Winbond Electronics
Industry: Corporation
DescriptionWinbond Electronics Corporation is a Taiwan-based corporation founded in 1987 that produces semiconductors and several types of integrated circuits, most notably Dynamic RAM, Static RAM, microcontrollers, and personal computer ICs, namely Super I/O chips. Headquarters: Taiwan Founded: 1987 Subsidiaries: Nuvoton, Winbond Electronics Corporation America,
Winbond Electronics List of Employees There's an exhaustive list of past and present employees! Get comprehensive information on the number of employees at Winbond Electronics. You can filter them based on skills, years of employment, job, education, department, and prior employment.
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Winbond Electronics Employees
Employee
Years
Job
Industry
I Ting Huang I Ting Huang's Winbond Electronics Experience July 2011 - September 2011
Job SDE at Uber
Industry Computer Software
Experience
Uber August 2015 - Present
Microsoft December 2013 - Present
Amazon June 2013 - September 2013
UC Santa Barbara September 2012 - June 2013
University of California,Santa Barbara September 2011 - June 2012
Winbond Electronics July 2011 - September 2011
National TsingHua University September 2008 - August 2009
Skills
Matlab, Electrical Engineering, DSP, Digital Image Processing, computer vision, C, C++, python, Data Structures, Layout, PHP, Java, Cadence Virtuoso, Linux, Xilinx ISE, OpenCV, FPGA, Verilog, Python, Networking, Computer Graphics, Computer Vision, Software Engineering, Computer Science, Git
Education
University of California, Santa Barbara 2010 — 2012
Master's degree, Electrical, Electronic and Communications Engineering Technology/Technician, 3.81
National Tsing Hua University 2007 — 2010
Bachelor's degree, Electrical, Electronic and Communications Engineering Technology/Technician, 3.68
Uber August 2015 - Present
Microsoft December 2013 - Present
Amazon June 2013 - September 2013
UC Santa Barbara September 2012 - June 2013
University of California,Santa Barbara September 2011 - June 2012
Winbond Electronics July 2011 - September 2011
National TsingHua University September 2008 - August 2009
Skills
Matlab, Electrical Engineering, DSP, Digital Image Processing, computer vision, C, C++, python, Data Structures, Layout, PHP, Java, Cadence Virtuoso, Linux, Xilinx ISE, OpenCV, FPGA, Verilog, Python, Networking, Computer Graphics, Computer Vision, Software Engineering, Computer Science, Git
Education
University of California, Santa Barbara 2010 — 2012
Master's degree, Electrical, Electronic and Communications Engineering Technology/Technician, 3.81
National Tsing Hua University 2007 — 2010
Bachelor's degree, Electrical, Electronic and Communications Engineering Technology/Technician, 3.68
Boaz Efroni Rotman Boaz Efroni Rotman's Winbond Electronics Experience December 1999 - December 2003
Job Strategic Marketing, SoC Roadmap at Intel Corporation
Industry Semiconductors
Experience
Intel Corporation June 2014 - Present
CSR February 2013 - February 2014
SmartLine Systems October 2011 - February 2013
CellGuide December 2009 - October 2011
Horizon Semiconductors October 2007 - February 2009
Global Locate December 2003 - October 2007
Winbond Electronics December 1999 - December 2003
National Semiconductor June 1995 - December 1999
Skills
Product Marketing, Mobile Devices, Wireless, Business Development, Product Management, Embedded Systems, Telecommunications, Semiconductors, GPS, Product Development, New Business Development, Sales, Start-ups, WiFi, Set Top Box, Bluetooth, Market Penetration, Fundraising, Negotiation, Market Pricing, Chip Architecture, Video Standards, Digital Signal..., Persuasive Presentations, Marketing, Marketing Strategy, Business Strategy, Management, Competitive Analysis, Leadership, Cross-functional Team..., Strategic Partnerships, Strategy, IC, Entrepreneurship, ASIC, SoC, Mobile Marketing, ARM, Consumer Electronics, Embedded Software
Education
Netanya Academic College 2011 — 2014
Master of Business Administration (MBA), Multidisciplinary Management
Ben-Gurion University of the Negev 1991 — 1995
BsEE, Electrical Engineering
Ort Yad Lebovitch High School 1982 — 1986
Electronics associate
Netanya Academic College
Netanya Academic College
Netanya Academic College
Intel Corporation June 2014 - Present
CSR February 2013 - February 2014
SmartLine Systems October 2011 - February 2013
CellGuide December 2009 - October 2011
Horizon Semiconductors October 2007 - February 2009
Global Locate December 2003 - October 2007
Winbond Electronics December 1999 - December 2003
National Semiconductor June 1995 - December 1999
Skills
Product Marketing, Mobile Devices, Wireless, Business Development, Product Management, Embedded Systems, Telecommunications, Semiconductors, GPS, Product Development, New Business Development, Sales, Start-ups, WiFi, Set Top Box, Bluetooth, Market Penetration, Fundraising, Negotiation, Market Pricing, Chip Architecture, Video Standards, Digital Signal..., Persuasive Presentations, Marketing, Marketing Strategy, Business Strategy, Management, Competitive Analysis, Leadership, Cross-functional Team..., Strategic Partnerships, Strategy, IC, Entrepreneurship, ASIC, SoC, Mobile Marketing, ARM, Consumer Electronics, Embedded Software
Education
Netanya Academic College 2011 — 2014
Master of Business Administration (MBA), Multidisciplinary Management
Ben-Gurion University of the Negev 1991 — 1995
BsEE, Electrical Engineering
Ort Yad Lebovitch High School 1982 — 1986
Electronics associate
Netanya Academic College
Netanya Academic College
Netanya Academic College
Phillip Pyo Phillip Pyo's Winbond Electronics Experience February 1995 - May 2001
Job Technology Marketing Director
Industry Consumer Electronics
Experience
NETGEAR October 2005 - Present
Donna Segreta, Inc February 2003 - October 2005
Winbond Electronics February 1995 - May 2001
AMD August 1992 - February 1995
Watkins-Johnson Co February 1987 - August 1992
Skills
SaaS, Product Marketing, Channel, Demand Generation, Marketing, Leadership, Channel Partners, Multi-channel Marketing, Go-to-market Strategy, Competitive Analysis, Product Management, Sales Enablement, Strategic Partnerships, Management, Consumer Electronics, Product Launch, Marketing Strategy, Cross-functional Team..., Product Lifecycle...
Education
Santa Clara University 1992 — 1995
MBA
University of California, Santa Barbara 1982 — 1986
BSEE
NETGEAR October 2005 - Present
Donna Segreta, Inc February 2003 - October 2005
Winbond Electronics February 1995 - May 2001
AMD August 1992 - February 1995
Watkins-Johnson Co February 1987 - August 1992
Skills
SaaS, Product Marketing, Channel, Demand Generation, Marketing, Leadership, Channel Partners, Multi-channel Marketing, Go-to-market Strategy, Competitive Analysis, Product Management, Sales Enablement, Strategic Partnerships, Management, Consumer Electronics, Product Launch, Marketing Strategy, Cross-functional Team..., Product Lifecycle...
Education
Santa Clara University 1992 — 1995
MBA
University of California, Santa Barbara 1982 — 1986
BSEE
Dennis Lyden's Winbond Electronics Experience 2004 - Present
Job Director of Sales at Winbond Electronics
Industry Semiconductors
Experience
Winbond Electronics 2004 - Present
Education
University of Notre Dame
BS, Electrical Engineering
Winbond Electronics 2004 - Present
Education
University of Notre Dame
BS, Electrical Engineering
Hasan Gadjali's Winbond Electronics Experience 1996 - 1999
Job Entrepreneur, Strategist and Business Development
Industry Semiconductors
Experience
ISSC January 2014 - September 2014
OmniVision April 2011 - December 2013
3DLabs June 2007 - March 2011
OmniVision 1999 - 2007
Winbond Electronics 1996 - 1999
Chromatic Research 1995 - 1996
Creative Labs 1995 - 1996
SHARP 1992 - 1996
Telephoto Communication 1987 - 1992
Skills
Product Management, SoC, Semiconductors, ASIC, Competitive Analysis, IC, Product Marketing, Product Engineering, Consumer Electronics, Product Development, CMOS, Start-ups, Embedded Systems, Semiconductor Industry, EDA, FPGA, Mixed Signal, Digital Signal...
Education
San Diego State University-California State University 1985 — 1987
Master of Science (M.S.), Electrical and Electronics Engineering
University of California, San Diego 1982 — 1985
Bachelor of Science (BS), Electrical and Electronics Engineering
ISSC January 2014 - September 2014
OmniVision April 2011 - December 2013
3DLabs June 2007 - March 2011
OmniVision 1999 - 2007
Winbond Electronics 1996 - 1999
Chromatic Research 1995 - 1996
Creative Labs 1995 - 1996
SHARP 1992 - 1996
Telephoto Communication 1987 - 1992
Skills
Product Management, SoC, Semiconductors, ASIC, Competitive Analysis, IC, Product Marketing, Product Engineering, Consumer Electronics, Product Development, CMOS, Start-ups, Embedded Systems, Semiconductor Industry, EDA, FPGA, Mixed Signal, Digital Signal...
Education
San Diego State University-California State University 1985 — 1987
Master of Science (M.S.), Electrical and Electronics Engineering
University of California, San Diego 1982 — 1985
Bachelor of Science (BS), Electrical and Electronics Engineering
Herbert Lai's Winbond Electronics Experience October 2000 - August 2008
Job Staff Mask Design Engineer at SanDisk
Industry Electrical/Electronic Manufacturing
Experience
SanDisk April 2011 - Present
Winbond Electronics October 2000 - August 2008
Education
Santa Clara University 2006 — 2008
Master's degree, Engineering Management
Institute for Business and Technology 1999 — 1999
CMOS Layout Design
University of California, Berkeley 1994 — 1998
Bachelor's degree, Integrative Biology
SanDisk April 2011 - Present
Winbond Electronics October 2000 - August 2008
Education
Santa Clara University 2006 — 2008
Master's degree, Engineering Management
Institute for Business and Technology 1999 — 1999
CMOS Layout Design
University of California, Berkeley 1994 — 1998
Bachelor's degree, Integrative Biology
Jason Dina's Winbond Electronics Experience July 2007 - July 2008
Job FAE at GE Intelligent Platforms
Industry Defense & Space
Experience
General Electric Intelligent Platforms May 2012 - Present
Nuvoton Technology Corp. America July 2008 - May 2012
Winbond Electronics July 2007 - July 2008
Hamilton Sundstrand June 1998 - July 2007
Skills
Embedded Systems, VHDL, Semiconductors, Customer-facing, Technical Sales, SIGINT, High Performance..., Hardware Architecture, FPGA, Firmware, Embedded Software, Microcontrollers, PCB design, Debugging, Electronics, IC, Mixed Signal, PCB Design
Education
The University of Connecticut 1993 — 1998
BSEE, Electrical and Electronics Engineering
Rensselaer Polytechnic Institute at Hartford
Digital Communications
General Electric Intelligent Platforms May 2012 - Present
Nuvoton Technology Corp. America July 2008 - May 2012
Winbond Electronics July 2007 - July 2008
Hamilton Sundstrand June 1998 - July 2007
Skills
Embedded Systems, VHDL, Semiconductors, Customer-facing, Technical Sales, SIGINT, High Performance..., Hardware Architecture, FPGA, Firmware, Embedded Software, Microcontrollers, PCB design, Debugging, Electronics, IC, Mixed Signal, PCB Design
Education
The University of Connecticut 1993 — 1998
BSEE, Electrical and Electronics Engineering
Rensselaer Polytechnic Institute at Hartford
Digital Communications
Tim Gilman's Winbond Electronics Experience October 2005 - April 2008
Job Director of Retirement Psychology
Industry Leisure, Travel & Tourism
Experience
Unafilliated July 2013 - Present
Nuvoton Technology Corporation April 2008 - July 2013
Winbond Electronics October 2005 - April 2008
National Semiconductor April 1976 - 2005
Skills
Product Development, Negotiation, Sales Management, New Business Development, Semiconductors, Customer Relations, Strategic Planning, IC, Problem Solving, Account Management, Product Management, Analog, Strategic Partnerships, Semiconductor Industry, Electronics, Cross-functional Team..., Sales, FPGA, ASIC, Customer Service, Start-ups, Business Development, Product Marketing, Competitive Analysis, Key Account Management
Education
United States Naval Academy 1967 — 1971
Bachelor of Science (B.S.), Naval Science and Operational Studies
Unafilliated July 2013 - Present
Nuvoton Technology Corporation April 2008 - July 2013
Winbond Electronics October 2005 - April 2008
National Semiconductor April 1976 - 2005
Skills
Product Development, Negotiation, Sales Management, New Business Development, Semiconductors, Customer Relations, Strategic Planning, IC, Problem Solving, Account Management, Product Management, Analog, Strategic Partnerships, Semiconductor Industry, Electronics, Cross-functional Team..., Sales, FPGA, ASIC, Customer Service, Start-ups, Business Development, Product Marketing, Competitive Analysis, Key Account Management
Education
United States Naval Academy 1967 — 1971
Bachelor of Science (B.S.), Naval Science and Operational Studies
Sho Kou's Winbond Electronics Experience January 1995 - January 1998
Job at Allegro Software Development Corporation
Industry Consumer Electronics
Experience
Allegro Software Development Corporation June 2009 - Present
Sony February 1998 - June 2009
Winbond Electronics January 1995 - January 1998
Symphony Labs 1995 - 1995
IBM Corp. July 1981 - December 1994
Bendix Corp. October 1979 - July 1981
Skills
DLNA, Software Development, Testing, Embedded Systems, Device Drivers, UPnP, Engineering Management, Set Top Box, IPTV, System Architecture, Embedded Software, DVB, RTOS, Digital TV
Education
Minnesota State University, Mankato 1977 — 1979
MS, Computer Science
Chung Yuan Christian University 1970 — 1974
BSEE, Electronic Engineering
Allegro Software Development Corporation June 2009 - Present
Sony February 1998 - June 2009
Winbond Electronics January 1995 - January 1998
Symphony Labs 1995 - 1995
IBM Corp. July 1981 - December 1994
Bendix Corp. October 1979 - July 1981
Skills
DLNA, Software Development, Testing, Embedded Systems, Device Drivers, UPnP, Engineering Management, Set Top Box, IPTV, System Architecture, Embedded Software, DVB, RTOS, Digital TV
Education
Minnesota State University, Mankato 1977 — 1979
MS, Computer Science
Chung Yuan Christian University 1970 — 1974
BSEE, Electronic Engineering
Ting-Ping Liu's Winbond Electronics Experience 2002 - 2008
Job Independent Consultant
Industry Semiconductors
Experience
IC Industry 2012 - Present
Nuvoton Electronics Technology 2009 - 2011
Nuvoton Electronics Technology 2008 - 2009
Winbond Electronics 2002 - 2008
Agere Systems 2000 - 2002
Bell Labs, Lucent Technology 1996 - 2000
AT&T Bell Labs 1995 - 1996
Education
University of California, Berkeley
Ph. D., EECS
IC Industry 2012 - Present
Nuvoton Electronics Technology 2009 - 2011
Nuvoton Electronics Technology 2008 - 2009
Winbond Electronics 2002 - 2008
Agere Systems 2000 - 2002
Bell Labs, Lucent Technology 1996 - 2000
AT&T Bell Labs 1995 - 1996
Education
University of California, Berkeley
Ph. D., EECS
Chung Eng's Winbond Electronics Experience April 2012 - Present
Job ASIC Design Engineer
Industry Computer Hardware
Experience
Winbond Electronics April 2012 - Present
Kilopass Technology January 2003 - July 2009
Fujitsu April 2001 - August 2002
NEC Electronics March 1998 - March 2001
Fujitsu January 1996 - January 1998
Skills
ASIC, Verilog, Static Timing Analysis, Primetime, RTL design, Equivalence Checking
Education
City University of New York City College
Bachelor of Science, Electrical Engineering
New York University - Polytechnic School of Engineering
Master of Science, Electrical Engineering
Winbond Electronics April 2012 - Present
Kilopass Technology January 2003 - July 2009
Fujitsu April 2001 - August 2002
NEC Electronics March 1998 - March 2001
Fujitsu January 1996 - January 1998
Skills
ASIC, Verilog, Static Timing Analysis, Primetime, RTL design, Equivalence Checking
Education
City University of New York City College
Bachelor of Science, Electrical Engineering
New York University - Polytechnic School of Engineering
Master of Science, Electrical Engineering
William Wen-Yi Chen's Winbond Electronics Experience June 2003 - June 2004
Job
Industry Semiconductors
Experience
Qualcomm May 2013 - Present
Freescale Semiconductor January 2012 - May 2013
National Chiao Tung University September 2007 - December 2011
UIUC August 2010 - August 2011
ITRI October 2006 - September 2007
Cost Guard Administration, Taiwan August 2005 - October 2006
Winbond Electronics June 2003 - June 2004
Skills
SPICE, CMOS, Simulations, Semiconductors, Analog Circuit Design, Circuit Design, Mixed Signal, Characterization, Matlab, Analog, Verilog, Electrical Engineering, IC, Cadence Virtuoso, TCAD, Pcell
Education
National Chiao Tung University 2007 — 2011
Ph.D., EE
National Chiao Tung University 2003 — 2005
MS, EE
National Chiao Tung University 1999 — 2003
BS, EE
Qualcomm May 2013 - Present
Freescale Semiconductor January 2012 - May 2013
National Chiao Tung University September 2007 - December 2011
UIUC August 2010 - August 2011
ITRI October 2006 - September 2007
Cost Guard Administration, Taiwan August 2005 - October 2006
Winbond Electronics June 2003 - June 2004
Skills
SPICE, CMOS, Simulations, Semiconductors, Analog Circuit Design, Circuit Design, Mixed Signal, Characterization, Matlab, Analog, Verilog, Electrical Engineering, IC, Cadence Virtuoso, TCAD, Pcell
Education
National Chiao Tung University 2007 — 2011
Ph.D., EE
National Chiao Tung University 2003 — 2005
MS, EE
National Chiao Tung University 1999 — 2003
BS, EE
Shane Huang's Winbond Electronics Experience July 2004 - June 2005
Job Staff Engineer at AMD
Industry Semiconductors
Experience
AMD November 2013 - Present
AMD (Shanghai) May 2007 - October 2013
Sony July 2005 - April 2007
Winbond Electronics July 2004 - June 2005
Skills
Device Drivers, Linux Kernel, Software Development, Debugging, X86, Embedded Systems, C, C++, SoC, ARM, Hardware, SATA, Firmware, Linux
Education
Nanjing University 2001 — 2004
Master, Computer Science and Technology
Nanjing University 1997 — 2001
Bachelor, Computer Science and Technology
AMD November 2013 - Present
AMD (Shanghai) May 2007 - October 2013
Sony July 2005 - April 2007
Winbond Electronics July 2004 - June 2005
Skills
Device Drivers, Linux Kernel, Software Development, Debugging, X86, Embedded Systems, C, C++, SoC, ARM, Hardware, SATA, Firmware, Linux
Education
Nanjing University 2001 — 2004
Master, Computer Science and Technology
Nanjing University 1997 — 2001
Bachelor, Computer Science and Technology
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