Invensas Corporation
Industry: Company
DescriptionFounded: 2008 Parent organization: Xperi Corporation
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Invensas Corporation Employees
Employee
Years
Job
Industry
Rizza Lee Cizek Rizza Lee Cizek's Invensas Corporation Experience April 2013 - June 2014
Job Senior Packaging Engineer at Kaiam Corporation
Industry Electrical/Electronic Manufacturing
Experience
Kaiam Corporation June 2014 - Present
Invensas Corporation April 2013 - June 2014
FormFactor October 2009 - February 2013
ASMPT October 2007 - September 2009
Amkor Technology April 2004 - April 2007
Skills
SPC, JMP, Matlab, MathCAD, Metrology, Soldering, Visual Inspection, Process Engineering, Root Cause Analysis, FMEA, QC Tools, Poka Yoke, Management, Failure Analysis, Characterization, Semiconductors, Wire Bonding, Die Attach, Cross Sections, Reliability Engineering, Process Integration, Materials Science, Process Simulation, Design for Manufacturing, Yield
Education
Technological University of the Philippines 1999 — 2004
BSME, Mechanical Engineering
Technological University of the Philippines 1999 — 2004
Bachelor of Science (B.S.), Mechanical Engineering
Kaiam Corporation June 2014 - Present
Invensas Corporation April 2013 - June 2014
FormFactor October 2009 - February 2013
ASMPT October 2007 - September 2009
Amkor Technology April 2004 - April 2007
Skills
SPC, JMP, Matlab, MathCAD, Metrology, Soldering, Visual Inspection, Process Engineering, Root Cause Analysis, FMEA, QC Tools, Poka Yoke, Management, Failure Analysis, Characterization, Semiconductors, Wire Bonding, Die Attach, Cross Sections, Reliability Engineering, Process Integration, Materials Science, Process Simulation, Design for Manufacturing, Yield
Education
Technological University of the Philippines 1999 — 2004
BSME, Mechanical Engineering
Technological University of the Philippines 1999 — 2004
Bachelor of Science (B.S.), Mechanical Engineering
Javier DeLaCruz Javier DeLaCruz's Invensas Corporation Experience August 2015 - Present
Job Vice President of Engineering at Invensas Corporation
Industry Semiconductors
Experience
Invensas Corporation August 2015 - Present
eSilicon January 2003 - August 2015
Multilink Technology November 2000 - December 2002
STATS ChipPAC June 1999 - November 2000
M/A-COM July 1996 - June 1999
Skills
Signal Integrity, Operations Management, Packaging, Semiconductors, 3D packaging, System Level Design, Design of Experiments, Outsourcing, IC, ASIC, SoC, 3DIC, Product Engineering, Analog Circuit Design, Mixed Signal, Silicon, Floorplanning, Engineering, Cross-functional Team..., CMOS, Electronics, RF, FPGA, Engineering Management, Failure Analysis, Hardware Architecture, Reliability, Process Simulation, Digital Signal..., PCB design, Product Development, Processors, Six Sigma, Simulations, Test Engineering, Semiconductor Industry, Analog, Debugging, Supply Chain Management, R&D, Electronic System Design, Manufacturing, Microelectronics, Characterization, Process Engineering, Circuit Design, FMEA, Microprocessors, EDA, Integrated Circuit...
Education
Babson College - Franklin W. Olin Graduate School of Business 2009 — 2011
MBA
Boston University 1998 — 2000
MS
Stevens Institute of Technology 1992 — 1996
BEME
Invensas Corporation August 2015 - Present
eSilicon January 2003 - August 2015
Multilink Technology November 2000 - December 2002
STATS ChipPAC June 1999 - November 2000
M/A-COM July 1996 - June 1999
Skills
Signal Integrity, Operations Management, Packaging, Semiconductors, 3D packaging, System Level Design, Design of Experiments, Outsourcing, IC, ASIC, SoC, 3DIC, Product Engineering, Analog Circuit Design, Mixed Signal, Silicon, Floorplanning, Engineering, Cross-functional Team..., CMOS, Electronics, RF, FPGA, Engineering Management, Failure Analysis, Hardware Architecture, Reliability, Process Simulation, Digital Signal..., PCB design, Product Development, Processors, Six Sigma, Simulations, Test Engineering, Semiconductor Industry, Analog, Debugging, Supply Chain Management, R&D, Electronic System Design, Manufacturing, Microelectronics, Characterization, Process Engineering, Circuit Design, FMEA, Microprocessors, EDA, Integrated Circuit...
Education
Babson College - Franklin W. Olin Graduate School of Business 2009 — 2011
MBA
Boston University 1998 — 2000
MS
Stevens Institute of Technology 1992 — 1996
BEME
andrew cao andrew cao's Invensas Corporation Experience December 2012 - Present
Job MTS lithography engineer at Soraa
Industry Semiconductors
Experience
Soraa September 2014 - Present
Invensas Corporation December 2012 - Present
Mirrorcle Technologies September 2012 - December 2012
Silicon Valley Technology Center January 2012 - September 2012
Mirrorcle Technologies September 2011 - January 2012
Pacific Bioscience March 2011 - September 2011
Western Digital June 2009 - April 2011
Mirrorcle Technologies January 2009 - June 2009
KLA-Tencor November 2006 - January 2009
Cypress Semiconductor December 2004 - October 2006
Skills
MEMS, Design of Experiments, Metrology, Photolithography, Semiconductors, Thin Films, Lithography, Failure Analysis, SPC, Sensors, JMP, Characterization, Optics, Simulations, R&D, Process Integration, Analysis, Nanotechnology, Microfabrication, Finite Element Analysis..., Solidworks
Education
University of California, Berkeley 1999 — 2004
Ph.D, Mechanical Engineering
University of California, Berkeley 1999 — 2002
MS, Mechanical Engineering
Stanford University 1998 — 1999
Mechanical Engineering
University of California, Berkeley 1993 — 1998
BS, Mechanical Engineering
Chabot college 1993 — 1995
San Jose City College
Laser and Optical Technology/Technician
Soraa September 2014 - Present
Invensas Corporation December 2012 - Present
Mirrorcle Technologies September 2012 - December 2012
Silicon Valley Technology Center January 2012 - September 2012
Mirrorcle Technologies September 2011 - January 2012
Pacific Bioscience March 2011 - September 2011
Western Digital June 2009 - April 2011
Mirrorcle Technologies January 2009 - June 2009
KLA-Tencor November 2006 - January 2009
Cypress Semiconductor December 2004 - October 2006
Skills
MEMS, Design of Experiments, Metrology, Photolithography, Semiconductors, Thin Films, Lithography, Failure Analysis, SPC, Sensors, JMP, Characterization, Optics, Simulations, R&D, Process Integration, Analysis, Nanotechnology, Microfabrication, Finite Element Analysis..., Solidworks
Education
University of California, Berkeley 1999 — 2004
Ph.D, Mechanical Engineering
University of California, Berkeley 1999 — 2002
MS, Mechanical Engineering
Stanford University 1998 — 1999
Mechanical Engineering
University of California, Berkeley 1993 — 1998
BS, Mechanical Engineering
Chabot college 1993 — 1995
San Jose City College
Laser and Optical Technology/Technician
Liang (Frank) Wang Liang (Frank) Wang's Invensas Corporation Experience August 2011 - Present
Job Sr. Manager of R&D Engineering at Invensas Corporation
Industry Semiconductors
Experience
Invensas Corporation August 2011 - Present
Pacific Northwest National Laboratory December 2008 - August 2011
AMD October 2005 - November 2008
Microelectronics Research Center, University of Texas at Austin August 2000 - August 2005
Skills
Nanotechnology, OLED, Failure Analysis, Metrology, IC, Device Design, CMOS, Fabrication, Characterization, Electronics, Cross-functional Team..., Device Physics, Semiconductors, Materials Science, Thin Films, Nanomaterials, Device Characterization, Microelectronics, Materials, Nanoparticles, Sensors, XRD, Semiconductor..., AFM, Nanofabrication, Electron Beam..., CVD, Etching, Surface, Optics, Power Management, Process Integration, FIB, Photolithography, Yield Enhancement, R&D, Spectroscopy, Metal Fabrication, Optoelectronics, Physics, Silicon, Design of Experiments, MEMS, Product Development
Education
The University of Texas at Austin 2000 — 2005
PhD, Electrical Engineering / Nanotechnology
Kansas State University 2000 — 2001
Physics
Nanjing University 1992 — 1999
M.S., B.S., Physics
Invensas Corporation August 2011 - Present
Pacific Northwest National Laboratory December 2008 - August 2011
AMD October 2005 - November 2008
Microelectronics Research Center, University of Texas at Austin August 2000 - August 2005
Skills
Nanotechnology, OLED, Failure Analysis, Metrology, IC, Device Design, CMOS, Fabrication, Characterization, Electronics, Cross-functional Team..., Device Physics, Semiconductors, Materials Science, Thin Films, Nanomaterials, Device Characterization, Microelectronics, Materials, Nanoparticles, Sensors, XRD, Semiconductor..., AFM, Nanofabrication, Electron Beam..., CVD, Etching, Surface, Optics, Power Management, Process Integration, FIB, Photolithography, Yield Enhancement, R&D, Spectroscopy, Metal Fabrication, Optoelectronics, Physics, Silicon, Design of Experiments, MEMS, Product Development
Education
The University of Texas at Austin 2000 — 2005
PhD, Electrical Engineering / Nanotechnology
Kansas State University 2000 — 2001
Physics
Nanjing University 1992 — 1999
M.S., B.S., Physics
Bongsub (Bong-Sub) Lee Bongsub (Bong-Sub) Lee's Invensas Corporation Experience March 2014 - Present
Job Senior Staff Engineer, Materials Analysis, at Invensas Corporation (Subsidiary of Tessera Technologies)
Industry Research
Experience
Invensas Corporation March 2014 - Present
Invensas Corporation June 2010 - February 2014
University of Illinois at Urbana-Champaign 2006 - 2010
Skills
Electron Microscopy, Scanning Electron..., Spectroscopy, Nanotechnology, Characterization, TEM, AFM, Thin Films, Powder X-ray Diffraction, PVD, Sputtering, Nanomaterials, Materials Science, Phase Change Materials, Electronic packaging, Semiconductors, Electronics Packaging, Optics
Education
University of Illinois at Urbana-Champaign 2000 — 2006
PhD, Materials Science & Engineering
Seoul National University 1998 — 2000
Master of Science (M.S.), Inorganic Materials Engineering
Seoul National University 1992 — 1998
Bachelor of Science (B.S.), Inorganic Materials Engineering
Invensas Corporation March 2014 - Present
Invensas Corporation June 2010 - February 2014
University of Illinois at Urbana-Champaign 2006 - 2010
Skills
Electron Microscopy, Scanning Electron..., Spectroscopy, Nanotechnology, Characterization, TEM, AFM, Thin Films, Powder X-ray Diffraction, PVD, Sputtering, Nanomaterials, Materials Science, Phase Change Materials, Electronic packaging, Semiconductors, Electronics Packaging, Optics
Education
University of Illinois at Urbana-Champaign 2000 — 2006
PhD, Materials Science & Engineering
Seoul National University 1998 — 2000
Master of Science (M.S.), Inorganic Materials Engineering
Seoul National University 1992 — 1998
Bachelor of Science (B.S.), Inorganic Materials Engineering
Nick Christensen Nick Christensen's Invensas Corporation Experience February 2012 - December 2013
Job (MBA)
Industry Management Consulting
Experience
DigitalOptics Corporation™ April 2012 - December 2013
Invensas Corporation February 2012 - December 2013
Tessera November 2009 - December 2013
Kaiser Permanente April 2008 - June 2010
National Japan February 2009 - October 2009
Texas Instruments January 2005 - January 2009
Texas Instruments November 1999 - January 2005
Toyota March 2002 - May 2002
Chevron March 2001 - July 2001
SGI January 2001 - May 2001
Skills
Access, Management, Project Management, Start-ups, JavaScript, MySQL, Business Analysis, SAP, HTML, Microsoft SQL Server, Business Strategy, Microsoft Office, Agile Methodologies, Agile Project Management, CRM, IP, Microsoft Excel, Photoshop, Illustrator, PowerPoint, PHP, Project Planning, IT Strategy, IT Management, Statistics, Healthcare, Automotive, Energy, Renewable Energy, Foundation IP, Blackduck, Ipendo, Dundas, Dundas Chart, TyMetrix, Microsoft Access, Budget, Statistical Modeling, Technology, Turn Around Management, Global Operations, Marketing, Social Media, Writing, Events Organisation, Data Analysis
Education
San Jose State University 1999 — 2003
M.B.A., Business
California State University Stanislaus 1995 — 1999
B.S., Management and Computer Information Systems
Stanford University 1998 — 1998
Coursework in statistical modeling
University of Oxford 1998 — 1998
Coursework in modern politics and statistics
Concord Law School - Kaplan University
Law
DigitalOptics Corporation™ April 2012 - December 2013
Invensas Corporation February 2012 - December 2013
Tessera November 2009 - December 2013
Kaiser Permanente April 2008 - June 2010
National Japan February 2009 - October 2009
Texas Instruments January 2005 - January 2009
Texas Instruments November 1999 - January 2005
Toyota March 2002 - May 2002
Chevron March 2001 - July 2001
SGI January 2001 - May 2001
Skills
Access, Management, Project Management, Start-ups, JavaScript, MySQL, Business Analysis, SAP, HTML, Microsoft SQL Server, Business Strategy, Microsoft Office, Agile Methodologies, Agile Project Management, CRM, IP, Microsoft Excel, Photoshop, Illustrator, PowerPoint, PHP, Project Planning, IT Strategy, IT Management, Statistics, Healthcare, Automotive, Energy, Renewable Energy, Foundation IP, Blackduck, Ipendo, Dundas, Dundas Chart, TyMetrix, Microsoft Access, Budget, Statistical Modeling, Technology, Turn Around Management, Global Operations, Marketing, Social Media, Writing, Events Organisation, Data Analysis
Education
San Jose State University 1999 — 2003
M.B.A., Business
California State University Stanislaus 1995 — 1999
B.S., Management and Computer Information Systems
Stanford University 1998 — 1998
Coursework in statistical modeling
University of Oxford 1998 — 1998
Coursework in modern politics and statistics
Concord Law School - Kaplan University
Law
Jerald Guerrero Jerald Guerrero's Invensas Corporation Experience November 2013 - Present
Job Mechanical Designer at Invensas Corporation
Industry Design
Experience
Invensas Corporation November 2013 - Present
AWS Ind. May 2012 - Present
Expertech Inc. September 2014 - December 2014
Soraa Inc. February 2011 - April 2012
Exclara Inc. May 2009 - May 2010
NanoGram Corp. February 2007 - January 2009
HOH Water Technology A/S 1982 - 1984
Skills
Solidworks, Manufacturing, Engineering, CAD, Testing, Sheet Metal, R&D, PCB design, Software Documentation, Injection Molding, Automation, Design Engineering
Education
Rio Hondo College 1981 — 1983
Associate's degree, Mechanical Engineering, 3.4
San Jose City College 1976 — 1977
Invensas Corporation November 2013 - Present
AWS Ind. May 2012 - Present
Expertech Inc. September 2014 - December 2014
Soraa Inc. February 2011 - April 2012
Exclara Inc. May 2009 - May 2010
NanoGram Corp. February 2007 - January 2009
HOH Water Technology A/S 1982 - 1984
Skills
Solidworks, Manufacturing, Engineering, CAD, Testing, Sheet Metal, R&D, PCB design, Software Documentation, Injection Molding, Automation, Design Engineering
Education
Rio Hondo College 1981 — 1983
Associate's degree, Mechanical Engineering, 3.4
San Jose City College 1976 — 1977
Ashok Prabhu's Invensas Corporation Experience September 2014 - Present
Job Director, Technical Program Management at Invensas Corporation
Industry Electrical/Electronic Manufacturing
Experience
Invensas Corporation September 2014 - Present
Northwestern Unversity 2014 - 2015
Northwestern Unversity 2014 - 2015
Texas Instruments September 2011 - September 2014
National Semiconductor June 2006 - September 2011
Skills
Semiconductors, Failure Analysis, IC, SoC, Semiconductor Industry, Product Engineering, Engineering Management, Design of Experiments, Analog, Engineering, Cross-functional Team..., Manufacturing, CMOS, Electronics, R&D, SPC, Power Management, Mixed Signal, Supplier Negotiation, Project Management, Leadership, Contract Negotiation, Technology Development, ASIC, Semiconductor Packaging, Technology Management, Materials, Program Management, Product Management, FMEA
Education
University of Maryland College Park 1989 — 1992
MS, Mechanical Engineering
Bangalore University 1987 — 1991
BE, Mechanical
Northwestern University 2014 — 2016
Master of Science (MS), Predictive Analytics
Invensas Corporation September 2014 - Present
Northwestern Unversity 2014 - 2015
Northwestern Unversity 2014 - 2015
Texas Instruments September 2011 - September 2014
National Semiconductor June 2006 - September 2011
Skills
Semiconductors, Failure Analysis, IC, SoC, Semiconductor Industry, Product Engineering, Engineering Management, Design of Experiments, Analog, Engineering, Cross-functional Team..., Manufacturing, CMOS, Electronics, R&D, SPC, Power Management, Mixed Signal, Supplier Negotiation, Project Management, Leadership, Contract Negotiation, Technology Development, ASIC, Semiconductor Packaging, Technology Management, Materials, Program Management, Product Management, FMEA
Education
University of Maryland College Park 1989 — 1992
MS, Mechanical Engineering
Bangalore University 1987 — 1991
BE, Mechanical
Northwestern University 2014 — 2016
Master of Science (MS), Predictive Analytics
Guilian Gao's Invensas Corporation Experience March 2013 - Present
Job Principal Engineer at Invensas
Industry Semiconductors
Experience
Invensas Corporation March 2013 - Present
Tessera January 2005 - March 2013
Zeevo Inc. 2002 - 2004
Stanford University 2001 - 2002
Ford Motor Company 1991 - 2001
University of Alabama December 1989 - July 1991
Skills
Materials Science, IC, Testing, Failure Analysis, Reliability, Materials, Electronics Packaging, Semiconductors, Process Simulation, Thin Films, Semiconductor Industry, Design of Experiments, Process Integration, Silicon, Manufacturing, Characterization, Product Engineering, Metrology
Education
University of Cambridge 1986 — 1989
Ph.D., Materials Science
The University of Manchester 1985 — 1986
M.S., Corrosion and Protection
Beijing University of Aeronautics and Astronautics 1980 — 1984
B.S., Materials Science and Engineering
Invensas Corporation March 2013 - Present
Tessera January 2005 - March 2013
Zeevo Inc. 2002 - 2004
Stanford University 2001 - 2002
Ford Motor Company 1991 - 2001
University of Alabama December 1989 - July 1991
Skills
Materials Science, IC, Testing, Failure Analysis, Reliability, Materials, Electronics Packaging, Semiconductors, Process Simulation, Thin Films, Semiconductor Industry, Design of Experiments, Process Integration, Silicon, Manufacturing, Characterization, Product Engineering, Metrology
Education
University of Cambridge 1986 — 1989
Ph.D., Materials Science
The University of Manchester 1985 — 1986
M.S., Corrosion and Protection
Beijing University of Aeronautics and Astronautics 1980 — 1984
B.S., Materials Science and Engineering
Dileep Goyal's Invensas Corporation Experience January 2012 - September 2012
Job Sr. Manager, Materials at Jawbone
Industry Semiconductors
Experience
Jawbone October 2012 - Present
Invensas Corporation January 2012 - September 2012
Invensas Corporation January 2011 - December 2011
Tessera April 2008 - December 2010
LNK Chemsolutions, LLC January 2007 - March 2008
University of Nebraska-Lincoln August 2004 - December 2007
Education
University of Nebraska-Lincoln 2004 — 2007
Master of Science (M.S.), Materials Science, Chemical Enginering, 3.95
Indian Institute of Technology, Bombay 2000 — 2004
Bachelor of Technology (B.Tech.), Materials Science and Engineering, 8.0/10.0
Jawbone October 2012 - Present
Invensas Corporation January 2012 - September 2012
Invensas Corporation January 2011 - December 2011
Tessera April 2008 - December 2010
LNK Chemsolutions, LLC January 2007 - March 2008
University of Nebraska-Lincoln August 2004 - December 2007
Education
University of Nebraska-Lincoln 2004 — 2007
Master of Science (M.S.), Materials Science, Chemical Enginering, 3.95
Indian Institute of Technology, Bombay 2000 — 2004
Bachelor of Technology (B.Tech.), Materials Science and Engineering, 8.0/10.0
Mason Woodford's Invensas Corporation Experience 2012 - 2014
Job
Industry Semiconductors
Experience
Ferric Semiconductor, Inc. 2014 - Present
Invensas Corporation 2012 - 2014
RTI Holdings Limited (acquired by Avnet Electronics) 2010 - October 2012
AMCC 2006 - 2009
Atheros Communications (acquired by Qualcomm) 2005 - 2006
Zettacom, Inc.(acquired by IDT) 2002 - 2004
Deutsche Bank Securities 2000 - 2001
Silicon Motion 1997 - 2000
Cirrus Logic 1992 - 1997
Everex (acquired by First International Computer) 1990 - 1992
Skills
Storage, Strategy, Product Marketing, Product Management, Business Development, Go-to-market Strategy, Strategic Partnerships, Sales Management, CRM, Sales, Semiconductors, Marketing, Competitive Analysis, Semiconductor Industry, Memory, Business Strategy, Licensing, Asian Business, Contract Negotiation, Semiconductor Packaging, Electronics Packaging, International Sales, Asian markets, Network Processors, Wireless Networking, IC, Start-ups, Business Alliances
Education
Dartmouth College - The Tuck School of Business at Dartmouth
MBA
University of California, Berkeley
Bachelor of Science
Ferric Semiconductor, Inc. 2014 - Present
Invensas Corporation 2012 - 2014
RTI Holdings Limited (acquired by Avnet Electronics) 2010 - October 2012
AMCC 2006 - 2009
Atheros Communications (acquired by Qualcomm) 2005 - 2006
Zettacom, Inc.(acquired by IDT) 2002 - 2004
Deutsche Bank Securities 2000 - 2001
Silicon Motion 1997 - 2000
Cirrus Logic 1992 - 1997
Everex (acquired by First International Computer) 1990 - 1992
Skills
Storage, Strategy, Product Marketing, Product Management, Business Development, Go-to-market Strategy, Strategic Partnerships, Sales Management, CRM, Sales, Semiconductors, Marketing, Competitive Analysis, Semiconductor Industry, Memory, Business Strategy, Licensing, Asian Business, Contract Negotiation, Semiconductor Packaging, Electronics Packaging, International Sales, Asian markets, Network Processors, Wireless Networking, IC, Start-ups, Business Alliances
Education
Dartmouth College - The Tuck School of Business at Dartmouth
MBA
University of California, Berkeley
Bachelor of Science
Akash Agrawal's Invensas Corporation Experience June 2014 - Present
Job Sr. Mechanical Simulation Engineer at Invensas Corporation
Industry Mechanical or Industrial Engineering
Experience
Invensas Corporation June 2014 - Present
Micron Technology June 2011 - June 2014
Microsoft February 2010 - May 2011
Integrated Electronics Engineering Center January 2007 - December 2009
Honda Motor Co., Ltd. July 2004 - April 2006
Skills
Finite Element Analysis, Simulations, ANSYS, Pro Engineer, Matlab, Solidworks, Engineering, Labview, Mechanical Engineering, Abaqus, Design for Manufacturing, FMEA, CAE, Minitab, Reliability Engineering, CFD, Manufacturing, AutoCAD, Electronics, Failure Analysis, Characterization, Design of Experiments, PCB design, Numerical Analysis, Root Cause Analysis, Reliability, R&D, Engineering Management, Thermal, Modeling, Product Development, MEMS
Education
Binghamton University 2007 — 2009
M.S, Mechanical Engineering; Solid Mechanics
SUNY Binghamton 2007 — 2009
Master of Science (MS), Mechanical Engineering
Invensas Corporation June 2014 - Present
Micron Technology June 2011 - June 2014
Microsoft February 2010 - May 2011
Integrated Electronics Engineering Center January 2007 - December 2009
Honda Motor Co., Ltd. July 2004 - April 2006
Skills
Finite Element Analysis, Simulations, ANSYS, Pro Engineer, Matlab, Solidworks, Engineering, Labview, Mechanical Engineering, Abaqus, Design for Manufacturing, FMEA, CAE, Minitab, Reliability Engineering, CFD, Manufacturing, AutoCAD, Electronics, Failure Analysis, Characterization, Design of Experiments, PCB design, Numerical Analysis, Root Cause Analysis, Reliability, R&D, Engineering Management, Thermal, Modeling, Product Development, MEMS
Education
Binghamton University 2007 — 2009
M.S, Mechanical Engineering; Solid Mechanics
SUNY Binghamton 2007 — 2009
Master of Science (MS), Mechanical Engineering
Reynaldo Co's Invensas Corporation Experience April 2011 - Present
Job Director, Mobile Technology Development at Invensas Corporation
Industry Semiconductors
Experience
Invensas Corporation April 2011 - Present
Tessera Technologies Inc September 2010 - March 2011
Vertical Circuits Inc June 2007 - June 2010
Amkor Technology Philippines August 2003 - June 2007
Advanced Interconnect Technologies (Hong Kong) June 1996 - May 2003
Swire Technologies Ltd (Hong Kong) November 1990 - June 1996
Intel Philippines April 1984 - November 1990
Skills
Strategy, Product Development, Engineering, Manufacturing, Mixed Signal, Program Management, IC, SPC, Design of Experiments, Semiconductor Industry, Electronics, Semiconductors, Failure Analysis, Engineering Management, FMEA, Process Engineering
Education
Mapua Institute of Technology 1979 — 1983
BSME, Mechanical Engineering
Invensas Corporation April 2011 - Present
Tessera Technologies Inc September 2010 - March 2011
Vertical Circuits Inc June 2007 - June 2010
Amkor Technology Philippines August 2003 - June 2007
Advanced Interconnect Technologies (Hong Kong) June 1996 - May 2003
Swire Technologies Ltd (Hong Kong) November 1990 - June 1996
Intel Philippines April 1984 - November 1990
Skills
Strategy, Product Development, Engineering, Manufacturing, Mixed Signal, Program Management, IC, SPC, Design of Experiments, Semiconductor Industry, Electronics, Semiconductors, Failure Analysis, Engineering Management, FMEA, Process Engineering
Education
Mapua Institute of Technology 1979 — 1983
BSME, Mechanical Engineering
Roseann Alatorre's Invensas Corporation Experience April 2011 - Present
Job Process Development Engineer at Invensas Corporation
Industry Semiconductors
Experience
Invensas Corporation April 2011 - Present
Tessera November 2009 - April 2011
Skills
R&D, Design of Experiments, Semiconductors, Failure Analysis, Semiconductor Industry, Wire Bonding, Flip Chip, Die Attach, IC, Metrology, Data Analysis, Vendor Relationships, Statistical Data..., Inventory Control, Document Management, Process Engineering, Engineering, Characterization, Electronics
Education
University of California, Davis 2006 — 2008
B.S., Biological Sciences
Invensas Corporation April 2011 - Present
Tessera November 2009 - April 2011
Skills
R&D, Design of Experiments, Semiconductors, Failure Analysis, Semiconductor Industry, Wire Bonding, Flip Chip, Die Attach, IC, Metrology, Data Analysis, Vendor Relationships, Statistical Data..., Inventory Control, Document Management, Process Engineering, Engineering, Characterization, Electronics
Education
University of California, Davis 2006 — 2008
B.S., Biological Sciences
Deloitte
PwC
Ernst & Young
Walgreens
Procter & Gamble
KPMG
PricewaterhouseCoopers
EY