FlipChip International
Industry: Company
DescriptionHeadquarters: Phoenix, AZ Founded: 1996 Subsidiaries: FlipChip Millennium Shanghai, Millennium Microtech Holding Corporation Parent organization: Tianshui Huatian Technology Co., Ltd.FeedbackDisclaimer Claim this knowledge panel Knowledge ResultSee outside Moved, closed, or was never hereReportFlipChip InternationalWebsiteDirections Saved (0) Saved Save 7 Google reviews Corporate office Address: 3701 E University Dr, Phoenix, AZ 85034 Phone: (602) 431-6020Category: : : Place name: : Website: Hours: : : : Website: http://www.flipchip.com/ Category: Corporate office Suggest an editUnable to add this file. Please check that it is a valid photo. Unable to add this file. Please check that it is a valid photo. · Own this business?Add missing informationAdd business hours Unable to add this file. Please check that it is a valid photo. Questions & answers Ask a questionBe the first to ask a question Add a photoThanks for sharing!Your photo will be posted publicly on Google.Contribute MoreDoneUpload public photos of FlipChip International Posting publicly on the Web Write a review Reviews 7 Google reviews
FlipChip International List of Employees There's an exhaustive list of past and present employees! Get comprehensive information on the number of employees at FlipChip International. You can filter them based on skills, years of employment, job, education, department, and prior employment.
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FlipChip International Employees
Intel Corporation February 2013 - Present
FlipChip International December 2005 - January 2012
IC Sservices July 2004 - December 2005
Freescale Semiconductor August 2001 - December 2003
Motorola September 1998 - December 2000
Skills
Semiconductors, Electronics, Manufacturing, Testing, Embedded Systems, Microsoft Office, Product Development, SPC, Troubleshooting, Metrology, Photolithography, Metals, Management, Wafer Fab, Electronics Packaging
Education
Mesa Community College 2003 — 2004
FlipChip International August 2013 - Present
Deseret Industries November 2012 - August 2013
Vangent, Inc. February 2010 - June 2010
Microsemi August 2007 - April 2008
Skills
Team Leadership, Training, Leadership, Team Building, Project Management, Public Relations, Event Management, Analysis, Process Improvement, Program Management, Leadership Development, Coaching, Customer Satisfaction, Customer Service, Inventory Management, Operations Management
Education
Mesa Community College 2005 — 2006
Associates, Digital Animation
Innovative Micro Technology 2010 - Present
FlipChip International 2012 - 2013
FlipChip International 2012 - 2013
Tegal Corporation September 2007 - April 2010
Tegal Corporation May 2002 - August 2007
Skills
CVD, Semiconductor Industry, Thin Films, Product Engineering, Metrology, PVD, Engineering Management, Design of Experiments, Electronics, R&D, Semiconductors, MEMS, Silicon, Cross-functional Team..., Embedded Systems, Characterization, Process Engineering, Failure Analysis, IC, Photolithography, Semiconductor Process, JMP, Process Simulation, SPC, Manufacturing, Vacuum, Nanotechnology, Automation, Analog, Sensors, Design for Manufacturing, Lithography, Engineering, Product Management, Product Development, Lean Manufacturing, Materials Science
Education
Moscow Institute of Electronic Technology (Technical University) (MIET) 1980 — 1986
M.S., Physics, Electronics
Interthinx, a subsidiary of First American Financial Corporation (NYSE: FAF) 2013 - Present
JPMorgan Chase 2012 - 2012
FlipChip International 2005 - 2012
Motorola 1997 - 2005
Blockbuster 1996 - 1997
Champs Sports 1992 - 1996
Skills
Leadership, Management, Operations Management, Training, Manufacturing, Customer Service, Customer Satisfaction, Time Management, Product Development, Team Management, Retail, Employee Relations
Education
Vanguard University of Southern California 1990 — 1991
Finance
International Business College 1984 — 1985
Diploma, Computer Accounting
Valley Metro RPTA January 2015 - Present
FlipChip International November 2010 - January 2015
LMS Intellibound, Inc. May 2009 - December 2010
Shamrock Foods November 2007 - June 2008
Skills
Semiconductor Industry, Semiconductors, Engineering, Automation, Warehousing, Java, Shipping, Electronics, Manufacturing, Preventive Maintenance, Continuous Improvement, ISO, FMEA, Six Sigma, Engineering Management, Design of Experiments
Education
DeVry University 2007 — 2010
Bachelor of Science in Electronics Engineering, Electronics Engineering
Thunderbird High school 2003 — 2007
High School Diploma
ViaSat December 2012 - Present
Freescale Semiconductor January 2005 - December 2012
FlipChip International January 2001 - January 2005
Motorola Computer Group, Motorola Mobility January 1999 - January 2001
Motorola Automotive Advanced SmartMos Products January 1998 - January 1999
Motorola Sensor Products Division January 1996 - January 1998
Motorola January 1995 - January 1996
Skills
Program Management, Cross-functional Team..., Semiconductors, International Project..., Process Improvement, Risk Management, Engineering Management, Product Development, Project Management, Management, Risk Assessment, PMP, Engineering, PMO, Product Management, PMO Management, Black Belt, Subcontracting, Manage Design Win to..., Microsoft Project/..., Cost Reduction/ Budget..., Profit/ Loss Performance, Subcontractor Management, PMP Certification, Six Sigma, Electronics, Testing
Education
Arizona State University
Master of Business Administration (MBA), Management of Technology
Arizona State University
Bachelor of Science, Chemical Engineering
The George Washington University
Master's Certificate, Project Management
Compunetics September 2009 - Present
Phototooling Data Services March 1993 - September 2009
HEI Inc March 2007 - July 2008
FlipChip International July 2004 - May 2007
HEI Inc March 1999 - July 2004
Nelco Products, Inc. March 1994 - August 1999
Dynaco Corporation January 1984 - March 1994
Skills
Front-end, Information Systems, Manufacturing, Product Development, System Administration, Electronics, Engineering, Cross-functional Team..., Design for Manufacturing, Product Management, ISO, Manufacturing..., Program Management
Education
University of Phoenix 2011 — 2014
Bachelor's Degree, Information Technology, 3.95
Chandler Gilbert Community College 2003 — 2003
Visual Basic, Unix, 4.00
Phoenix College
BSIT/BSCS Course Work, 3.33
Vale Technical College
Associate in Specialized Technology, Automotive Techniques & Management, 3.5
FlipChip International August 1999 - May 2013
FlipChip International January 2012 - April 2013
FlipChip International August 1999 - January 2004
Southwest Airlines May 1996 - October 1999
Skills
Failure Analysis, Engineering, Semiconductors, Electronics, Design of Experiments, IC, Thin Films, SPC, Manufacturing, Continuous Improvement, Process Improvement, Troubleshooting, ISO 14001, Root Cause Analysis, FMEA, Testing, Software Documentation, Process Engineering, Engineering Management, JMP, Test Equipment, SharePoint, CATSWeb, Plasma Etch, Analog, Reliability
Education
Dynamic Worldwide Training 2013 — 2014
Certified in Word and Excel, Certified Medical Administrative Assistant/Billing and Coding Specialist
Chandler/Gilbert Community College 1996 — 1999
AA, Semiconductor Manufacturing Technology
University of North Texas 1974 — 1976
Bachelor of Science (BS), Housing
Qualcomm July 2012 - Present
Maxim Integrated Products April 2008 - July 2012
FlipChip International May 2000 - August 2007
JME (Johnson Matthey Electronics) June 1996 - April 2000
Texas Instruments, Philippines, Inc April 1983 - May 1996
Skills
Product Engineering, Semiconductors, IC, Program Management, Semiconductor Industry, Failure Analysis, Design of Experiments, JMP, Manufacturing, PCB design, Reliability, Six Sigma, ASIC, Analog, Analog Circuit Design, CMOS, Characterization, Continuous Improvement, Cross-functional Team..., Electronics, Engineering Management, MEMS, Mixed Signal, Process Engineering, R, Root Cause Analysis, SPC, Signal Integrity, Silicon
Education
Mapua Institute of Technology 1977 — 1983
FlipChip International October 1996 - Present
SGS September 1995 - October 1996
US Airways February 1988 - December 1995
US Navy April 1981 - April 1985
Education
University of Phoenix
BS-Marketing
FlipChip International October 2009 - Present
Avago Technologies October 2008 - October 2009
Freescale Semiconductor June 1999 - October 2008
Education
Arizona State University 1993 — 1998
LP Analytical, LLC July 2014 - Present
Clear Path Technologies, Inc. May 2008 - Present
Malcolm Grey, LLC July 2007 - Present
Isola Group January 2010 - November 2013
Flipchip International 2004 - 2007
Park Electrochemical Corporation 1997 - 2003
Nalco Chemical Company 1992 - 1995
National Science Foundation (NSF) Center for Charge Transfer Studies 1991 - 1992
Skills
R&D, Product Development, Cross-functional Team..., Continuous Improvement, Management, Semiconductors, Product Management, Product Marketing, Manufacturing, Strategic Planning, Program Management, Electronics, Project Management, Process Optimization, Business Intelligence, Analysis
Education
University of Rochester 1991 — 1992
Postdoctoral Fellow, Photochemistry
Arizona State University 1987 — 1991
Ph.D., Physical-Organic Chemistry
Bowling Green State University 1985 — 1987
M.S., Organic Chemistry
Point Loma Nazarene University 1982 — 1985
BA, Chemistry
STATS ChipPAC January 2013 - Present
Cleanpart US LLC, Hohnloser Group August 2011 - November 2012
Adams Brothers Inc. June 2010 - July 2011
QuantumClean 2007 - June 2010
Adams Acquisitions LLC April 2005 - April 2007
Leica Microsystems (Vistec) January 2001 - April 2005
Electroglas 2000 - 2001
Flipchip International 1998 - 2000
Kulicke and Soffa Industries 1997 - 1998
Skills
Semiconductors, Manufacturing, Cross-functional Team..., ISO Certifications, Product Development, Sales Operations, Strategy, Selling, Leadership, Engineering, Business Development, Account Management, Sales, Forecasting, Supply Chain, Marketing Strategy, Project Management, Sales Process, B2B, Negotiation, Budgets, Product Management, Manufacture
Education
University of Pittsburgh - Joseph M. Katz Graduate School of Business 1993 — 1994
EMBA, International Finance
Purdue University 1978 — 1982
BS, Electrical Engineering
Freeport-McMoRan May 2015 - Present
FlipChip International June 2012 - October 2014
Education
Computer Career Center a division of Vista College 2010 — 2011
Network and System Administration/Administrator
FlipChip International January 2006 - Present
Laminate Technologies Inc. May 1998 - September 2005
Dynaco Corp June 1987 - May 1998
Skills
Semiconductors, Semiconductor Industry, IC, CMOS, Design of Experiments
Education
ITT Technical Institute-Phoenix 1986 — 1987
Associate's degree, Computer Aided Design
Microchip Technology April 2015 - Present
FlipChip International September 2013 - April 2015
Microchip Technology January 2010 - August 2013
Microchip Technology March 2007 - January 2010
Microchip Technology May 1999 - May 2007
Microchip Technology 1996 - 1999
Microchip Technology October 1991 - 1996
Skills
Semiconductors, Semiconductor Industry, IC, ASIC, Manufacturing, Embedded Systems, Mixed Signal, Electronics, Engineering Management, Product Engineering, Debugging, Design of Experiments, Analog, Memory, EEPROM, Flash Memory, Business Strategy, New Business Development, Process Improvement, Program Management, CMOS, Product Development, System Architecture, Firmware, Testing, EDA, Reliability, Packaging
Education
Cranfield University 1990 — 1991
MSc, Astronautics and Space Engineering
The University of Edinburgh 1986 — 1990
BSc (Hons), Astrophysics
Global Communication Semiconductors,Inc. March 2013 - February 2015
FlipChip International February 2007 - October 2012
FlipChip International January 2005 - February 2007
California Micro Devices 2002 - 2004
California Micro Devices January 1996 - January 2002
Motorola June 1995 - January 1996
GTE Microcircuits / California Micro Devices October 1991 - June 1995
Skills
Semiconductor Industry, Packaging Engineering, Photolithography, Plasma Etch, Wet Chemical Etching, WLCSP, Semiconductors, SPC, Design of Experiments, Continuous Improvement, Six Sigma, Root Cause Analysis, Product Development, Engineering, Product Engineering, Process Engineering, Silicon, Reliability, Manufacturing, Failure Analysis, Process Simulation, Yield, Metrology, Thin Films, CMOS, Manufacturing..., JMP, Process Integration, Electronics, Testing, PECVD, Microelectronics, Lean Manufacturing, R&D, PVD, Characterization, Analog, Mixed Signal, Semiconductor..., IC, Etching, MEMS, CVD, Test Engineering, ASIC, PCB design, FMEA, Semiconductor Process, Engineering Management, Power Management
Education
Arizona State University 1994 — 2000
Bachelor of Science, Electrical Engineering
Honeywell Aerospace April 2014 - October 2014
Stryker Sustainability Solutions May 2013 - December 2013
Peter Wolters of America July 2010 - October 2012
MicroPower Global Limited September 2008 - August 2010
FlipChip International April 2007 - May 2008
SpeedFam-IPEC 1998 - 2001
AGI, inc 1996 - 1997
AGI, inc 1996 - 1997
Skills
Materials Science, R&D, Process Engineering, Design of Experiments, CSSGB, Semiconductors, Thin Films, Characterization, Silicon, Failure Analysis, Process Simulation, SPC, Nanotechnology, PECVD, Sputtering, Six Sigma, Process Improvement, Manufacturing, PVD, Photolithography, Lean Manufacturing, FMEA
Education
Arizona State University
Master's Degree, Materials Engineering, 3.64/4.00
Arizona State University
Bachelor's Degree, Material Science Engineering
Esri October 2012 - Present
Arizona State University, School of Geographical Sciences and Urban Planning May 2012 - October 2012
FlipChip International November 2009 - August 2011
Intel Corporation May 2006 - January 2009
Skills
GIS, ArcGIS, GPS, ESRI, Geography, Remote Sensing, Spatial Analysis, AutoCAD, Cartography, Microsoft Office, Python, Google Earth, Data Management, ArcMap, Data Analysis, Data Collection
Education
Arizona State University 2011 — 2012
Masters of Advanced Study in Geographic Information Systems (MAS-GIS), Geographical Information Systems (GIS)
Arizona State University 2007 — 2011
BSc, Urban Planning and GIS
Arizona State University 2006 — 2008
Architectural Studies
Addis Ababa University 2000 — 2002
Architecture and Urban Planning
Augustana College (SD) May 2014 - Present
PacTech January 2008 - May 2014
WLCSP Forum January 2009 - December 2012
dpiX May 2007 - November 2007
Starkey Hearing Technologies January 2007 - May 2007
International Microelectronics and Packaging Society January 2005 - May 2007
FlipChip International February 2005 - January 2007
IC Interconnect July 1998 - February 2005
The Dow Chemical Company October 1984 - July 1998
MCNC August 1995 - July 1996
Skills
Manufacturing, Semiconductors, Design of Experiments, Semiconductor Industry, R&D, Electronics, Coatings, Characterization, Polymers, Materials Science, Failure Analysis, Microelectronics, IC, SPC, Silicon, Thin Films, Metrology
Education
University of Minnesota-Twin Cities 1979 — 1984
Doctor of Philosophy (Ph.D.), Organic Chemistry
Luther College 1975 — 1979
Bachelor's Degree, Chemistry, Physics, Biology
Moorhead High School 1971 — 1975
High School
Medtronic July 2006 - Present
Medtronic October 2003 - July 2006
Target November 2001 - October 2003
FlipChip International April 2000 - November 2001
Motorola April 1998 - April 2000
Motorola April 1993 - March 1998
Skills
Lean Sigma Green Belt..., Knowledge of Import..., Mentoring, Coaching,..., Experienced with ISO..., International Air..., Resource Conservation..., Occupational Safety..., Capacity Utilization, Utilized Theories of..., Proficient in...
Education
University of Phoenix 1999 — 2001
Master of Business Administration (MBA), Business Administration and Management, General
Huston-Tillotson University 1994 — 1996
Bachelor of Arts (BA), Business Administration and Management, General
Central Arizona College 1989 — 1991
Associate of Arts (AA), Business Administration and Management, General
GrafTech International April 2010 - Present
Radio Datacom, Inc. January 2009 - July 2010
Amkor Technology January 2008 - November 2008
FlipChip International 2000 - 2007
Flip Chip Technologies 2000 - 2004
Arch Chemicals 1996 - 2000
Olin Corporation 1996 - 2000
Teepak LLC 1987 - 1996
Skills
Semiconductors, Manufacturing, Product Development, Product Management, Sales, Electronics, Failure Analysis, Marketing, Engineering, Product Engineering, Semiconductor Industry, Design of Experiments, Engineering Management, Lean Manufacturing, Cross-functional Team..., Process Engineering, R&D, Continuous Improvement, SPC, Characterization, Program Management, Six Sigma, Testing, Root Cause Analysis, Reliability, Graphite TIMs, Graphite Heat Spreaders
Education
University of Colorado Boulder 1978 — 1984
BS, Chemical Engineering
University of Phoenix at Phoenix 1997 — 2000
MBA, Business
SDC Materials, INC June 2015 - Present
SDC Materials February 2011 - April 2015
FlipChip International July 2007 - February 2011
Freescale Semiconductor March 2006 - June 2007
Motorola Semiconductor 1997 - 2003
Motorola 1990 - 1996
Signetics July 1987 - May 1990
Intel Corporation May 1984 - July 1987
Anderson Clayton & Co August 1982 - May 1984
Skills
Semiconductor Industry, Engineering Management, Process Engineering, Plasma Etch, Semiconductors, CVD, Design of Experiments, Manufacturing, SPC, PECVD, Cross-functional Team..., Failure Analysis, Six Sigma, Diffusion, Electronics, Continuous Improvement, Engineering, JMP, Lean Manufacturing, Metrology, Thin Films, Silicon, R&D, Characterization, Yield, FMEA, IC, Product Engineering, Process Simulation, Leadership, Photolithography, PVD, Materials Science, Plasma Physics, Intel, Microelectronics, MEMS, Nanotechnology, CMOS, Root Cause Analysis, Process Integration, Etching, Lithography, Coatings, Semiconductor Process, Powder X-ray Diffraction, Atomic Layer Deposition, Electroplating, Semiconductor..., Device Characterization
Education
Arizona State University 1980 — 1982
BSE
Fujitsu February 2012 - Present
Solutions Real Estate April 2011 - Present
Keller Williams Integrity First Realty October 2009 - April 2011
Honeywell Aerospace September 2008 - November 2008
Honeywell Information Systems September 2005 - October 2006
FlipChip International February 2001 - May 2005
DCI Management January 2000 - February 2001
Lawrence Semiconductor Laboratories Marketing & Sales, Inc. September 1989 - September 1998
Skills
Project Management, Customer Service, Sales, Process Improvement, Semiconductors, Management, Vendor Management, Human Resources, Operations Management, Payroll, SAP, PMO, Manufacturing, Marketing, Cross-functional Team..., Finance, Contract Negotiation, Infrastructure, Testing, Negotiation, Leadership, Retail, Databases, Auditing, Real Estate, Program Management, New Business Development, Invoicing, Problem Solving, Residential Homes, Data Center, Accounting, Integration, Sales Management, Business Development, Six Sigma
Education
Arizona State University
Family Resources & Human Development, Human Development and Family Studies, General
Torment CNC Machining September 2009 - Present
FlipChip International September 2007 - Present
Lam Research February 1995 - September 2007
Skills
Semiconductors, Photolithography, Silicon, Semiconductor Industry, Electronics, Manufacturing, Failure Analysis, Continuous Improvement, Design of Experiments, SPC, Metrology, Six Sigma, Cross-functional Team..., Lean Manufacturing, Engineering, Troubleshooting, Root Cause Analysis, Engineering Management, CVD, Process Engineering, Testing, IC, FMEA, Automation, Thin Films, Analog, Robotics, PVD, Reliability, Product Development, R, Manufacturing..., ISO, Product Engineering
Education
DeVry University Phoenix, AZ 1992 — 1994
Associate's degree, Electrical and Electronics Engineering
University of Phoenix August 2010 - Present
Creative Human Resources January 2007 - August 2008
FlipChip International March 2005 - December 2006
Captive Plastics August 1997 - February 2005
Skills
Employee Relations, Change Management, Human Resources, Succession Planning, Employee Benefits, Program Management, HR Consulting, Organizational..., Team Building, Leadership Development, Strategic Planning, Performance Management, Labor Relations, Coaching, Mergers, Management, Leadership
Education
University of Phoenix 1996 — 1998
MBA, International Business
Park College 1990 — 1992
BS, HR Management
Raytheon March 2015 - Present
GT Advanced Technologies January 2014 - November 2014
Jabil July 2010 - January 2014
Nutraceutical Corporation July 2009 - July 2010
2Wire November 2008 - July 2009
FlipChip International January 2005 - January 2008
Intel Corporation June 2000 - January 2005
Skills
SMT, Test Equipment, Electronics, Soldering, Electronics..., Power Supplies, Multimeter, Electronics Repair, Oscilloscope, Electro-mechanical, Spectrum Analyzer, Calibration, Signal Generators, Schematic, Test Engineering, Digital Electronics, Electrical..., PCB design, Wiring, Equipment Repair, Electronic Engineering, Failure Analysis, Hand Tools, Equipment Maintenance, Metrology, Equipment Installation, ESD control, Pneumatics, Power Electronics, Analog, PLC Allen Bradley, AC/DC, RF, PLC Ladder Logic, Schematic Capture, Components, Orcad, Preventive Maintenance, PCB Design, Manufacturing, Lean Manufacturing
Education
Arizona State University 2006 — 2008
Bachelor's Degree, Operations Management and Supervision, 3.89
Mesa Community College 1998 — 2000
Associate's degree, Electrical, Electronic and Communications Engineering Technology/Technician
FlipChip International February 2012 - Present
International Rectifier February 2011 - January 2012
Microsemi Corporation October 2004 - December 2010
Skills
Semiconductors, Semiconductor Industry, Business Intelligence, Economics, Business, Manufacturing, Access, Process Engineering, Cross-functional Team..., FMEA, Continuous Improvement, Failure Analysis, Root Cause Analysis, Engineering Management, Lean Manufacturing, Six Sigma, Design of Experiments, Electronics, SPC
Education
Arizona State University 2001 — 2014
Bachelor's Degree, Interdisciplinary Studies Business/Economics, Senior
FlipChip International 2013 - Present
SUMCO USA 2008 - 2013
STMicroelectronics 1998 - 2008
CFM Technologies 1996 - 1998
Skills
Silicon, Semiconductor Industry, Etching, Plasma Etch, Materials Science, Process Engineering, SPC, Semiconductors, Design of Experiments, Failure Analysis, Metrology, Thin Films, FMEA, JMP, CVD, Etch, CMOS, Process Integration, Characterization, Manufacturing, Root Cause Analysis, ISO, TS16949, Auditing, Quality System, 8D Problem Solving, Change Control, Environmental Monitoring, BiCMOS, Lean Manufacturing, PVD
Education
Lehigh University 1994 — 1996
M.S., Materials Science and Engineering
Rensselaer Polytechnic Institute 1990 — 1994
B.S., Materials Engineering
PRA Health Sciences July 2014 - Present
Quintiles October 2011 - June 2014
FileONE March 2011 - September 2011
CREE, Inc November 2008 - March 2011
Wachovia Securities February 2008 - November 2008
CIRCUIT CITY STORES October 2006 - February 2008
INFINEON TECHNOLOGIES / QIMONDA August 2004 - October 2006
FlipChip International February 1999 - July 2004
Brooks Automation January 1998 - September 1998
Motorola Solutions May 1996 - January 1998
Skills
Business Analysis, Requirements Gathering, Requirements Analysis, Requirements Management, Agile, SDLC, Testing, User Acceptance Testing, Data Analysis, Software Project..., SQL, SQL Server, Six Sigma, Problem Solving, Business Process..., Documentation, Microsoft SQL Server, Software Documentation, XML, Unix, Business Process, Visual Basic, Visio, Agile Methodologies
Education
University of Florida 1989 — 1992
BS, Materials Science Engineering
University of Phoenix
Masters, Business Administration
Aveta Business Institute
Green Belt Certification, Six Sigma
Isola Group October 2007 - Present
FlipChip International September 2005 - September 2007
Carolina Circuits 1987 - 1991
Hadco 1983 - 1987
Skills
Certified Arizona Home..., Notary Public, Master Redwood Carver, Product Marketing, Manufacturing, Product Development, Electronics, Cross-functional Team...
Education
University of South Carolina-Columbia 1975 — 1980
Bachelor of Science (BS), Chemistry
University of South Carolina-Columbia
University of South Carolina-Columbia
Icon Injection Molding June 2015 - Present
Colonial Saw January 2011 - January 2015
Wright Machine Tool January 2008 - May 2011
Intel January 2004 - March 2007
FlipChip International 1996 - 1999
Skills
Wide range of..., Recognized Team..., Operational Risk..., Strategic planning, Value Stream Mapping, SPC, Leadership, Organization, Strategic Planning, Manufacturing..., Operations Management, Engineering, Cross-functional Team..., Lean Manufacturing, Semiconductors, Kaizen, Manufacturing Operations, Team Building, Continuous Improvement, Six Sigma, Manufacturing...
Education
University of Phoenix 1994 — 1999
Bachelor of Science (BS), Business Administration, Management and Operations
University of Phoenix 1992 — 1996
Bachelor of Science (B.S.), Business Administration and Management, General
FlipChip International April 2013 - Present
Microsemi February 2002 - April 2013
FlipChip International 1998 - 2002
FlipChip Technologies/KNS FCD 1998 - 2002
Skills
Failure Analysis, Manufacturing, R&D, Engineering, Product Development, Test Equipment, Yield, Materials, Medical Devices, Semiconductors, Validation, Design of Experiments
Education
University of Pittsburgh 1986 — 1990
Bachelor of Science (BS), Chemistry
GoDaddy.com April 2009 - Present
FlipChip International September 2007 - December 2008
FlipChip International October 2003 - September 2007
Education
Devry University 2002 — 2005
bs, Technical Management
DeVry University Phoenix 2001 — 2004
bs, Technical Management
Northstar Aerospace June 2008 - Present
D-Velco Manufacturing of Arizona June 2008 - June 2011
FlipChip International November 1996 - February 2008
Skills
Manufacturing, Semiconductor Industry, Six Sigma, Continuous Improvement, Lean Manufacturing, Purchasing, Semiconductors, SPC, Cross-functional Team..., Supply Chain Management, Root Cause Analysis, MRP, FMEA, Supply Management, ISO, 5S, DMAIC, AS9100, Engineering Management, Quality System, Value Stream Mapping, Engineering, Process Engineering, Black Belt, APQP, TQM, Supplier Quality, Process Improvement
Education
University of Phoenix 1976 — 1996
FlipChip International August 2009 - September 2014
Freescale Semiconductor 2002 - 2008
Motorola Semiconductor 1994 - 2002
Motorola Semiconductor 1992 - 1994
Motorola Semiconductor 1989 - 1992
Skills
Process Engineering, Electronics, Manufacturing, Troubleshooting, Process Improvement, Testing, CMOS, Semiconductors, Semiconductor Industry, SPC, Silicon, ASIC, Leadership, Plasma Etch, Metrology, Equipment Maintenance, Root Cause Analysis, Automation, Process Integration, Preventive Maintenance, PCB design, Engineering Management, Design of Experiments, Sensors, Lean Manufacturing, Lithography, Product Engineering, Project Management, Electricians, Oscilloscope, Software Documentation, RF, Electrical Engineering, JMP, Yield, Process Simulation, Microelectronics, Reliability, PVD, DMAIC, Manufacturing..., IC, Failure Analysis
Education
Glendale Community College 1986 — 1989
AAS, Computer Electronics
WD, a Western Digital company February 2011 - Present
ST Microelectronics January 2007 - February 2011
Microchip Technology 2004 - 2006
FlipChip International 2003 - 2004
Brooks Automation 1999 - 2003
Electronic Data Systems 1995 - 1999
Electronic Data Systems 1991 - 1995
Electronic Data Systems 1987 - 1991
Skills
System Architecture, Software Development, Automation, Semiconductor Industry, C#, Object Oriented Design, SQL, Agile Methodologies, Testing, Integration, Debugging, Program Management, Manufacturing, Microsoft SQL Server, Continuous Improvement, Troubleshooting, Unix, Cross-functional Team..., Process Improvement, Storage, IC, Perl, Hardware, Linux, TCL, SPC
Education
Anderson University 1982 — 1986
Bachelor’s Degree, Mathematics
Kulicke and Soffa July 2014 - Present
STATS ChipPAC April 2008 - July 2014
FlipChip International February 2004 - February 2008
Flipchip Technologies October 1996 - February 2004
Skills
Start-ups, Semiconductors, Business Development, IC, Product Development, Semiconductor Industry, Manufacturing, Silicon, Design of Experiments, SPC, Product Engineering, R&D, Electronics, Engineering Management, Continuous Improvement
Education
University of Kansas
Multek January 2015 - Present
Flextronics May 2013 - December 2014
Shocking Technologies, Inc. June 2011 - March 2013
eKubik Consulting, LLC May 2002 - August 2011
Kemeta, LLC February 2010 - January 2011
Kemeta, LLC 2007 - 2010
FlipChip International February 2004 - August 2006
Intel 1994 - 2003
Skills
Semiconductors, Product Development, Cross-functional Team..., R&D, Manufacturing, Product Management, Engineering Management, Start-ups, Product Marketing, Process Engineering, Engineering, Electronics, Program Management, Six Sigma, Strategic Partnerships, Lean Manufacturing, Medical Devices, New Business Development
Education
University of Massachusetts, Amherst 1990 — 1994
PhD, Polymer Science & Engineering
University of Massachusetts, Amherst 1990 — 1992
MS, Polymer Science and Engineering
Illinois Institute of Technology 1986 — 1990
MS, Metallurgical and Materials Engineering
DePaul University - Charles H. Kellstadt Graduate School of Business 1986 — 1989
MBA, Entrepreneurship
University of Illinois at Chicago 1976 — 1981
BS, Chemistry
Schneider Development General contracting September 2005 - Present
Phoenician Creative Environments September 2005 - Present
United Sustainable Energy April 2008 - February 2010
PurePak Technology November 1999 - November 2002
FlipChip International May 1997 - November 1999
Air Products and Chemicals May 1991 - May 1997
Intel Corporation January 1986 - May 1991
Skills
Product Development, Manufacturing, Cross-functional Team..., Operations Management, Strategic Planning, Process Improvement, Continuous Improvement, Lean Manufacturing, Contract Negotiation, New Business Development, Troubleshooting, Design of Experiments, Residential Homes, Program Management, Semiconductors, Business Strategy, Project Planning, Restoration, Negotiation, Competitive Analysis, Electronics, Solar Energy, Start-ups, Semiconductor Industry, R&D, Business Development, Business Planning, Strategy, Product Management, Process Engineering, Engineering Management, Engineering
Education
University of Arizona 1974 — 1978
Bachelor of Applied Science (BASc), Chemistry/Psychology
Camelback High School 1969 — 1973
science
Process Technology June 2015 - Present
Carsem June 2014 - May 2015
FlipChip International September 2012 - June 2013
Progression Solutions January 2010 - September 2012
Amkor Technology June 2003 - June 2009
Miller Heiman 2003 - 2003
Semitool 1995 - 2002
Intergraph 1989 - 1995
Teradyne 1979 - 1985
Hewlett Packard (now Agilent Technologies) 1977 - 1979
Skills
Semiconductors, Manufacturing, Electronics, Semiconductor Industry, New Business Development, Strategy, Testing, Direct Sales, SPC, Product Management, IC, Lithography, RF, Metrology, Semiconductor Packaging, Sales Management, Electroplating, Sales Process, Entrepreneurship, Instrumentation, Capital Equipment, Account Management, Director level, Leadership, Capital Equipment Sales, Miller-Heiman Strategic..., Global Account..., Electronics..., Customer service..., Entrepreneur, Company Representation, 3D Packaging, WLP, CAD/CAM software, IC packaging
Education
Purdue University 1973 — 1977
BSEE, Electrical Engineering
Qualcomm October 2013 - Present
FlipChip International August 2012 - October 2013
Amkor Technology November 1999 - April 2012
Medtronic February 1999 - November 1999
Motorola Semiconductor August 1996 - February 1999
Motorola October 1994 - August 1996
Skills
Product Development, Substrates, Flip Chip, Semiconductors, Microelectronics, Semiconductor Packaging, Supply Management, Packaging, Supply Chain Management, Electronics Packaging, IC, Silicon, JMP, Design of Experiments
Education
Auburn University 1992 — 1994
Masters, Electrical Engineering
Auburn University 1987 — 1992
Bachelors, EE
Freescale Semiconductor 2010 - Present
FlipChip International February 2007 - January 2010
Freescale Semiconductor 2005 - February 2007
Motorola Semiconductor 1998 - 2005
Motorola Semiconductor 1990 - 1998
Skills
Manufacturing, Continuous Improvement, Flip Chip, WLP, Semiconductors, SPC, Design of Experiments, Six Sigma, Semiconductor Industry, Electronics, Cross-functional Team..., Failure Analysis, Lean Manufacturing, Process Engineering, Reliability, Management, Engineering Management, Process Improvement, Product Development, JMP, Customer Service, Program Management, FMEA, Yield, Quality Assurance, Analog, Root Cause Analysis, Engineering, Reliability Engineering, Statistics, Contract Negotiation, IC, DMAIC
Education
Arizona State University
University of Phoenix
Southwest College of Naturopathic Medicine May 2012 - Present
US Airways March 2007 - 2012
FlipChip International November 2005 - March 2007
Thornwood furniture Mfg September 2003 - November 2005
Office of the Auditor General of Arizona January 2000 - September 2003
Education
Mesa Community College 1984 — 2019
University of Phoenix 1997 — 1999
BS, Accounting and Business/Management
FlipChip International March 2012 - Present
Western Digital May 2011 - March 2012
ST Microelectronics January 2000 - May 2011
STEAG Microelectronics November 1995 - January 2000
IBM January 1984 - October 1995
Skills
Semiconductors, Failure Analysis, Analog, Microelectronics, SPC, Semiconductor Industry, CVD, Silicon, IC, CMOS, PVD, Metrology, Thin Films, Design of Experiments, Electronics, Field Service, ASIC, FMEA, Debugging, Mixed Signal, Engineering Management, Sputtering, Etching, Plasma Etch, SoC, Characterization, Sensors, Vacuum, Robotics, Manufacturing, Yield, R&D, Semiconductor Process, Product Engineering, Process Engineering, Reliability, Labview, Nanotechnology, MEMS, JMP, Equipment Maintenance, Electro-mechanical, PECVD, Intel, Test Equipment, Photolithography, RF, Clean Rooms, Process Simulation, Diffusion
Education
State University of New York at Stony Brook 1979 — 1983
Bachelors of Science, Electrical Engineering
FlipChip International November 2009 - Present
Freescale Semiconductor December 1997 - December 2009
Motorola Semiconductor September 1993 - August 1997
Education
Arizona State University 1993 — 1999
BS, Mechanical Engineering
FlipChip International August 2015 - Present
FlipChip International January 2013 - August 2015
FlipChip International January 2005 - January 2013
FlipChip International September 2000 - January 2005
Motorola June 1995 - September 2000
Skills
Technical Product Sales, Wafer Level Packaging, New Business Development, Strategic Marketing, Business Strategy, Corporate Branding, Wafer Fab, Photolithography, Wireless Industry..., Semiconductors, Mobile Devices, Design of Experiments, Failure Analysis, Semiconductor Industry, SPC, Reliability, Research and Development, Silicon, Material..., Engineering Management, Root Cause Analysis, IC, Electronics, Manufacturing
Education
Grand Canyon University 1994 — 1996
Bachelor's Degree, Biology
VWR September 2010 - Present
Goodrich 2006 - 2009
Rogers Corporation 2000 - 2006
FlipChip International 1998 - 1999
Honeywell 1988 - 1998
Skills
Engineering, Six Sigma, Manufacturing, Design of Experiments, Process Engineering, Failure Analysis, R&D, Lean Manufacturing, Materials Science, Product Development, Materials, SPC, Green Belt, Testing, Process Simulation, Water Treatment
Education
University of Newcastle
Bachelor's Degree, Materials Engineering
FlipChip International January 2010 - Present
Cypress Semiconductor April 2002 - September 2009
Andigilog 2000 - 2001
ON Semiconductor 1997 - 2001
Motorola Semiconductor 1992 - 1997
Skills
Semiconductors, Mixed Signal, IC, Product Engineering, Engineering Management, SPC, Product Management, CMOS, SoC, Debugging, Firmware, Electronics, Analog Circuit Design, Semiconductor Industry, Silicon, Yield, Analog, Failure Analysis, PCB design, ASIC
Education
Arizona State University 1990 — 1993
BSE, Electrical Engineering
Yazaki North America February 2013 - Present
FANUC Robotics August 2010 - February 2013
Inteva Products - Orion Cockpit Ops February 2009 - June 2009
Microchip Technology May 2007 - February 2009
PSI Repair Services, Inc. @ Freescale Semiconductor October 2006 - May 2007
SPX Contech (former Ryken Tube Mfg.) December 2004 - October 2006
Meridian Automotive Systems March 2004 - October 2004
Contract June 2002 - October 2002
FlipChip International September 2000 - May 2001
California Micro Devices June 1997 - September 2000
Skills
Continuous Improvement, Materials Management, Automotive, Lean Manufacturing, Manufacturing, Management, Engineering, ISO/TS 16949, MRP, Root Cause Analysis, SAP, PPAP, Product Development, Six Sigma
Education
University of Phoenix 2009 — 2011
MS, Master of Science in Accountancy, 3.0
Michigan State University 1984 — 1989
BA, Materials & Logistics Mgt--Purchasing & Operations, 3.3
Sumika Electronic Materials 2010 - Present
Kemeta 2007 - 2010
FlipChip International 2004 - 2006
Kopin Corporation 2000 - 2004
Advanced Technology Materials, Inc. 1995 - 2000
Skills
Crystal Growth, Materials Science, Semiconductors, Characterization, Product Development, Thin Films, R&D, Metrology, Manufacturing, Device Characterization, Semiconductor Industry, Electronics, Optics, Sensors, SPC, Epitaxy, Solar Cells, Materials, Silicon, MOCVD, Laser, Nanomaterials, Design of Experiments, Photovoltaics, IC, MEMS, Failure Analysis, Microelectronics, GaN, GAAS, Photonics, JMP, Sputtering, Etching, Mixed Signal, PECVD, Analog, Product Engineering, Nanotechnology, PVD, CVD, Yield, Optoelectronics, CMOS, Engineering Management, Photolithography
Education
University of Massachusetts, Amherst
Ph.D., M.S., B.S., Electrical Engineering
FlipChip International
Skills
SPC, Manufacturing, FMEA, Design of Experiments, Lean Manufacturing, Six Sigma, Root Cause Analysis, Engineering, Semiconductors, Manufacturing...
Education
DePaul University 2001 — 2004
Master of Business Administration (MBA)
University of Illinois at Urbana-Champaign 1995 — 1997
Master of Science (M.S.), Theoretical and Applied Mechanics
Rensselaer Polytechnic Institute 1990 — 1994
Bachelor of Science (BS), Mechanical Engineering
University High School
Isola Group February 2011 - Present
FlipChip International January 2008 - February 2011
FlipChip International September 2005 - January 2008
Park Electrochemical (Neltec) October 1998 - September 2005
Skills
Process Engineering, SPC, Manufacturing, Design of Experiments, Project Management, Continuous Improvement, Six Sigma, DMAIC, Value Stream Mapping, Product Development, Engineering, Process Improvement, Engineering Management, 5S, Failure Analysis, Management, Cross-functional Team..., Lean Manufacturing, Semiconductors, Silicon, Semiconductor Industry, ISO, Testing, Kaizen, Thin Films, Electronics, Manufacturing..., R&D, PVD, Root Cause Analysis, Product Engineering, Metrology, FMEA, Manufacturing..., Design for Manufacturing, Plasma Etch, Yield, Process Simulation, Process Integration, PECVD, CVD, Photolithography, Etching
Education
Arizona State University 1979 — 1983
Bachelor of Science
Express Scripts February 2015 - Present
GT Advanced Technologies March 2014 - February 2015
International Rectifier April 2010 - March 2014
Microsemi Corp Scottsdale 2007 - April 2010
FlipChip International January 2001 - November 2007
Motorola 1996 - 2001
Skills
Process Engineering, Distribution Center..., Silicon, Engineering, Continuous Improvement, Cross-functional Team..., Design of Experiments, Electronics, Engineering Management, FMEA, Failure Analysis, Kaizen, Lean Manufacturing, Automation, MRP, Manufacturing, Manufacturing..., Manufacturing..., Metrology, Power Supplies, SPC, Semiconductor Industry, Root Cause Analysis, Semiconductors, Supply Chain, Supply Chain Management, Six Sigma, Thin Films, Troubleshooting
Education
University of Phoenix 2008 — 2012
BBM, Business Administration, Management and Operations
Mesa Community College 1997 — 2000
Associate of Arts (A.A.), general study
FlipChip International August 2015 - Present
FlipChip International March 2015 - August 2015
FlipChip International July 2012 - March 2015
FlipChip International April 2011 - July 2012
FlipChip International October 2010 - April 2011
Skills
Semiconductors, SPC, Silicon, Semiconductor Industry, Photolithography, Electronics, Manufacturing, Process Engineering, Engineering Management, Engineering, Continuous Improvement, Root Cause Analysis, Troubleshooting, Preventive Maintenance, Automation, ISO, Metrology, FMEA, Design of Experiments, Failure Analysis, Lean Manufacturing, Cross-functional Team...
Education
DeVry University Phoenix 2012 — 2013
Bachelors of Science in Technical Management
DeVry University 2008 — 2010
AAS in Computer Science, Electronics
Qorvo (RFMD) June 2007 - Present
Amkor Technology 2004 - June 2007
California Micro Devices 2001 - 2004
FlipChip International 2000 - 2001
Motorola 1994 - 2000
Education
University of Phoenix 1997 — 2000
Master of Business Administration (M.B.A.)
Arizona State University 1988 — 1991
Bachelor of Science (B.S.)
FlipChip International July 2012 - Present
L-3 communications July 2003 - July 2012
Motorola June 1997 - February 2003
Skills
Preventive Maintenance, Electrical..., Electronics, Clean Rooms, Manufacturing, Automation, Calibration, Continuous Improvement, Cross-functional Team..., Design of Experiments, Electro-mechanical, Equipment Maintenance, Failure Analysis, Field Service, Inspection, Lean Manufacturing, Maintenance, Pneumatics, Pumps, Robotics, SPC, Semiconductor Industry, Semiconductors, Six Sigma, Soldering, Test Equipment, Troubleshooting
Education
Mesa Community College 2009 — 2012
Associate's degree, Accounting and Business/Management, 3.6
Mesa Community College 2008 — 2012
Associate's degree, Business/Computer Information Systems, 3.6
Mesa Community College 1997 — 2003
Associate of Applied Science, Electronic Engineering Technology, 3.33
FlipChip International June 2000 - Present
Micron Technology November 1997 - June 2000
Skills
Semiconductors, Semiconductor Industry, Photolithography, Design of Experiments, Silicon, CVD, Engineering, Etching, Failure Analysis, Manufacturing, Thin Films, Plasma Etch, Root Cause Analysis, Continuous Improvement, SPC, Six Sigma, Electronics, Metrology, Cross-functional Team..., Process Engineering, Troubleshooting, JMP, Engineering Management, Process Integration, PECVD, Reliability, Yield, Testing, Test Equipment, CMOS, Automation, Product Engineering, PVD, Vacuum, ISO, R&D, Analog, Diffusion, Microelectronics, Preventive Maintenance, Manufacturing..., Semiconductor Process, Robotics, FMEA, IC, Characterization
Education
DeVry University Phoenix 1995 — 1997
Associate's degree, Electrical and Electronics Engineering