, Circuit Design, CMOS, IC, Simulations, Mixed Signal, Phase change Memory, Memory
Education
Korea University 1993 — 1995
Master's Degree, Semiconductor Electronics
Korea University 1984 — 1988
BS, Electrical Engineering
Yi-Jan HO Yi-Jan HO's Winbond Experience June 2004 - September 2004
Job Sr. Design Engineer at Cypress Semiconductor Corporation
Industry Semiconductors
Experience
Cypress Semiconductor, former Spansion LLC January 2013 - Present
Spansion LLC May 2008 - January 2013
Nanya Technology Coporation June 2007 - August 2007
Winbond June 2004 - September 2004
Education
Carnegie Mellon University 2006 — 2007
Master’s Degree, Electrical and Computer Engineering
National Central University 2001 — 2006
Bachelor’s Degree, Electrical Engineering
Cypress Semiconductor, former Spansion LLC January 2013 - Present
Spansion LLC May 2008 - January 2013
Nanya Technology Coporation June 2007 - August 2007
Winbond June 2004 - September 2004
Education
Carnegie Mellon University 2006 — 2007
Master’s Degree, Electrical and Computer Engineering
National Central University 2001 — 2006
Bachelor’s Degree, Electrical Engineering
Gustavo Bitdinger Gustavo Bitdinger's Winbond Experience August 2003 - August 2004
Job Product guy with a passion for usercentered design
Industry Internet
Experience
Jabber Labs, Inc. February 2015 - Present
JPMorgan Chase January 2013 - February 2015
Bloomspot (acq. by JPMorgan Chase) March 2010 - January 2013
Doostang January 2008 - March 2010
Google July 2007 - September 2007
AmeriCorps National Civilian Community Corps September 2005 - July 2006
Cornell University, Marohn Group Research August 2004 - August 2005
Winbond August 2003 - August 2004
Skills
Product Development, Web Analytics, Product Marketing, Product Management, Google Analytics, SEM, Start-ups, Entrepreneurship, Social Media
Education
Stanford University 2006 — 2007
M.S., Management Science & Engineering
Cornell University 2001 — 2005
B.S., Electrical & Computer Engineering
Jabber Labs, Inc. February 2015 - Present
JPMorgan Chase January 2013 - February 2015
Bloomspot (acq. by JPMorgan Chase) March 2010 - January 2013
Doostang January 2008 - March 2010
Google July 2007 - September 2007
AmeriCorps National Civilian Community Corps September 2005 - July 2006
Cornell University, Marohn Group Research August 2004 - August 2005
Winbond August 2003 - August 2004
Skills
Product Development, Web Analytics, Product Marketing, Product Management, Google Analytics, SEM, Start-ups, Entrepreneurship, Social Media
Education
Stanford University 2006 — 2007
M.S., Management Science & Engineering
Cornell University 2001 — 2005
B.S., Electrical & Computer Engineering
Nansi McCallum Nansi McCallum's Winbond Experience August 2006 - Present
Job Customer Services Associate at Frys.com
Industry Consumer Services
Experience
Winbond August 2006 - Present
Protel Broadband Services, In. June 2000 - April 2004
Education
Evergreen Valley College 1995 — 1997
General
Winbond August 2006 - Present
Protel Broadband Services, In. June 2000 - April 2004
Education
Evergreen Valley College 1995 — 1997
General
Lingyan Zhao 赵灵彦 Lingyan Zhao 赵灵彦's Winbond Experience July 1998 - October 2001
Job pipapai.com
Industry Computer Software
Experience
枇杷派 Pipapai November 2012 - Present
Array Networks September 2003 - November 2012
Bytemobile November 2001 - September 2003
Winbond July 1998 - October 2001
中国电信 September 1997 - May 1998
Skills
Distributed Systems, Software Development, C++, iOS development, Team Leadership, Mobile Devices, Cloud Computing, Management, Product Management, SaaS, Enterprise Software, TCP/IP, Go-to-market Strategy, Software Engineering, Product Development, Agile Methodologies, Virtualization, Network Security, Leadership, Start-ups, Linux, Network Architecture, Strategic Partnerships, Product Marketing, Product Lifecycle..., Mobile Applications, Security, Pre-sales, Scalability
Education
Tsinghua University 1994 — 1997
MS, EE
Beihang University 1990 — 1994
BS, EE
枇杷派 Pipapai November 2012 - Present
Array Networks September 2003 - November 2012
Bytemobile November 2001 - September 2003
Winbond July 1998 - October 2001
中国电信 September 1997 - May 1998
Skills
Distributed Systems, Software Development, C++, iOS development, Team Leadership, Mobile Devices, Cloud Computing, Management, Product Management, SaaS, Enterprise Software, TCP/IP, Go-to-market Strategy, Software Engineering, Product Development, Agile Methodologies, Virtualization, Network Security, Leadership, Start-ups, Linux, Network Architecture, Strategic Partnerships, Product Marketing, Product Lifecycle..., Mobile Applications, Security, Pre-sales, Scalability
Education
Tsinghua University 1994 — 1997
MS, EE
Beihang University 1990 — 1994
BS, EE
Dennis Lim's Winbond Experience October 2014 - Present
Job Director of Engineering at Winbond
Industry Semiconductors
Experience
Winbond October 2014 - Present
Kilopass Technology October 2012 - September 2014
Winbond Electronic Corporation July 2010 - September 2012
Unity Semiconductor Corp. (Acquired by Rambus) June 2007 - July 2010
Kilopass Technology Inc. January 2006 - June 2007
Winbond Electronic Corporation March 2003 - December 2005
Actrans System Inc. (Acquired by SST) March 2000 - March 2003
Vantis-AMD (Acquired by Lattice Semiconductor) January 1997 - March 2000
Xicor Inc. (Acquired by Intersil) January 1995 - January 1997
Skills
Semiconductors, CMOS, EDA, IC, Mixed Signal, Primetime, ASIC, SoC, VLSI, SRAM, RTL design, Analog, Analog Circuit Design, Verilog, Static Timing Analysis, Flash Memory, Cadence Virtuoso, FPGA, Functional Verification, Integrated Circuit..., Circuit Design, Debugging
Education
University of Alabama in Huntsville 1992 — 1994
MSEE
Foon Yew High School 1981 — 1987
Winbond October 2014 - Present
Kilopass Technology October 2012 - September 2014
Winbond Electronic Corporation July 2010 - September 2012
Unity Semiconductor Corp. (Acquired by Rambus) June 2007 - July 2010
Kilopass Technology Inc. January 2006 - June 2007
Winbond Electronic Corporation March 2003 - December 2005
Actrans System Inc. (Acquired by SST) March 2000 - March 2003
Vantis-AMD (Acquired by Lattice Semiconductor) January 1997 - March 2000
Xicor Inc. (Acquired by Intersil) January 1995 - January 1997
Skills
Semiconductors, CMOS, EDA, IC, Mixed Signal, Primetime, ASIC, SoC, VLSI, SRAM, RTL design, Analog, Analog Circuit Design, Verilog, Static Timing Analysis, Flash Memory, Cadence Virtuoso, FPGA, Functional Verification, Integrated Circuit..., Circuit Design, Debugging
Education
University of Alabama in Huntsville 1992 — 1994
MSEE
Foon Yew High School 1981 — 1987
Hyuk Kim's Winbond Experience 2004 - 2007
Job Sr. staff design engineer at Microsemi Corp.
Industry Semiconductors
Experience
Microsemi 2007 - Present
Winbond 2004 - 2007
National Semiconductor 2001 - 2004
Skills
Flash Memory, NOR Flash, IC, Circuit Design, Semiconductor Failure..., SPICE, HSIM, Perl Script, OPUS, Cadence Virtuoso
Education
Stanford University
MS, Electrical Engineering
Microsemi 2007 - Present
Winbond 2004 - 2007
National Semiconductor 2001 - 2004
Skills
Flash Memory, NOR Flash, IC, Circuit Design, Semiconductor Failure..., SPICE, HSIM, Perl Script, OPUS, Cadence Virtuoso
Education
Stanford University
MS, Electrical Engineering
Joseph Berman's Winbond Experience September 1998 - December 2000
Job Principal Software Engineer at Elbit Systems
Industry Defense & Space
Experience
Elbit Systems of America July 2007 - Present
Elbit April 2004 - June 2007
Elisra January 2001 - April 2004
Kerenix 2000 - 2001
Winbond September 1998 - December 2000
Branson Ultrasonics 1996 - August 1998
Northrop Grumman Norden Systems 1994 - 1996
Skills
Embedded Systems, Systems Engineering, Software Design, Embedded Software, Device Drivers, System Architecture
Education
New York University - Polytechnic School of Engineering 1996 — 1998
MSCS, Computer Science
New York University - Polytechnic School of Engineering 1991 — 1994
BSEE, Electrical Engineering
Elbit Systems of America July 2007 - Present
Elbit April 2004 - June 2007
Elisra January 2001 - April 2004
Kerenix 2000 - 2001
Winbond September 1998 - December 2000
Branson Ultrasonics 1996 - August 1998
Northrop Grumman Norden Systems 1994 - 1996
Skills
Embedded Systems, Systems Engineering, Software Design, Embedded Software, Device Drivers, System Architecture
Education
New York University - Polytechnic School of Engineering 1996 — 1998
MSCS, Computer Science
New York University - Polytechnic School of Engineering 1991 — 1994
BSEE, Electrical Engineering
Kevin Furini's Winbond Experience May 2005 - Present
Job Principal Field Application Engineer at Winbond
Industry Semiconductors
Experience
Winbond May 2005 - Present
National Semiconductor November 1997 - May 2005
Cyrix June 1991 - November 1997
Intel January 1983 - June 1991
Independant Contractor 1983 - 1985
Intel - Development System Operation June 1980 - January 1983
Skills
Semiconductors, Product Marketing, IC, Analog
Education
University of Delaware 1977 — 1980
Winbond May 2005 - Present
National Semiconductor November 1997 - May 2005
Cyrix June 1991 - November 1997
Intel January 1983 - June 1991
Independant Contractor 1983 - 1985
Intel - Development System Operation June 1980 - January 1983
Skills
Semiconductors, Product Marketing, IC, Analog
Education
University of Delaware 1977 — 1980
David Ku's Winbond Experience April 2007 - February 2009
Job MBA Summer Associate at Ulupono Initiative
Industry Financial Services
Experience
Ulupono Initiative May 2015 - August 2015
KPMG January 2014 - June 2014
KPMG July 2012 - December 2013
Citi May 2011 - July 2012
HSBC March 2009 - September 2010
Winbond April 2007 - February 2009
Skills
Banking, Sales Management, Product Marketing, Training, Business Development, Semiconductors, IC, Sales, Customer Service, Financial Analysis, Strategy, Digital Marketing, Project Management
Education
Emory University - Goizueta Business School 2014 — 2016
University of California, Davis 2002 — 2006
Bachelor of Arts, Economics
Ulupono Initiative May 2015 - August 2015
KPMG January 2014 - June 2014
KPMG July 2012 - December 2013
Citi May 2011 - July 2012
HSBC March 2009 - September 2010
Winbond April 2007 - February 2009
Skills
Banking, Sales Management, Product Marketing, Training, Business Development, Semiconductors, IC, Sales, Customer Service, Financial Analysis, Strategy, Digital Marketing, Project Management
Education
Emory University - Goizueta Business School 2014 — 2016
University of California, Davis 2002 — 2006
Bachelor of Arts, Economics
Charlie, Chi-Dar Tsai's Winbond Experience July 1996 - February 2000
Job Reliability Engineer at Crane Aerospace
Industry Airlines/Aviation
Experience
Crane Aerospace November 2006 - Present
Toptrend Technologies Corp. October 2002 - November 2006
Micron Technology, Taiwan Branch March 2000 - March 2002
Winbond July 1996 - February 2000
Winbond July 1993 - July 1996
Skills
Reliability, Aerospace, Failure Analysis, Lean Manufacturing, Systems Engineering, Engineering, Avionics, Aircraft, Engineering Management, Electronics, DO-178B, Kaizen, Testing, Root Cause Analysis, Six Sigma, AS9100, Continuous Improvement, Earned Value Management, Manufacturing..., FMEA, Value Stream Mapping, GD&T, DMAIC, SPC, Design for Manufacturing, Design of Experiments, Manufacturing, Aerospace Engineering, Fault Tree Analysis, Catia, Aeronautics, Test Equipment, Simulations
Education
Californica State of Northridge 1989 — 1993
Bachelor of Science (BS), Electrical and Electronics Engineering
California State University-Northridge 1988 — 1993
Bachelor of Engineering (BEng), Electrical and Electronics Engineering
Crane Aerospace November 2006 - Present
Toptrend Technologies Corp. October 2002 - November 2006
Micron Technology, Taiwan Branch March 2000 - March 2002
Winbond July 1996 - February 2000
Winbond July 1993 - July 1996
Skills
Reliability, Aerospace, Failure Analysis, Lean Manufacturing, Systems Engineering, Engineering, Avionics, Aircraft, Engineering Management, Electronics, DO-178B, Kaizen, Testing, Root Cause Analysis, Six Sigma, AS9100, Continuous Improvement, Earned Value Management, Manufacturing..., FMEA, Value Stream Mapping, GD&T, DMAIC, SPC, Design for Manufacturing, Design of Experiments, Manufacturing, Aerospace Engineering, Fault Tree Analysis, Catia, Aeronautics, Test Equipment, Simulations
Education
Californica State of Northridge 1989 — 1993
Bachelor of Science (BS), Electrical and Electronics Engineering
California State University-Northridge 1988 — 1993
Bachelor of Engineering (BEng), Electrical and Electronics Engineering
Dan Fainshtein's Winbond Experience May 2005 - Present
Job Senior Application Engineer at Winbond
Industry Computer Hardware
Experience
Nuvoton 2008 - Present
Winbond May 2005 - Present
National Semiconductor July 1998 - May 2005
Education
Holon Institute of Technology 1999 — 2004
B.Sc.T.E., Electricity and Electronics
Nuvoton 2008 - Present
Winbond May 2005 - Present
National Semiconductor July 1998 - May 2005
Education
Holon Institute of Technology 1999 — 2004
B.Sc.T.E., Electricity and Electronics
Jiajia Xu's Winbond Experience 2002 - 2003
Job at Broadcom.com
Industry Semiconductors
Experience
Broadcom October 2005 - January 2012
Winbond 2002 - 2003
Education
Peking University 1999 — 2002
MS, Microelectronic
University of Electronic Science and Technology 1995 — 1999
ba, EE
Broadcom October 2005 - January 2012
Winbond 2002 - 2003
Education
Peking University 1999 — 2002
MS, Microelectronic
University of Electronic Science and Technology 1995 — 1999
ba, EE
Ed Efron's Winbond Experience Senior Sales ManagerWinbond Electronics2007 - Present
Job Senior Sales Manager at Winbond
Industry Semiconductors
Experience
Winbond Senior Sales ManagerWinbond Electronics2007 - Present
Education
Santa Clara University - Leavey School of Business
Master of Business Administration (MBA)
Winbond Senior Sales ManagerWinbond Electronics2007 - Present
Education
Santa Clara University - Leavey School of Business
Master of Business Administration (MBA)
Ming-Huei Shieh's Winbond Experience December 2008 - Present
Job Technical Executive at Winbond
Industry Semiconductors
Experience
Winbond December 2008 - Present
Spansion August 2005 - December 2008
Spansion December 2004 - August 2005
AMD August 2002 - December 2004
Skills
IC, Verilog, Semiconductors, Analog, VLSI, Electronics, Circuit Design, FPGA, ASIC, EDA, Integrated Circuit..., Simulations, Mixed Signal, CMOS, SoC, Analog Circuit Design, Failure Analysis, System Architecture
Education
University of Maryland College Park 1989 — 1994
Ph.D.
National Taiwan University 1982 — 1984
MS
National Chiao Tung University 1978 — 1982
BS
Winbond December 2008 - Present
Spansion August 2005 - December 2008
Spansion December 2004 - August 2005
AMD August 2002 - December 2004
Skills
IC, Verilog, Semiconductors, Analog, VLSI, Electronics, Circuit Design, FPGA, ASIC, EDA, Integrated Circuit..., Simulations, Mixed Signal, CMOS, SoC, Analog Circuit Design, Failure Analysis, System Architecture
Education
University of Maryland College Park 1989 — 1994
Ph.D.
National Taiwan University 1982 — 1984
MS
National Chiao Tung University 1978 — 1982
BS
Malcolm White's Winbond Experience March 2004 - June 2004
Job Contract IC Layout Designer at Computer Task Group
Industry Semiconductors
Experience
Computer Task Group March 2015 - Present
Intel Corporation August 2013 - February 2015
NVIDIA September 2011 - August 2013
Dongbu HiTek December 2009 - September 2011
Maxim Integrated Products December 2004 - March 2009
Epoch Microelectronics, Inc. 2009 - 2009
Qualcomm Corporation July 2004 - November 2004
Winbond March 2004 - June 2004
Texas Instruments October 2003 - March 2004
Texas Instruments September 2003 - September 2003
Skills
DRC, LVS, Mixed Signal, CMOS, Hercules, Floorplanning, BiCMOS, Analog, Physical Verification, PLL, Cadence Virtuoso, IC, Physical Design, Semiconductors, RF, Cadence, Virtuoso, IC layout, Cadence Virtuoso XL
Education
Portland Community College 1990 — 1992
AAS, Electronic Engineering Technology
Computer Task Group March 2015 - Present
Intel Corporation August 2013 - February 2015
NVIDIA September 2011 - August 2013
Dongbu HiTek December 2009 - September 2011
Maxim Integrated Products December 2004 - March 2009
Epoch Microelectronics, Inc. 2009 - 2009
Qualcomm Corporation July 2004 - November 2004
Winbond March 2004 - June 2004
Texas Instruments October 2003 - March 2004
Texas Instruments September 2003 - September 2003
Skills
DRC, LVS, Mixed Signal, CMOS, Hercules, Floorplanning, BiCMOS, Analog, Physical Verification, PLL, Cadence Virtuoso, IC, Physical Design, Semiconductors, RF, Cadence, Virtuoso, IC layout, Cadence Virtuoso XL
Education
Portland Community College 1990 — 1992
AAS, Electronic Engineering Technology
Lori K. Cox's Winbond Experience 1995 - 2000
Job Marketing Communications Consultant
Industry Marketing and Advertising
Experience
LK Cox LLC April 1995 - Present
NetApp 2007 - 2014
Hewlett-Packard 2000 - 2008
Cisco Systems 2005 - 2005
Symantec 2005 - 2005
Quantum 1998 - 2001
Winbond 1995 - 2000
EFI 1989 - 1995
Neale-May & Partners 1988 - 1989
Skills
Marketing Communications, Project Management, Concept Development, Product Management, Entrepreneurship, Teaching, Integrated Marketing, Corporate Communications, Copywriting, Media Relations, Advertising, Social Media Marketing, Internal Communications, Public Relations, Strategic Communications, Email Marketing, Press Releases, Digital Marketing, Direct Marketing, Social Media, Marketing Strategy
Education
Florida State University
B.S., Communications
LK Cox LLC April 1995 - Present
NetApp 2007 - 2014
Hewlett-Packard 2000 - 2008
Cisco Systems 2005 - 2005
Symantec 2005 - 2005
Quantum 1998 - 2001
Winbond 1995 - 2000
EFI 1989 - 1995
Neale-May & Partners 1988 - 1989
Skills
Marketing Communications, Project Management, Concept Development, Product Management, Entrepreneurship, Teaching, Integrated Marketing, Corporate Communications, Copywriting, Media Relations, Advertising, Social Media Marketing, Internal Communications, Public Relations, Strategic Communications, Email Marketing, Press Releases, Digital Marketing, Direct Marketing, Social Media, Marketing Strategy
Education
Florida State University
B.S., Communications
Tim Yao's Winbond Experience June 2000 - June 2002
Job Software Architect, Director at Amlogic, Inc.
Industry Semiconductors
Experience
Amlogic, Inc. February 2000 - Present
Winbond June 2000 - June 2002
Education
Tongji University 1995 — 1999
Electric Engineering
Amlogic, Inc. February 2000 - Present
Winbond June 2000 - June 2002
Education
Tongji University 1995 — 1999
Electric Engineering
Zhuangrong (John) Xu's Winbond Experience May 2002 - May 2005
Job at
Industry Computer Hardware
Experience
Apple November 2014 - Present
Broadcom July 2012 - November 2014
Marvell May 2005 - July 2012
Winbond May 2002 - May 2005
Skills
FPGA, Embedded Systems, SoC, ASIC, IC, Debugging, ARM, Embedded Software, Semiconductors, RTOS, Algorithms, C, Software Engineering, Wireless, C++, Linux, Software Development
Education
Institute of Software, Chinese Academy of Sciences
Tsinghua University
Apple November 2014 - Present
Broadcom July 2012 - November 2014
Marvell May 2005 - July 2012
Winbond May 2002 - May 2005
Skills
FPGA, Embedded Systems, SoC, ASIC, IC, Debugging, ARM, Embedded Software, Semiconductors, RTOS, Algorithms, C, Software Engineering, Wireless, C++, Linux, Software Development
Education
Institute of Software, Chinese Academy of Sciences
Tsinghua University
Albert Wu's Winbond Experience March 1997 - March 1998
Job Board Director at Global Semiconductor Alliance
Industry Semiconductors
Experience
Global Semiconductor Alliance January 2013 - Present
Marvell Semiconductor November 2001 - Present
San Jose State University March 2006 - October 2012
Global Monte Jade Science & Technology Association - July 2005 - July 2009
Global Semiconductor Alliance December 2005 - December 2008
Marvell Semiconductor August 1998 - November 2001
Silicon Spice March 1998 - August 1998
Winbond March 1997 - March 1998
MoSys March 1994 - March 1997
Integrated Silicon Solutions Inc. March 1991 - March 1994
Skills
Semiconductors, IC, SoC, ASIC, Silicon, Semiconductor Industry, CMOS, Yield, Mixed Signal, Cross-functional Team..., Product Engineering, Engineering Management
Education
University of California, Berkeley 1980 — 2007
Doctor of Philosophy (Ph.D.), Electrical Engineering and Computer Science
National Taiwan University 1974 — 1978
BS Electrical Engineering
Global Semiconductor Alliance January 2013 - Present
Marvell Semiconductor November 2001 - Present
San Jose State University March 2006 - October 2012
Global Monte Jade Science & Technology Association - July 2005 - July 2009
Global Semiconductor Alliance December 2005 - December 2008
Marvell Semiconductor August 1998 - November 2001
Silicon Spice March 1998 - August 1998
Winbond March 1997 - March 1998
MoSys March 1994 - March 1997
Integrated Silicon Solutions Inc. March 1991 - March 1994
Skills
Semiconductors, IC, SoC, ASIC, Silicon, Semiconductor Industry, CMOS, Yield, Mixed Signal, Cross-functional Team..., Product Engineering, Engineering Management
Education
University of California, Berkeley 1980 — 2007
Doctor of Philosophy (Ph.D.), Electrical Engineering and Computer Science
National Taiwan University 1974 — 1978
BS Electrical Engineering
Lisa Chiong's Winbond Experience June 2012 - Present
Job Customer Service Manager at Winbond
Industry Semiconductors
Experience
Winbond June 2012 - Present
Winbond February 2003 - June 2012
Winbond January 2001 - February 2003
@Network October 1999 - December 2000
Skills
Semiconductors, Electronics, Sales Management, Semiconductor Industry
Education
University of Phoenix
B.S., Business Administration
Winbond June 2012 - Present
Winbond February 2003 - June 2012
Winbond January 2001 - February 2003
@Network October 1999 - December 2000
Skills
Semiconductors, Electronics, Sales Management, Semiconductor Industry
Education
University of Phoenix
B.S., Business Administration
Rachel Santos Mendoza's Winbond Experience September 2005 - September 2007
Job Senior Project Manager at Comet Technologies
Industry Semiconductors
Experience
COMET Technologies USA, Inc. September 2014 - Present
COMET Technologies USA inc June 2013 - September 2014
COMET Technologies USA inc October 2010 - June 2013
COMET Technologies USA, Inc. October 2007 - September 2010
Winbond September 2005 - September 2007
Torani August 2003 - September 2005
MadeToOrder.com November 1999 - December 2002
Skills
Customer Service, Inventory Management, Forecasting, Process Improvement, Product Management, Project Management, Purchasing, Management, SAP, Product Development, Cross-functional Team..., Product Marketing, CRM
Education
University of Phoenix 2011 — 2011
Project Management
Golden Gate University 2007 — 2009
Business Administration
COMET Technologies USA, Inc. September 2014 - Present
COMET Technologies USA inc June 2013 - September 2014
COMET Technologies USA inc October 2010 - June 2013
COMET Technologies USA, Inc. October 2007 - September 2010
Winbond September 2005 - September 2007
Torani August 2003 - September 2005
MadeToOrder.com November 1999 - December 2002
Skills
Customer Service, Inventory Management, Forecasting, Process Improvement, Product Management, Project Management, Purchasing, Management, SAP, Product Development, Cross-functional Team..., Product Marketing, CRM
Education
University of Phoenix 2011 — 2011
Project Management
Golden Gate University 2007 — 2009
Business Administration
Tsung-Han Yang's Winbond Experience October 2006 - June 2007
Job Process Development Engineer
Industry Semiconductors
Experience
Lam Research March 2011 - Present
Winbond October 2006 - June 2007
Skills
Thin film fabrication..., Thin film..., Microscopy: SEM, AFM,..., Materials..., Mechanical...
Education
North Carolina State University 2007 — 2011
Doctor of Philosophy (Ph.D.), Materials Sciences, 3.8
Lam Research March 2011 - Present
Winbond October 2006 - June 2007
Skills
Thin film fabrication..., Thin film..., Microscopy: SEM, AFM,..., Materials..., Mechanical...
Education
North Carolina State University 2007 — 2011
Doctor of Philosophy (Ph.D.), Materials Sciences, 3.8
Beng Beh's Winbond Experience October 2001 - March 2006
Job Sr System Engineer at Vital Connect, Inc.
Industry Semiconductors
Experience
Vital Connect, Inc. November 2012 - Present
Nuvoton Technology Corporation America April 2007 - October 2012
Maxim Integrated Products April 2006 - March 2007
Winbond October 2001 - March 2006
Radar System and Remote Sensing Laboratory, The University of Kansas January 1995 - August 2001
Avago Technology Malaysia (formerly known as Hewlett Packard Malaysia) October 1992 - November 1994
Skills
Mixed Signal, Test Engineering, Debugging, Test Equipment, Characterization, Hardware Architecture, I2C, SPI, PCM, I2S, Excel, IC, RF, Testing, Data Analysis, SoC, C++, LabVIEW, Wearables, Mobile Testing, MATLAB
Education
The University of Kansas 1995 — 1997
MS, Electrical Engineering
Jit Sin High School
Vital Connect, Inc. November 2012 - Present
Nuvoton Technology Corporation America April 2007 - October 2012
Maxim Integrated Products April 2006 - March 2007
Winbond October 2001 - March 2006
Radar System and Remote Sensing Laboratory, The University of Kansas January 1995 - August 2001
Avago Technology Malaysia (formerly known as Hewlett Packard Malaysia) October 1992 - November 1994
Skills
Mixed Signal, Test Engineering, Debugging, Test Equipment, Characterization, Hardware Architecture, I2C, SPI, PCM, I2S, Excel, IC, RF, Testing, Data Analysis, SoC, C++, LabVIEW, Wearables, Mobile Testing, MATLAB
Education
The University of Kansas 1995 — 1997
MS, Electrical Engineering
Jit Sin High School
Vincent Mui's Winbond Experience November 2003 - July 2009
Job Marketing Manager at Texas Instruments
Industry Semiconductors
Experience
Texas Instruments July 2012 - Present
Nuvoton Technology Corporation January 2010 - July 2012
Nuvoton Technology Corporation July 2009 - January 2010
Winbond November 2003 - July 2009
Alcatel-Lucent August 2000 - December 2000
Xerox Canada January 1999 - December 1999
Citi April 1998 - September 1998
Skills
Microsoft Office, Microsoft Excel, Microsoft Word, PowerPoint, Customer Service, Matlab, Simulink, C, C++, Hspice, Network Analyzer, Analog Circuit Design, Ericsson, RF Circuits Design, Frequency Synthesizers, PLL, Bluetooth, LNA, DAC, ADC, Audio, Development of..., Product Marketing, Financial Analysis, Financial Risk..., PCB design, Sound, SPICE, RF, Audio Codecs, ADCs
Education
University of San Francisco - Masagung Graduate School of Management
Master's degree, GPA = 4.0 out of 4.0
University of Toronto
Master's degree, Electrical and Electronics Engineering
University of Waterloo
Honours Bachelor of Applied Science (B.A.Sc.), Electrical and Electronics Engineering with Management Option
Texas Instruments July 2012 - Present
Nuvoton Technology Corporation January 2010 - July 2012
Nuvoton Technology Corporation July 2009 - January 2010
Winbond November 2003 - July 2009
Alcatel-Lucent August 2000 - December 2000
Xerox Canada January 1999 - December 1999
Citi April 1998 - September 1998
Skills
Microsoft Office, Microsoft Excel, Microsoft Word, PowerPoint, Customer Service, Matlab, Simulink, C, C++, Hspice, Network Analyzer, Analog Circuit Design, Ericsson, RF Circuits Design, Frequency Synthesizers, PLL, Bluetooth, LNA, DAC, ADC, Audio, Development of..., Product Marketing, Financial Analysis, Financial Risk..., PCB design, Sound, SPICE, RF, Audio Codecs, ADCs
Education
University of San Francisco - Masagung Graduate School of Management
Master's degree, GPA = 4.0 out of 4.0
University of Toronto
Master's degree, Electrical and Electronics Engineering
University of Waterloo
Honours Bachelor of Applied Science (B.A.Sc.), Electrical and Electronics Engineering with Management Option
Myung Chan Choi's Winbond Experience August 2010 - Present
Job Principal Engineer at Winbond
Industry Semiconductors
Experience
Winbond August 2010 - Present
ZMOS Technology, Inc. August 2003 - May 2010
AMIC Technology March 1999 - July 2003
Alpha Corp. November 1997 - October 1998
Samsung Electronics January 1992 - November 1997
Skills
Low-power Design, DDR3, Circuit Design, Memory Test, RAMS, Integrated Circuit..., Semiconductors, CMOS, RAM Structural Systems, Semiconductor Industry, IC, ASIC, DRAM, SoC, Analog, EDA
Education
Kwangwoon University 1986 — 1992
BS, Electronics
Winbond August 2010 - Present
ZMOS Technology, Inc. August 2003 - May 2010
AMIC Technology March 1999 - July 2003
Alpha Corp. November 1997 - October 1998
Samsung Electronics January 1992 - November 1997
Skills
Low-power Design, DDR3, Circuit Design, Memory Test, RAMS, Integrated Circuit..., Semiconductors, CMOS, RAM Structural Systems, Semiconductor Industry, IC, ASIC, DRAM, SoC, Analog, EDA
Education
Kwangwoon University 1986 — 1992
BS, Electronics
oswald yoon's Winbond Experience September 2010 - Present
Job Staff Design Engineer at Winbond
Industry Semiconductors
Experience
Winbond September 2010 - Present
ZMOS Technology, Inc. December 2003 - May 2010
AMIC Technology Inc. November 2000 - December 2003
LG semicon Co. January 1993 - August 1997
Skills
DRAM, Verilog, Semiconductors, IC, Mobile Devices, Product Management, VLSI, Cross-functional Team..., Analog Circuit Design, Cadence Virtuoso
Education
Kwangwoon University 1988 — 1992
BSEE, Electonic Materials Engineering
Winbond September 2010 - Present
ZMOS Technology, Inc. December 2003 - May 2010
AMIC Technology Inc. November 2000 - December 2003
LG semicon Co. January 1993 - August 1997
Skills
DRAM, Verilog, Semiconductors, IC, Mobile Devices, Product Management, VLSI, Cross-functional Team..., Analog Circuit Design, Cadence Virtuoso
Education
Kwangwoon University 1988 — 1992
BSEE, Electonic Materials Engineering
George S. Zhou's Winbond Experience March 2000 - June 2002
Job Senior Staff Engineer at Qualcomm QCT
Industry Semiconductors
Experience
Qualcomm February 2013 - Present
Broadcom June 2009 - January 2013
O2 Medtech August 2008 - July 2010
Texas Instruments February 2006 - September 2008
VIA Telecom July 2002 - December 2005
Winbond March 2000 - June 2002
Blonder Tongue Laboratories June 1999 - February 2000
University of Pennsylvania ,NIM,inc April 1996 - January 1999
Skills
Wireless, CDMA, FPGA, speech and audio coding, Audio enhancement, GGE,WCDMA,HSPA+,etc, Wireless..., Digital Signal..., Verilog, RTOS, Embedded Software, Embedded Systems, LTE, Mixed Signal, Digital Signal..., RF, Firmware, Algorithms, SoC, Mobile Devices, WCDMA, Debugging
Education
University of Pennsylvania 1993 — 1999
Electrical and Electronics Engineering
Huazhong University of Science and Technology
Qualcomm February 2013 - Present
Broadcom June 2009 - January 2013
O2 Medtech August 2008 - July 2010
Texas Instruments February 2006 - September 2008
VIA Telecom July 2002 - December 2005
Winbond March 2000 - June 2002
Blonder Tongue Laboratories June 1999 - February 2000
University of Pennsylvania ,NIM,inc April 1996 - January 1999
Skills
Wireless, CDMA, FPGA, speech and audio coding, Audio enhancement, GGE,WCDMA,HSPA+,etc, Wireless..., Digital Signal..., Verilog, RTOS, Embedded Software, Embedded Systems, LTE, Mixed Signal, Digital Signal..., RF, Firmware, Algorithms, SoC, Mobile Devices, WCDMA, Debugging
Education
University of Pennsylvania 1993 — 1999
Electrical and Electronics Engineering
Huazhong University of Science and Technology
Bo-Yi Lin's Winbond Experience February 1997 - February 2000
Job Engineer at OmniVision Technologies Inc.
Industry Semiconductors
Experience
OmniVision Technologies Inc. February 2000 - Present
Winbond February 1997 - February 2000
Creative Labs June 1995 - February 1997
Education
University of California, Berkeley 1991 — 1995
BS, EECS
OmniVision Technologies Inc. February 2000 - Present
Winbond February 1997 - February 2000
Creative Labs June 1995 - February 1997
Education
University of California, Berkeley 1991 — 1995
BS, EECS
Hualiang Xu's Winbond Experience June 2006 - February 2008
Job
Industry Computer Software
Experience
EMC June 2013 - Present
University of Massachusetts September 2012 - May 2013
Dextrys January 2009 - August 2012
InScan April 2008 - January 2009
Winbond June 2006 - February 2008
Skills
Perl, Software Development, Java, C, Linux, C++, Agile Methodologies, Unix, Software Engineering, Python, Scrum, Design Patterns, Operating Systems, Distributed Systems, Algorithms
Education
UMass Lowell 2012 — 2013
Master's, Computer Science
Nantong University 2000 — 2004
Bachelor's, Computer Science and Technology
EMC June 2013 - Present
University of Massachusetts September 2012 - May 2013
Dextrys January 2009 - August 2012
InScan April 2008 - January 2009
Winbond June 2006 - February 2008
Skills
Perl, Software Development, Java, C, Linux, C++, Agile Methodologies, Unix, Software Engineering, Python, Scrum, Design Patterns, Operating Systems, Distributed Systems, Algorithms
Education
UMass Lowell 2012 — 2013
Master's, Computer Science
Nantong University 2000 — 2004
Bachelor's, Computer Science and Technology
Chia-Ching(Lance) Wang's Winbond Experience June 2011 - September 2013
Job NOR/NAND Flash Product/Test Senior Staff Engineer
Industry Semiconductors
Experience
Winbond June 2011 - September 2013
Winbond Electronics Corporation America April 2007 - June 2011
Skills
Semiconductors, Semiconductor Industry, Engineering Management, Cross-functional Team..., Product Engineering, Electronics, Product Management, Failure Analysis, CMOS, Advantester, Versatester, NAND Flash, NOR Flash, Flash Product Engineer, Flash Test Engineer, Device Characterization, Test Flow Development, Test Time Reduction, Customer Return FA, ONFI NAND, SPI NAND, Test Development, Python, Excel Macro, Memory ATE
Education
National Chiao Tung University 1992 — 1994
Master's degree
Chung Yuan Christian University 1988 — 1992
Bachelor of Engineering (BEng)
Winbond June 2011 - September 2013
Winbond Electronics Corporation America April 2007 - June 2011
Skills
Semiconductors, Semiconductor Industry, Engineering Management, Cross-functional Team..., Product Engineering, Electronics, Product Management, Failure Analysis, CMOS, Advantester, Versatester, NAND Flash, NOR Flash, Flash Product Engineer, Flash Test Engineer, Device Characterization, Test Flow Development, Test Time Reduction, Customer Return FA, ONFI NAND, SPI NAND, Test Development, Python, Excel Macro, Memory ATE
Education
National Chiao Tung University 1992 — 1994
Master's degree
Chung Yuan Christian University 1988 — 1992
Bachelor of Engineering (BEng)
Michael Hsieh's Winbond Experience July 1996 - June 1998
Job SMTS at GLOBALFOUNDRIES
Industry Semiconductors
Experience
GLOBALFOUNDRIES 2005 - Present
United Microelectronics Corporation (UMC) March 2003 - August 2005
United Microelectronics Corporation (UMC) June 1998 - March 2003
Winbond July 1996 - June 1998
Skills
Lithography, Metrology, Silicon, Failure Analysis, IC, Semiconductors, SPC, CMOS
Education
Tunghai University 1992 — 1994
Master's degree, Chemical Engineering
GLOBALFOUNDRIES 2005 - Present
United Microelectronics Corporation (UMC) March 2003 - August 2005
United Microelectronics Corporation (UMC) June 1998 - March 2003
Winbond July 1996 - June 1998
Skills
Lithography, Metrology, Silicon, Failure Analysis, IC, Semiconductors, SPC, CMOS
Education
Tunghai University 1992 — 1994
Master's degree, Chemical Engineering
Rynn Wang's Winbond Experience June 1989 - May 1992
Job Business development Sr manager at Lam Research
Industry Semiconductors
Experience
Applied Materials May 2014 - Present
Lam Research December 2011 - April 2014
Lam Research January 2008 - January 2011
Lam Research June 2004 - December 2007
Lam Taiwan May 2002 - October 2003
Applied Materials August 1994 - May 2002
Applied Materials May 1992 - July 1994
Winbond June 1989 - May 1992
Skills
Productivity Improvement, Project Managment, Business Management, Product Marketing, Management, Project Management, Cross-functional Team...
Education
Concordia University-Wisconsin 2001 — 2003
Master, MBA
Tamkang University 1983 — 1987
BS, Electrical and Electronics Engineering
Applied Materials May 2014 - Present
Lam Research December 2011 - April 2014
Lam Research January 2008 - January 2011
Lam Research June 2004 - December 2007
Lam Taiwan May 2002 - October 2003
Applied Materials August 1994 - May 2002
Applied Materials May 1992 - July 1994
Winbond June 1989 - May 1992
Skills
Productivity Improvement, Project Managment, Business Management, Product Marketing, Management, Project Management, Cross-functional Team...
Education
Concordia University-Wisconsin 2001 — 2003
Master, MBA
Tamkang University 1983 — 1987
BS, Electrical and Electronics Engineering
Jeff Peng's Winbond Experience September 1988 - December 1991
Job IC design professional
Industry Design
Experience
MediaTek December 2014 - Present
Broadcom Corp. December 1998 - September 2014
ESST November 1996 - December 1998
ISSI Integrated Silicon Solution Inc. May 1993 - November 1996
Winbond September 1988 - December 1991
Skills
High speed / low power..., Low power..., Custom/semi-custom..., Library development..., Timing closure, Signal/Power Integrity, VLSI new technologies..., Debugging (pre/post..., Functional verification..., Formal Verification, EDA, Verilog, Unix and script..., ASIC, Processors, Static Timing Analysis, Mixed Signal
Education
University of Southern California 1991 — 1993
Master's Degree, Electrical, Electronics and Communications Engineering
National Chiao Tung University
Bachelor's Degree, Electrical and Electronics Engineering (Electrophysics)
MediaTek December 2014 - Present
Broadcom Corp. December 1998 - September 2014
ESST November 1996 - December 1998
ISSI Integrated Silicon Solution Inc. May 1993 - November 1996
Winbond September 1988 - December 1991
Skills
High speed / low power..., Low power..., Custom/semi-custom..., Library development..., Timing closure, Signal/Power Integrity, VLSI new technologies..., Debugging (pre/post..., Functional verification..., Formal Verification, EDA, Verilog, Unix and script..., ASIC, Processors, Static Timing Analysis, Mixed Signal
Education
University of Southern California 1991 — 1993
Master's Degree, Electrical, Electronics and Communications Engineering
National Chiao Tung University
Bachelor's Degree, Electrical and Electronics Engineering (Electrophysics)
Brian (Borwen) Yang's Winbond Experience December 1996 - July 2008
Job Principal Engineer ASIC Development at WD, a Western Digital company
Industry Computer Hardware
Experience
WD, a Western Digital company November 2012 - Present
WD, a Western Digital company November 2011 - November 2012
Nuvoton Technology Corp July 2008 - July 2011
Winbond December 1996 - July 2008
Skills
RTL design, RTL verification, SoC, ASIC, NAND Flash, ONFI 3.0, Synopsys tools, Cadence, UVM, Verilog, SystemVerilog
Education
Santa Clara University 1992 — 1994
Master of Science (MS), Electrical and Electronics Engineering
WD, a Western Digital company November 2012 - Present
WD, a Western Digital company November 2011 - November 2012
Nuvoton Technology Corp July 2008 - July 2011
Winbond December 1996 - July 2008
Skills
RTL design, RTL verification, SoC, ASIC, NAND Flash, ONFI 3.0, Synopsys tools, Cadence, UVM, Verilog, SystemVerilog
Education
Santa Clara University 1992 — 1994
Master of Science (MS), Electrical and Electronics Engineering
Xerox
ExxonMobil
Kimberly-Clark
Xerox Corporation
Micron Technology
Parker Hannifin
Tennessee Valley Authority
Apollo Group