STATS ChipPAC Ltd.
Industry: Company
DescriptionCEO: Byeong Joon Han (Aug 2015–) Founded: 1994 Parent organization: Jiangsu Changjiang Electronics Tech Co Subsidiaries: Stats Chippac Malaysia Sdn. Bhd,
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STATS ChipPAC Ltd. Employees
STATS ChipPAC Ltd. September 2015 - Present
KLA-Tencor October 2013 - September 2015
KLA-Tencor 2012 - 2013
ICOS Division- KLA-Tencor 2010 - 2012
KLA-Tencor 2005 - 2010
KLA-Tencor 1999 - 2005
Thermax Ltd. 1996 - 1997
Skills
Semiconductors, Product Marketing, Semiconductor Industry, Product Development, Product Management, Cross-functional Team..., Product Lifecycle..., Engineering Management, Business Strategy, Competitive Analysis, Management, R&D, IC, Product Launch, Program Management, Marketing, Go-to-market Strategy, Leadership, Electronics, Process Simulation, Market Analysis, Design of Experiments, Thin Films, Failure Analysis, Metrology, Engineering, SPC, Optics, Characterization, Strategic Planning, Strategic Partnerships, Business Alliances, Silicon, Marketing Strategy, Project Management, Product Engineering, New Business Development, Integration, Materials Science, Technical Marketing, Market Research, Pricing, FMEA, Process Improvement, Corporate Development, Business Planning, Business Analysis, Team Leadership
Education
Santa Clara University - Leavey School of Business
Master of Business Administration (MBA)
Louisiana State University
Indian Institute of Technology, Bombay
Taglio Salon Sales & Payroll CoordinatorStarwood Hotels & Resorts Worldwide, Inc.2007 - 2010
STATS ChipPAC Ltd. January 2006 - February 2007
Skills
Hair Care, Beauty Industry, Customer Service, Advertising
Education
Arizona State University 2001 — 2005
Bachelor of Science (BS), Marketing
Arizona State University - W. P. Carey School of Business 2001 — 2005
Bachelor's degree, Marketing
Kohler Academy
Cosmetology/Cosmetologist, General
STATS ChipPAC Ltd. February 2015 - Present
Global Technology Associates August 2014 - January 2015
ARRIS April 2014 - July 2014
Tech Mahindra July 2012 - March 2014
Alcatel-Lucent March 2012 - June 2012
Skills
•Cisco Router..., •Cisco Switch..., •Cisco Nexus..., •Load Balancers:..., •Routing Protocols:..., •L2 Protocols: VTP,..., •Switching: VLANs,..., •Redundancy Protocols:..., •Cisco Firewalls :..., •Network Management:..., •Servers: FTP,..., •Documentation: MS..., •WLAN Technologies..., •WAN Technologies ..., •Operating Systems :..., IP, Wireless
Education
Southern Methodist University 2010 — 2011
Master of Science, Telecommunications
L-com Global Connectivity January 2012 - January 2015
McCue Corporation August 2008 - June 2011
McCue Corporation January 2007 - July 2008
STATS ChipPAC Ltd. July 1999 - April 2006
M/A-COM Technology Solutions June 1994 - September 1998
Skills
Sales Operations, Management, Business Development, Sales, Customer Satisfaction, Customer Service, Forecasting, Budgets, New Business Development, Account Management, Direct Sales, Negotiation, Contract Negotiation, Sales Process, Salesforce.com, Team Building, Cross-functional Team..., CRM, B2B, Sales Presentations
Education
Merrimack College
B.S. Business Management, Business, Management, Marketing, and Related Support Services
UMass Lowell
B.S. Information Systems, Information Technology
STATS ChipPAC Ltd. 2015 - Present
National Center for Advanced Packaging Co., LTD. (NCAP China) 2012 - 2015
Institute of Microelectronics (IME), Chinese Academy of Sciences 2012 - 2015
Akrometrix January 2012 - December 2012
Flextronics International 2001 - 2012
Ford / Visteon August 1991 - May 2001
Ford August 1991 - May 2001
Skills
Engineering Management, Cleantech, Design for Manufacturing, Solar PV, Sustainability, Reliability Engineering, Electronics..., Elecrtonics Packaging, Advanced Materials, Technology Management, Environmental Technology, Automotive Electronics, Manufacturing, Packaging, PCB design, Green Technology, Electronics, Reliability, Innovation Management, Lean Manufacturing, Semiconductors, Failure Analysis, Continuous Improvement, Supplier Quality, Design of Experiments, IC, Engineering, Six Sigma, Materials, Renewable Energy, SPC, Manufacturing..., R&D, Quality Management, Root Cause Analysis, Product Development, Cross-functional Team..., Semiconductor Industry, Sensors, Manufacturing..., Simulations, Embedded Systems, FMEA, Process Engineering, Electrical Engineering, Operational Excellence, Manufacturing Operations, Process Simulation, DMAIC, PCB Design
Education
University of Oxford 1985 — 1989
Ph.D., Materials
San Jose State University 2001 — 2003
MBA, Business Administration
Tsinghua University
B.Sc., Mechanical Engineering
STATS ChipPAC Ltd. September 2011 - Present
Micron Technology June 2007 - September 2011
Intel Corporation April 2005 - May 2007
Skills
Product Management, Project Management, Semiconductors, Cross-functional Team..., Competitive Analysis, Pricing, Product Development, Product Engineering, Business Strategy, Product Planning, Program Management, Pricing Strategy, Product Requirements
Education
Universiti Teknologi Malaysia 2000 — 2005
Bachelors’ Degree, Engineering (Electrical-Electronic)
Yardi July 2015 - Present
Distributed Systems Lab January 2015 - April 2015
Procore March 2014 - January 2015
STATS ChipPAC Ltd. June 2012 - August 2012
Skills
Social Media, HTML, JavaScript, CSS, Ruby on Rails, Testing, Scripting, Java
Education
University of California, Santa Barbara 2011 — 2015
Bachelor of Engineering (B.E.), Computer Science, 3.84
El Camino Real High School
STATS ChipPAC Ltd. April 2003 - Present
Motorola January 2000 - January 2002
Motorola January 1995 - January 2000
Motorola January 1990 - January 1995
Motorola January 1984 - January 1990
Motorola January 1981 - January 1984
Skills
Project management,..., Semiconductors, Manufacturing, Product Development, Product Engineering, Program Management, Management, Engineering, Project Management, Package Engineering
Education
The University of Texas at Austin
Mechanical Engineering
University of Saigon, Saigon, Vietnam
Architectural Engineering
Advanced Semiconductor Engineering, Inc. May 2013 - January 2014
STATS ChipPAC Ltd. November 2011 - April 2013
Skills
Microsoft Office, Microsoft Excel, Customer Service, Microsoft Word, PowerPoint, Research, Project Management, Strategic Planning
Education
Indiana State University 2003 — 2007
Master's Degree, Mathematics and Computer Science
Kaohsiung Medical University 1996 — 2000
Bachelor’s Degree, Psychology
Lattice Semiconductor March 2015 - Present
Silicon Image November 2013 - Present
Silicon Image Inc August 2009 - November 2014
Silicon Image Inc August 2004 - August 2009
Cirrus Logic Inc 2000 - 2004
STATS ChipPAC Ltd. June 1998 - July 2000
SPEL September 1995 - June 2000
Skills
Testing, Semiconductors, Debugging, IC, Electronics, SoC, ASIC, Analog, C, Mixed Signal
Education
Government College of Technology , Coimbatore, India 1989 — 1993
Engineer's Degree, Electrical, Electronics and Communications Engineering
Accenture January 2011 - Present
Prosum IT solutions November 2009 - December 2010
Edutech India Pvt Ltd July 2008 - November 2009
STATS ChipPAC Ltd. May 2006 - May 2008
Skills
SAP MM, SAP Warehouse Management, SAP decentral WM, HPALM, Change Management, Vendor Management, SAP Implementation, SAP Testing, SAP Supply Chain, SAP Application..., SAP ALE, Logistics Management, Unit Testing, Business Process, Integration, Requirements Analysis, SAP ERP
Education
Manonmaniam Sundaranar University 2001 — 2005
Bachelor’s Degree, Computer Engineering
Maxim Integrated August 2012 - Present
Maxim Integrated June 2006 - August 2012
ALLVIA, Inc. August 2005 - June 2006
Ablestik Laboratories November 2004 - June 2005
STATS ChipPAC Ltd. September 2002 - October 2004
Advanpack Solutions Pte Ltd August 1997 - September 2002
Skills
IC packaging, IC, Semiconductors, Mixed Signal, Semiconductor Industry, SoC, Silicon, CMOS
Education
National University of Singapore 1995 — 1999
Doctor of Philosophy (Ph.D.), Surface Science in Chemical Engineering
Dalian University of Technology 1984 — 1991
Master's Degree, Polymer Science in Chemical Engineering
Pacific Coast Well Drilling September 2015 - Present
Droney & Associates, Inc. September 2009 - Present
STATS ChipPAC Ltd. April 2004 - September 2009
Skills
Project Management, Process Improvement, Business Process..., Business Application..., CAD, Vectorworks, SolidWorks, Visio, BPMN, Microsoft Project, MRP, Lean Manufacturing
Education
California Polytechnic State University-San Luis Obispo 1999 — 2003
Bachelor of Science (B.S.), Industrial Engineering
DoorDash July 2015 - Present
Aqui July 2014 - June 2015
Bella Bella Salon November 2013 - July 2014
Le Boulanger November 2011 - October 2013
STATS ChipPAC Ltd. April 2010 - September 2011
Education
De Anza College 2012 — 2016