Hermes Microvision Inc.
Industry: Company
DescriptionFounded: 1998 Parent organization: ASML Holding Subsidiaries: Hermes Microvision Co., Ltd. (Beijing), Hermes Microvision, Inc. (USA), HMI Holdings, Inc.FeedbackDisclaimer Claim this knowledge panel Knowledge ResultSee photos Moved, closed, or was never hereReportHermes Microvision IncDirections Saved (0) Saved Save 3 Google reviews Manufacturer in San Jose, California Address: 1762 Automation Pkwy, San Jose, CA 95131 Phone: (408) 597-8689: : Place name: Category: Hours: : Website: : : : Category: Manufacturer Suggest an editUnable to add this file. Please check that it is a valid photo. Unable to add this file. Please check that it is a valid photo. · Own this business?Add missing informationAdd business hours Unable to add this file. Please check that it is a valid photo. Add website Unable to add this file. Please check that it is a valid photo. Questions & answers Ask a questionBe the first to ask a question Add a photoThanks for sharing!Your photo will be posted publicly on Google.Contribute MoreDoneUpload public photos of Hermes Microvision Inc Posting publicly on the Web Write a review Reviews 3 Google reviews
Hermes Microvision Inc. List of Employees There's an exhaustive list of past and present employees! Get comprehensive information on the number of employees at Hermes Microvision Inc.. You can filter them based on skills, years of employment, job, education, department, and prior employment.
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Hermes Microvision Inc. Employees
Employee
Years
Job
Industry
Ivy Wu Ivy Wu's Hermes Microvision Inc. Experience September 2014 - Present
Job Application Engineer at Hermes Microvision Inc.
Industry Electrical/Electronic Manufacturing
Experience
Hermes Microvision Inc. September 2014 - Present
Optimal IT January 2014 - September 2014
Center for High Rate Nanomanufacturing (CHN) – Univ. of Massachusetts Lowell September 2009 - August 2013
Skills
AFM, Scanning Electron..., Nanotechnology, MEMS, Characterization, Nanomaterials, Photolithography, Thin Films, Materials Science, Raman Microscopy, Sputter Deposition, COMSOL, Spectroscopy, Physics, Electrochemistry, Mathematica, Solidworks, FTIR, Labview, Matlab, Clean Rooms, IR, Ellipsometry, Spin Coating, CVD, C++ Language, Fortran 95, Wet Chemical Etching, Rheology, Nanocomposites, ATR-FTIR, Methodology, Depositions, Thin Film Coating, Thin Film..., Powder X-ray Diffraction, PVD
Education
University of Massachusetts Lowell
Doctor of Philosophy (Ph.D.), Physics
National Cheng Kung University
Bachelor's degree, Physics
Hermes Microvision Inc. September 2014 - Present
Optimal IT January 2014 - September 2014
Center for High Rate Nanomanufacturing (CHN) – Univ. of Massachusetts Lowell September 2009 - August 2013
Skills
AFM, Scanning Electron..., Nanotechnology, MEMS, Characterization, Nanomaterials, Photolithography, Thin Films, Materials Science, Raman Microscopy, Sputter Deposition, COMSOL, Spectroscopy, Physics, Electrochemistry, Mathematica, Solidworks, FTIR, Labview, Matlab, Clean Rooms, IR, Ellipsometry, Spin Coating, CVD, C++ Language, Fortran 95, Wet Chemical Etching, Rheology, Nanocomposites, ATR-FTIR, Methodology, Depositions, Thin Film Coating, Thin Film..., Powder X-ray Diffraction, PVD
Education
University of Massachusetts Lowell
Doctor of Philosophy (Ph.D.), Physics
National Cheng Kung University
Bachelor's degree, Physics
Fei Wang, MBA Fei Wang, MBA's Hermes Microvision Inc. Experience October 2014 - Present
Job Product Marketing Manager at HermesMicrovision, Inc.
Industry Semiconductors
Experience
Hermes-Microvision, Inc. October 2014 - Present
Hermes Microvision Inc. June 2013 - October 2014
Hermes Microvision Inc. February 2012 - June 2013
Hermes Microvision Inc. October 2007 - February 2012
Lam Research June 2006 - October 2007
Skills
Semiconductor Industry, Semiconductor..., CMOS, Scanning Electron..., SEM, Defect, Wafer Fab, Project Management, MS Project, Inspection, Metrology, Semiconductors, Lithography, Yield, Simulations, Failure Analysis, Electronics, Process Simulation, Materials Science, Thin Films
Education
San Jose State University 2010 — 2012
Master, MBA
Tsinghua University 2003 — 2006
Master, Electrical and Electronics Engineering
Tsinghua University 1999 — 2003
BS, Materials Science & Engineering
Hermes-Microvision, Inc. October 2014 - Present
Hermes Microvision Inc. June 2013 - October 2014
Hermes Microvision Inc. February 2012 - June 2013
Hermes Microvision Inc. October 2007 - February 2012
Lam Research June 2006 - October 2007
Skills
Semiconductor Industry, Semiconductor..., CMOS, Scanning Electron..., SEM, Defect, Wafer Fab, Project Management, MS Project, Inspection, Metrology, Semiconductors, Lithography, Yield, Simulations, Failure Analysis, Electronics, Process Simulation, Materials Science, Thin Films
Education
San Jose State University 2010 — 2012
Master, MBA
Tsinghua University 2003 — 2006
Master, Electrical and Electronics Engineering
Tsinghua University 1999 — 2003
BS, Materials Science & Engineering
Ji Wang Ji Wang's Hermes Microvision Inc. Experience September 2013 - Present
Job System Integration Engineer at Hermes Microvision, Inc
Industry Mechanical or Industrial Engineering
Experience
Hermes Microvision, Inc September 2013 - Present
Rockefeller University May 2013 - August 2013
Columbia University Robotics Lab September 2012 - January 2013
Columbia University -- Lehman Library May 2012 - December 2012
shenhua group August 2010 - June 2011
Skills
PCB design, Siemens S7-200, PLC Programming, Mechanical Testing, Python, C/C++, ArcGIS, Altium Designer, Multisim, Control Systems Design, Filter Design, Real time control, NI LabVIEW, COMSOL, Mechatronics, Microcontrollers
Education
Columbia University - Fu Foundation School of Engineering and Applied Science 2011 — 2012
Master of Science (M.S.), Mechanical Engineering, 3.8/4.0
Zhejiang Sci-Tech University 2007 — 2011
Bachelor of Engineering (BE), Measurement, Control and Instrumentation, 90.1/100
Hermes Microvision, Inc September 2013 - Present
Rockefeller University May 2013 - August 2013
Columbia University Robotics Lab September 2012 - January 2013
Columbia University -- Lehman Library May 2012 - December 2012
shenhua group August 2010 - June 2011
Skills
PCB design, Siemens S7-200, PLC Programming, Mechanical Testing, Python, C/C++, ArcGIS, Altium Designer, Multisim, Control Systems Design, Filter Design, Real time control, NI LabVIEW, COMSOL, Mechatronics, Microcontrollers
Education
Columbia University - Fu Foundation School of Engineering and Applied Science 2011 — 2012
Master of Science (M.S.), Mechanical Engineering, 3.8/4.0
Zhejiang Sci-Tech University 2007 — 2011
Bachelor of Engineering (BE), Measurement, Control and Instrumentation, 90.1/100
Ying Luo Ying Luo's Hermes Microvision Inc. Experience May 2014 - Present
Job Project Manager at HermesMicrovision Inc.
Industry Industrial Automation
Experience
Hermes-Microvision, Inc. May 2014 - Present
Hermes-Microvision, Inc. January 2012 - April 2014
Samsung Information Systems America May 2010 - December 2011
Utah State University September 2009 - May 2010
Skills
Control Algorithms, Motion Controls, Vibration Controls, Signal Processing, Embedded Systems, Project Management, Matlab/Simulink, DSP, FPGA, C, VHDL, ARM, Linux, EtherCAT, Fractional Order
Education
South China University of Technology 2004 — 2009
Doctor of Philosophy (Ph.D.), Department of Automation Science and Engineering
Utah State University 2007 — 2009
Ph.D in Joint Program, Department of Electrical & Computer Engineering
Hermes-Microvision, Inc. May 2014 - Present
Hermes-Microvision, Inc. January 2012 - April 2014
Samsung Information Systems America May 2010 - December 2011
Utah State University September 2009 - May 2010
Skills
Control Algorithms, Motion Controls, Vibration Controls, Signal Processing, Embedded Systems, Project Management, Matlab/Simulink, DSP, FPGA, C, VHDL, ARM, Linux, EtherCAT, Fractional Order
Education
South China University of Technology 2004 — 2009
Doctor of Philosophy (Ph.D.), Department of Automation Science and Engineering
Utah State University 2007 — 2009
Ph.D in Joint Program, Department of Electrical & Computer Engineering
Yueh-Ling Hsieh Yueh-Ling Hsieh's Hermes Microvision Inc. Experience August 2014 - Present
Job Application Engineer at Hermesmicrovision
Industry Nanotechnology
Experience
Hermes Microvision Inc August 2014 - Present
University of Florida April 2013 - July 2014
China Ecotek Corp March 2012 - July 2012
ITRI October 2010 - January 2011
Air Defense Artillery (ADA), ROC Army, October 2009 - September 2010
Education
University of Florida 2012 — 2014
Master's degree, Materials Science and Engineering
National Tsing Hua University 2005 — 2009
Bachelor's degree, Materials Science and Engineering
Hermes Microvision Inc August 2014 - Present
University of Florida April 2013 - July 2014
China Ecotek Corp March 2012 - July 2012
ITRI October 2010 - January 2011
Air Defense Artillery (ADA), ROC Army, October 2009 - September 2010
Education
University of Florida 2012 — 2014
Master's degree, Materials Science and Engineering
National Tsing Hua University 2005 — 2009
Bachelor's degree, Materials Science and Engineering
Jing Li Jing Li's Hermes Microvision Inc. Experience January 2012 - July 2012
Job Data Analyst at Drawbridge Inc.
Industry Information Technology and Services
Experience
Drawbridge Inc. April 2015 - Present
Drawbridge, Inc. March 2014 - March 2015
Esurance October 2013 - January 2014
Google July 2012 - July 2013
Hermes Microvision Inc. January 2012 - July 2012
Skills
SQL, Business Intelligence, Python, Shell Scripting, Online Advertising, Excel, Apache Pig, Hive, Java, Microsoft Excel, C, Data Mining, Testing
Education
State University of New York at Buffalo 2009 — 2011
Master in Science, Electrical Engineering
Huazhong University of Science and Technology 2004 — 2008
Bachelor in Science, Telecommunication Engineering
Drawbridge Inc. April 2015 - Present
Drawbridge, Inc. March 2014 - March 2015
Esurance October 2013 - January 2014
Google July 2012 - July 2013
Hermes Microvision Inc. January 2012 - July 2012
Skills
SQL, Business Intelligence, Python, Shell Scripting, Online Advertising, Excel, Apache Pig, Hive, Java, Microsoft Excel, C, Data Mining, Testing
Education
State University of New York at Buffalo 2009 — 2011
Master in Science, Electrical Engineering
Huazhong University of Science and Technology 2004 — 2008
Bachelor in Science, Telecommunication Engineering
Gaochao Wang's Hermes Microvision Inc. Experience January 2015 - Present
Job Application Engineer at Hermes Microvision, Inc
Industry Semiconductors
Experience
Hermes-Microvision, Inc. January 2015 - Present
Hermes Microvision, Inc September 2014 - December 2014
College of Nanoscale Science and Engineering October 2012 - May 2014
Tulane University August 2010 - May 2012
Skills
Nanofabrication, Nanotechnology, Device physics, Physics, Scanning Electron..., Characterization, Design of Experiments, Photolithography, Semiconductor Device, Matlab, CVD, Electronics, Ion Implantation, PPMS, Floating Zone Furnace, RBS, XPS, EDS, RTP, Probe Station, XRD, SRIM, Mask Design, Wet Clean, E-beam Evaporation, Powder X-ray Diffraction, PVD, Materials Science
Education
State University of New York at Albany 2012 — 2014
Master of Science (MS), Nanoscale Engineering
Tulane University 2010 — 2012
Master of Science (MS), Physics
Beijing Normal University 2006 — 2010
Bachelor of Science (BS), Physics
Hermes-Microvision, Inc. January 2015 - Present
Hermes Microvision, Inc September 2014 - December 2014
College of Nanoscale Science and Engineering October 2012 - May 2014
Tulane University August 2010 - May 2012
Skills
Nanofabrication, Nanotechnology, Device physics, Physics, Scanning Electron..., Characterization, Design of Experiments, Photolithography, Semiconductor Device, Matlab, CVD, Electronics, Ion Implantation, PPMS, Floating Zone Furnace, RBS, XPS, EDS, RTP, Probe Station, XRD, SRIM, Mask Design, Wet Clean, E-beam Evaporation, Powder X-ray Diffraction, PVD, Materials Science
Education
State University of New York at Albany 2012 — 2014
Master of Science (MS), Nanoscale Engineering
Tulane University 2010 — 2012
Master of Science (MS), Physics
Beijing Normal University 2006 — 2010
Bachelor of Science (BS), Physics
Derek(Hoyoung) Kim Derek(Hoyoung) Kim's Hermes Microvision Inc. Experience December 2012 - Present
Job EBeam Application / Semiconductor Industry Marketing / Semiconductor Process Engineer
Industry Computer Hardware
Experience
Hermes-Microvision, Inc. December 2012 - Present
The University of Texas at San Antonio August 2011 - December 2011
SAMSUNG Electronics, Semiconductor Division, / South Korea May 2006 - October 2008
SAMSUNG Electronics, Semiconductor Division/ South Korea July 2000 - April 2006
75th Division, South Korean Army March 1998 - June 2000
Skills
C++, Verilog, Perl Script, Unix Shell Scripting, Cadence Encounter, Xilinx ISE, Hspice, Magic, ModelSim, VTune, Minitab, Windows, Linux, Pinnacle Studio, Scanning Electron..., English, Korean, Six Sigma Green Belt, SPICE, Cadence, IC, Perl
Education
The University of Texas at San Antonio 2010 — 2012
Master of Science (MS), Electrical and Electronics Engineering
Hermes-Microvision, Inc. December 2012 - Present
The University of Texas at San Antonio August 2011 - December 2011
SAMSUNG Electronics, Semiconductor Division, / South Korea May 2006 - October 2008
SAMSUNG Electronics, Semiconductor Division/ South Korea July 2000 - April 2006
75th Division, South Korean Army March 1998 - June 2000
Skills
C++, Verilog, Perl Script, Unix Shell Scripting, Cadence Encounter, Xilinx ISE, Hspice, Magic, ModelSim, VTune, Minitab, Windows, Linux, Pinnacle Studio, Scanning Electron..., English, Korean, Six Sigma Green Belt, SPICE, Cadence, IC, Perl
Education
The University of Texas at San Antonio 2010 — 2012
Master of Science (MS), Electrical and Electronics Engineering
IHung Ting IHung Ting's Hermes Microvision Inc. Experience July 2013 - Present
Job System Engineer at HermesMicrovision Inc.
Industry Electrical/Electronic Manufacturing
Experience
Hermes-Microvision Inc. July 2013 - Present
Hermes-Microvision Inc. August 2012 - July 2013
University of Pittsburgh July 2011 - May 2012
National Cheng Kung University February 2008 - June 2009
Skills
Optics, Systems Engineering, Zemax, Design for Manufacturing, TFCalc, Manufacturing, Openfiler, Test Equipment, vacuum system, SEM, Laser, Design of Experiments, C, C++, SigmaPlot, Original, BWSpec, Differentiators, Amplifiers, Matlab, Depositions, Annealing, Surface Defect..., Laser Physics, CCD, Oscilloscope, Semiconductors, Materials, Nanomaterials, Nanotechnology, Field Emission..., STM, Electronics, Power Electronics, Inspection, Camera, laser camera, System Integrators
Education
UC Irvine, Extension 2014 — 2015
Optics/Optical Sciences
University of Pittsburgh 2010 — 2012
Master of Science, Electrical Engineering, 3.9
National Cheng Kung University 2005 — 2009
B.S., Physics
Hermes-Microvision Inc. July 2013 - Present
Hermes-Microvision Inc. August 2012 - July 2013
University of Pittsburgh July 2011 - May 2012
National Cheng Kung University February 2008 - June 2009
Skills
Optics, Systems Engineering, Zemax, Design for Manufacturing, TFCalc, Manufacturing, Openfiler, Test Equipment, vacuum system, SEM, Laser, Design of Experiments, C, C++, SigmaPlot, Original, BWSpec, Differentiators, Amplifiers, Matlab, Depositions, Annealing, Surface Defect..., Laser Physics, CCD, Oscilloscope, Semiconductors, Materials, Nanomaterials, Nanotechnology, Field Emission..., STM, Electronics, Power Electronics, Inspection, Camera, laser camera, System Integrators
Education
UC Irvine, Extension 2014 — 2015
Optics/Optical Sciences
University of Pittsburgh 2010 — 2012
Master of Science, Electrical Engineering, 3.9
National Cheng Kung University 2005 — 2009
B.S., Physics
Nathan Keech Nathan Keech's Hermes Microvision Inc. Experience July 2014 - Present
Job Senior Applications Engineer at Hermes Microvision
Industry Nanotechnology
Experience
Hermes Microvision Inc. July 2014 - Present
Hermes Microvision Inc. October 2012 - July 2014
Intel May 2008 - December 2011
Technical University of Berlin and Fraunhofer Institute September 2007 - April 2008
Microstar Laborotories February 2007 - August 2007
Skills
Scanning Electron..., Nanotechnology, Programming (Java, C#,..., Thin Films, Semiconductor Industry, Etching, AFM, Semiconductors, SPC, Materials Science, JMP, Java, Lean Manufacturing, Characterization, Nanomaterials, Design of Experiments, Dry Etch, Nanofabrication, Prototype, Data Analysis, MEMS, Metrology, Continuous Improvement, Semiconductor Process, Polymers, CVD, Powder X-ray Diffraction, LabVIEW, PVD, Sputtering, Wet Chemical Etching, SEM, Proposal Writing, Lithography, Mathematics, Intellectual Property, Nano, Carbon Nanotubes, Defect Elimination, Microfabrication, Plasma Etch, Linux System..., Customer Relations
Education
Arizona State University 2010 — 2012
Professional Science Masters, Nanoscience
University of Washington 2002 — 2007
Bachelors, Materials Science Engineering
Hermes Microvision Inc. July 2014 - Present
Hermes Microvision Inc. October 2012 - July 2014
Intel May 2008 - December 2011
Technical University of Berlin and Fraunhofer Institute September 2007 - April 2008
Microstar Laborotories February 2007 - August 2007
Skills
Scanning Electron..., Nanotechnology, Programming (Java, C#,..., Thin Films, Semiconductor Industry, Etching, AFM, Semiconductors, SPC, Materials Science, JMP, Java, Lean Manufacturing, Characterization, Nanomaterials, Design of Experiments, Dry Etch, Nanofabrication, Prototype, Data Analysis, MEMS, Metrology, Continuous Improvement, Semiconductor Process, Polymers, CVD, Powder X-ray Diffraction, LabVIEW, PVD, Sputtering, Wet Chemical Etching, SEM, Proposal Writing, Lithography, Mathematics, Intellectual Property, Nano, Carbon Nanotubes, Defect Elimination, Microfabrication, Plasma Etch, Linux System..., Customer Relations
Education
Arizona State University 2010 — 2012
Professional Science Masters, Nanoscience
University of Washington 2002 — 2007
Bachelors, Materials Science Engineering
Tingyu (Grace) Wei Tingyu (Grace) Wei's Hermes Microvision Inc. Experience June 2015 - Present
Job Sr. Material Planner at Hermes Microvision
Industry Electrical/Electronic Manufacturing
Experience
Hermes-Microvision, Inc. June 2015 - Present
Foxconn San Jose January 2015 - June 2015
Hon Hai Logistics (Foxconn) March 2012 - January 2015
One Planet July 2011 - October 2011
Marcellus Shale, PA, USA March 2011 - April 2011
BNY Mellon February 2011 - April 2011
Travel Industry September 2010 - November 2010
China National Cereals, Oils and Foods Cooperation (COFCO), Beijing, China January 2005 - May 2008
Beijing Today, Beijing Youth Daily Corp., China March 2004 - March 2005
Ningbo Wanli Univ., China July 2000 - July 2002
Skills
Supply Chain Management, Six Sigma, Market Research, New Business Development, Simulation, Financial Modeling, Customer Relations, English, Forecasting, Marketing Management, Mandarin, Excel, Microsoft Excel, Simulations, Marketing, Marketing Strategy, Customer Service, Product Development, Strategy, Analysis, Competitive Analysis, Cross-functional Team..., Business Planning, Business Development, CRM, Management, Supply Chain, Procurement, Project Planning, Vendor Management, Leadership, SAP, Budgets, Lean Manufacturing, Sourcing, Logistics, Purchasing, B2B, Sales, Operations Management, International Business
Education
University of Pittsburgh - Joseph M. Katz Graduate School of Business 2010 — 2011
Master of Business Administration (MBA)
Beijing Foreign Studies University 2003 — 2005
MA
Henan University of Science and Technology 1996 — 2000
BA
Hermes-Microvision, Inc. June 2015 - Present
Foxconn San Jose January 2015 - June 2015
Hon Hai Logistics (Foxconn) March 2012 - January 2015
One Planet July 2011 - October 2011
Marcellus Shale, PA, USA March 2011 - April 2011
BNY Mellon February 2011 - April 2011
Travel Industry September 2010 - November 2010
China National Cereals, Oils and Foods Cooperation (COFCO), Beijing, China January 2005 - May 2008
Beijing Today, Beijing Youth Daily Corp., China March 2004 - March 2005
Ningbo Wanli Univ., China July 2000 - July 2002
Skills
Supply Chain Management, Six Sigma, Market Research, New Business Development, Simulation, Financial Modeling, Customer Relations, English, Forecasting, Marketing Management, Mandarin, Excel, Microsoft Excel, Simulations, Marketing, Marketing Strategy, Customer Service, Product Development, Strategy, Analysis, Competitive Analysis, Cross-functional Team..., Business Planning, Business Development, CRM, Management, Supply Chain, Procurement, Project Planning, Vendor Management, Leadership, SAP, Budgets, Lean Manufacturing, Sourcing, Logistics, Purchasing, B2B, Sales, Operations Management, International Business
Education
University of Pittsburgh - Joseph M. Katz Graduate School of Business 2010 — 2011
Master of Business Administration (MBA)
Beijing Foreign Studies University 2003 — 2005
MA
Henan University of Science and Technology 1996 — 2000
BA
Yaqiong Chen's Hermes Microvision Inc. Experience August 2012 - Present
Job Application Engineer at Hermes Microvision, Inc
Industry Electrical/Electronic Manufacturing
Experience
Hermes Microvision, Inc August 2012 - Present
NJIT April 2011 - May 2011
NJIT October 2010 - November 2010
Beijing University of Technology February 2010 - May 2010
Beijing University of Technology October 2008 - November 2008
Education
NYU School of Professional Studies
Big Data Analytics & Visualization
New Jersey Institute of Technology 2010 — 2012
M S, Electrical and Computer Engineering
Beijing University of Technology 2006 — 2010
BE, Electronics and Science, 3.59
Hermes Microvision, Inc August 2012 - Present
NJIT April 2011 - May 2011
NJIT October 2010 - November 2010
Beijing University of Technology February 2010 - May 2010
Beijing University of Technology October 2008 - November 2008
Education
NYU School of Professional Studies
Big Data Analytics & Visualization
New Jersey Institute of Technology 2010 — 2012
M S, Electrical and Computer Engineering
Beijing University of Technology 2006 — 2010
BE, Electronics and Science, 3.59
Duoyang Zhang Duoyang Zhang's Hermes Microvision Inc. Experience July 2013 - Present
Job Application Engineer at HermesMicrovision, Inc.
Industry Semiconductors
Experience
Hermes-Microvision, Inc. July 2013 - Present
Construction Quality Inspection Bureau of Chifeng July 2010 - September 2010
Skills
Microsoft Office, AutoCAD, Matlab, SEM, Semiconductors, Biomaterials, Semiconductor..., XRD, Electronic Materials, Electronics, Powder X-ray Diffraction, Project Planning, Engineering, Manufacturing, Materials Science, Characterization, Data Analysis, Scanning Electron..., Microsoft Excel
Education
University of Florida 2011 — 2013
Master's degree, Material Engineering, 3.5/4/0
South China University of Technology 2007 — 2011
Bachlor's degree, Material science and engineering, 3.4/4.0
Hermes-Microvision, Inc. July 2013 - Present
Construction Quality Inspection Bureau of Chifeng July 2010 - September 2010
Skills
Microsoft Office, AutoCAD, Matlab, SEM, Semiconductors, Biomaterials, Semiconductor..., XRD, Electronic Materials, Electronics, Powder X-ray Diffraction, Project Planning, Engineering, Manufacturing, Materials Science, Characterization, Data Analysis, Scanning Electron..., Microsoft Excel
Education
University of Florida 2011 — 2013
Master's degree, Material Engineering, 3.5/4/0
South China University of Technology 2007 — 2011
Bachlor's degree, Material science and engineering, 3.4/4.0
Haokun Hu's Hermes Microvision Inc. Experience May 2013 - Present
Job Customer Service Engineer at Hermes Microvision, Inc
Industry Electrical/Electronic Manufacturing
Experience
Hermes Microvision, Inc May 2013 - Present
Boston University February 2012 - June 2012
TÜV SÜD January 2011 - May 2011
Skills
eBeam Inspection..., Simulations, Cadence Virtuoso, Analog Circuit Design, Xilinx ISE, C, Verilog HDL, FPGA, Verilog
Education
Boston University 2011 — 2013
Master of Engineering, Electrical Engineering
Shanghai University 2007 — 2011
Bachelor of Science, Electrical and Electronics Engineering
Hermes Microvision, Inc May 2013 - Present
Boston University February 2012 - June 2012
TÜV SÜD January 2011 - May 2011
Skills
eBeam Inspection..., Simulations, Cadence Virtuoso, Analog Circuit Design, Xilinx ISE, C, Verilog HDL, FPGA, Verilog
Education
Boston University 2011 — 2013
Master of Engineering, Electrical Engineering
Shanghai University 2007 — 2011
Bachelor of Science, Electrical and Electronics Engineering
Ruochong Fei Ruochong Fei's Hermes Microvision Inc. Experience October 2014 - Present
Job Application Engineer at HermesMicrovision, Inc.
Industry Electrical/Electronic Manufacturing
Experience
Hermes-Microvision, Inc. October 2014 - Present
Texas A&M University September 2009 - September 2014
Bose Corporation May 2013 - August 2013
Purdue University July 2008 - September 2008
Skills
Biomaterials, Scanning Electron..., Mechanical Testing, Finite Element Analysis, Biostatistics, Nanoparticles, Polymer Characterization, Characterization, TEM, UV/Vis, DSC, Matlab, Solidworks, Nanofabrication, FTIR, Microsoft Office, Organic Synthesis, NMR, Rheometry, X-ray Diffraction..., Polymers, Nanotechnology, Cell Culture
Education
Texas A&M University 2009 — 2014
Doctor of Philosophy (Ph.D.), Biomedical/Medical Engineering, 3.81
Zhejiang University 2005 — 2009
Bachelor's degree, Materials Science and Engineering, 3.67
Hermes-Microvision, Inc. October 2014 - Present
Texas A&M University September 2009 - September 2014
Bose Corporation May 2013 - August 2013
Purdue University July 2008 - September 2008
Skills
Biomaterials, Scanning Electron..., Mechanical Testing, Finite Element Analysis, Biostatistics, Nanoparticles, Polymer Characterization, Characterization, TEM, UV/Vis, DSC, Matlab, Solidworks, Nanofabrication, FTIR, Microsoft Office, Organic Synthesis, NMR, Rheometry, X-ray Diffraction..., Polymers, Nanotechnology, Cell Culture
Education
Texas A&M University 2009 — 2014
Doctor of Philosophy (Ph.D.), Biomedical/Medical Engineering, 3.81
Zhejiang University 2005 — 2009
Bachelor's degree, Materials Science and Engineering, 3.67
Amy (YuanChi ) Chiang Amy (YuanChi ) Chiang's Hermes Microvision Inc. Experience May 2013 - January 2015
Job Account Manager at UMCUSA
Industry Electrical/Electronic Manufacturing
Experience
UMC-USA January 2015 - Present
Hermes Microvision Inc May 2013 - January 2015
Northwestern University September 2012 - February 2013
Compeq Manufacturing Co., Ltd. April 2011 - July 2011
University of Arizona August 2009 - August 2010
Education
Northwestern University 2011 — 2012
Master of Science (MS), Materials Sciences and Engineering, GPA 3.6
University of Arizona 2008 — 2010
Bachelor of Science (BS), Materials Science and Engineering, GPA 3.5
UMC-USA January 2015 - Present
Hermes Microvision Inc May 2013 - January 2015
Northwestern University September 2012 - February 2013
Compeq Manufacturing Co., Ltd. April 2011 - July 2011
University of Arizona August 2009 - August 2010
Education
Northwestern University 2011 — 2012
Master of Science (MS), Materials Sciences and Engineering, GPA 3.6
University of Arizona 2008 — 2010
Bachelor of Science (BS), Materials Science and Engineering, GPA 3.5
NAN ZHAO NAN ZHAO's Hermes Microvision Inc. Experience September 2015 - Present
Job Senior Algorithm Engineer at HermesMicrovision, Inc.
Industry Computer Software
Experience
Hermes-Microvision, Inc. September 2015 - Present
Florida State University August 2008 - May 2015
UtopiaCompression Corporation May 2012 - August 2012
Florida State University May 2009 - May 2012
College of Computer Science, Sichuan University September 2005 - March 2008
Skills
Machine Learning, Computer Vision, Matlab, C++, Algorithms, Programming, C, Medical Imaging, LaTeX, Artificial Intelligence, Image Processing, Pattern Recognition, Python, Image Segmentation, Signal Processing, OpenCV, Project Management, Project Planning, Computer Science, Object Recognition, 3D reconstruction, Medical Image Processing, Object Detection, Deep Learning, Statistics, Partial Differential...
Education
Florida State University 2008 — 2013
Ph.D Candidate of Computer Science Department, Computer Vision and Pattern Recognition, 3.7
Sichuan University 2005 — 2008
Master's Degree, Computer Science
Sichuan University 2001 — 2005
Bachelor's Degree, Computer Science
Bashu Middle School 1995 — 2001
Hermes-Microvision, Inc. September 2015 - Present
Florida State University August 2008 - May 2015
UtopiaCompression Corporation May 2012 - August 2012
Florida State University May 2009 - May 2012
College of Computer Science, Sichuan University September 2005 - March 2008
Skills
Machine Learning, Computer Vision, Matlab, C++, Algorithms, Programming, C, Medical Imaging, LaTeX, Artificial Intelligence, Image Processing, Pattern Recognition, Python, Image Segmentation, Signal Processing, OpenCV, Project Management, Project Planning, Computer Science, Object Recognition, 3D reconstruction, Medical Image Processing, Object Detection, Deep Learning, Statistics, Partial Differential...
Education
Florida State University 2008 — 2013
Ph.D Candidate of Computer Science Department, Computer Vision and Pattern Recognition, 3.7
Sichuan University 2005 — 2008
Master's Degree, Computer Science
Sichuan University 2001 — 2005
Bachelor's Degree, Computer Science
Bashu Middle School 1995 — 2001
Sheng-Yung Chen Sheng-Yung Chen's Hermes Microvision Inc. Experience February 2013 - Present
Job Hermes Microvision, Inc. Senior Engineer
Industry Semiconductors
Experience
Hermes Microvision, Inc. February 2013 - Present
ITRI August 2003 - September 2005
Skills
C, C++, Matlab, Verilog, Microsoft Office, Electronics, Microsoft Excel, Embedded Systems, Linux, Programming, PowerPoint, Microsoft Word, Windows
Education
National Taiwan University 2005 — 2013
Doctor of Philosophy (Ph.D.), Electrical Engineering
Hermes Microvision, Inc. February 2013 - Present
ITRI August 2003 - September 2005
Skills
C, C++, Matlab, Verilog, Microsoft Office, Electronics, Microsoft Excel, Embedded Systems, Linux, Programming, PowerPoint, Microsoft Word, Windows
Education
National Taiwan University 2005 — 2013
Doctor of Philosophy (Ph.D.), Electrical Engineering
LONG ERIC MA LONG ERIC MA's Hermes Microvision Inc. Experience May 2013 - Present
Job Application Manager at Hermes Microvision Inc
Industry Semiconductors
Experience
Hermes Microvision Inc May 2013 - Present
Hermes Microvision Inc November 2006 - Present
Hermes epitek February 2006 - September 2006
Cadence Design Systems July 2005 - September 2005
Skills
Semiconductors, Manufacturing, Semiconductor..., Flash Memory, CMOS, Electrical Engineering, Metrology, Signal Processing
Education
Tsinghua University 1999 — 2005
MS, Microelectronics
Hermes Microvision Inc May 2013 - Present
Hermes Microvision Inc November 2006 - Present
Hermes epitek February 2006 - September 2006
Cadence Design Systems July 2005 - September 2005
Skills
Semiconductors, Manufacturing, Semiconductor..., Flash Memory, CMOS, Electrical Engineering, Metrology, Signal Processing
Education
Tsinghua University 1999 — 2005
MS, Microelectronics
Pengqing Xie's Hermes Microvision Inc. Experience June 2013 - August 2013
Job Firmware Engineer at Intersil Corporation
Industry Computer Software
Experience
Intersil Corporation May 2014 - Present
Iowa State University August 2012 - Present
Iowa State University August 2012 - Present
Hermes Microvision Inc. June 2013 - August 2013
Iowa State University February 2008 - May 2012
Skills
Research, C/C++, Objective-C, Java, HTML, JavaScript, VHDL, MIPS Assembly, Verilog, OpenCV, Matlab, Linux, Mac OS, Xcode, Perl, Python, Embedded Systems, Machine Learning, ModelSim, Computer Vision, Image Processing, iOS development, Operating Systems, FPGA, C, Algorithms, C
Education
Iowa State University 2008 — 2012
Bachelor of Science (B.S.), Computer Engineering, 3.52
Intersil Corporation May 2014 - Present
Iowa State University August 2012 - Present
Iowa State University August 2012 - Present
Hermes Microvision Inc. June 2013 - August 2013
Iowa State University February 2008 - May 2012
Skills
Research, C/C++, Objective-C, Java, HTML, JavaScript, VHDL, MIPS Assembly, Verilog, OpenCV, Matlab, Linux, Mac OS, Xcode, Perl, Python, Embedded Systems, Machine Learning, ModelSim, Computer Vision, Image Processing, iOS development, Operating Systems, FPGA, C, Algorithms, C
Education
Iowa State University 2008 — 2012
Bachelor of Science (B.S.), Computer Engineering, 3.52
Lining Lin's Hermes Microvision Inc. Experience July 2013 - Present
Job Application Engineer at Hermes Microvision Inc.
Industry Semiconductors
Experience
Hermes Microvision Inc. July 2013 - Present
University of Pennsylvania 2012 - 2013
University of Science and Technology of China June 2009 - May 2011
Chinese Academy of Sciences July 2010 - August 2010
Skills
Materials Science, Microfabrication, UV/Vis, FTIR, Nanotechnology, AFM, SEM, MEMS, Renewable Energy, Semiconductors, Corporate Finance, Java, Corrosion, Semiconductor Industry, E-beam, Lean Manufacturing
Education
University of Pennsylvania 2011 — 2013
Master's degree, Materials Science & Engineering
University of Science and Technology of China 2007 — 2011
Bachelor's degree, Materials Science & Engineering
Hermes Microvision Inc. July 2013 - Present
University of Pennsylvania 2012 - 2013
University of Science and Technology of China June 2009 - May 2011
Chinese Academy of Sciences July 2010 - August 2010
Skills
Materials Science, Microfabrication, UV/Vis, FTIR, Nanotechnology, AFM, SEM, MEMS, Renewable Energy, Semiconductors, Corporate Finance, Java, Corrosion, Semiconductor Industry, E-beam, Lean Manufacturing
Education
University of Pennsylvania 2011 — 2013
Master's degree, Materials Science & Engineering
University of Science and Technology of China 2007 — 2011
Bachelor's degree, Materials Science & Engineering
Anlei Dong's Hermes Microvision Inc. Experience February 2006 - May 2008
Job Senior Relevance Scientist at Yahoo! Inc.
Industry Computer Software
Experience
Yahoo! Inc. May 2008 - Present
Hermes Microvision Inc. February 2006 - May 2008
FastVDO Inc. February 2005 - February 2006
Siemens Corporate Research June 2004 - September 2004
Eastman Kodak June 2003 - September 2003
Education
University of California, Riverside 1999 — 2004
Ph.D, Electrical Engineering
University of Science and Technology of China 1996 — 1999
Master, Automation
University of Science and Technology of China 1991 — 1996
B.S., Automation
Qingdao No. 2 Middle School 1985 — 1991
Yahoo! Inc. May 2008 - Present
Hermes Microvision Inc. February 2006 - May 2008
FastVDO Inc. February 2005 - February 2006
Siemens Corporate Research June 2004 - September 2004
Eastman Kodak June 2003 - September 2003
Education
University of California, Riverside 1999 — 2004
Ph.D, Electrical Engineering
University of Science and Technology of China 1996 — 1999
Master, Automation
University of Science and Technology of China 1991 — 1996
B.S., Automation
Qingdao No. 2 Middle School 1985 — 1991
Xiaochun Li's Hermes Microvision Inc. Experience January 2014 - January 2015
Job Principal Software Engineer at Intermolecular
Industry Semiconductors
Experience
Intermolecular January 2015 - Present
Hermes-Microvision, Inc. January 2014 - January 2015
PDF Solutions February 2012 - October 2013
PDF Solutions October 2007 - January 2012
PDF Solutions February 2004 - October 2007
PDF Solutions January 2002 - February 2004
PDF Solutions July 2000 - January 2002
Department of Electrical Engineering, Unversity of Wyoming August 1997 - June 2000
Department of Signal Processing, Institute of Acoustics, CAS September 1993 - July 1996
Skills
Semiconductors, Software Development, Embedded Systems, Engineering Management, Databases, Programming, Perl, Software Engineering, Project Management, OOD/OOP, Big data processing,..., Relational Databases, C++, Computing Geometry, Java, Java script, Cloud Computing, XML/HTML, HTTP, Ajax,..., Distributed systems and..., GUI design and..., System and network..., Unit test and test..., Shell and scripting..., EDA databases
Education
University of Wyoming 1997 — 2000
Ph.D., EE - Robotics and control system
Graduate School of Chinese Academy of Sciences 1993 — 1996
M.S., Acoustics and Signal Processing
Tsinghua University 1988 — 1993
B.E., Automatic Control
Intermolecular January 2015 - Present
Hermes-Microvision, Inc. January 2014 - January 2015
PDF Solutions February 2012 - October 2013
PDF Solutions October 2007 - January 2012
PDF Solutions February 2004 - October 2007
PDF Solutions January 2002 - February 2004
PDF Solutions July 2000 - January 2002
Department of Electrical Engineering, Unversity of Wyoming August 1997 - June 2000
Department of Signal Processing, Institute of Acoustics, CAS September 1993 - July 1996
Skills
Semiconductors, Software Development, Embedded Systems, Engineering Management, Databases, Programming, Perl, Software Engineering, Project Management, OOD/OOP, Big data processing,..., Relational Databases, C++, Computing Geometry, Java, Java script, Cloud Computing, XML/HTML, HTTP, Ajax,..., Distributed systems and..., GUI design and..., System and network..., Unit test and test..., Shell and scripting..., EDA databases
Education
University of Wyoming 1997 — 2000
Ph.D., EE - Robotics and control system
Graduate School of Chinese Academy of Sciences 1993 — 1996
M.S., Acoustics and Signal Processing
Tsinghua University 1988 — 1993
B.E., Automatic Control
Kathreen Woyak's Hermes Microvision Inc. Experience January 2014 - Present
Job Applications Engineer at Hermes Microvision, Inc.
Industry Nanotechnology
Experience
Hermes Microvision, Inc. January 2014 - Present
Shanghai Guanghua College February 2012 - December 2013
FEI Company 2008 - February 2012
USPTO 2007 - 2008
Skills
Materials Science, Scanning Electron..., Patents, Experimentation, Physics, Focused Ion Beam Systems, Charged Particle Optics, Mathematica, Optics, FIB
Education
University of Minnesota-Twin Cities
M.S., Physics
Carleton College 1998 — 2002
BA, Physics
Hermes Microvision, Inc. January 2014 - Present
Shanghai Guanghua College February 2012 - December 2013
FEI Company 2008 - February 2012
USPTO 2007 - 2008
Skills
Materials Science, Scanning Electron..., Patents, Experimentation, Physics, Focused Ion Beam Systems, Charged Particle Optics, Mathematica, Optics, FIB
Education
University of Minnesota-Twin Cities
M.S., Physics
Carleton College 1998 — 2002
BA, Physics
Jon Chiang's Hermes Microvision Inc. Experience June 2012 - Present
Job Senior Application Engineer at Hermes Microvision Inc
Industry Semiconductors
Experience
Hermes Microvision Inc June 2012 - Present
Srico Inc January 2011 - December 2011
Srico January 2010 - January 2011
Tech4imaging January 2009 - December 2009
BioLOC , Ohio State University January 2009 - March 2009
The Ohio State University September 2005 - June 2008
Asia TEK. Inc June 2002 - September 2002
Skills
Characterization, Matlab, Labview, Thin Films, Photolithography, Simulations, Sensors, Scanning Electron..., Electronics, Engineering, C, Etching, C++, Lithography, Pspice, Verilog, PCB design, Testing, Simulink, AutoCAD
Education
The Ohio State University 2005 — 2008
Master, Electrical Engineering
The Ohio State University 2002 — 2005
Bachelor's degree, Electrical Engineering
Hermes Microvision Inc June 2012 - Present
Srico Inc January 2011 - December 2011
Srico January 2010 - January 2011
Tech4imaging January 2009 - December 2009
BioLOC , Ohio State University January 2009 - March 2009
The Ohio State University September 2005 - June 2008
Asia TEK. Inc June 2002 - September 2002
Skills
Characterization, Matlab, Labview, Thin Films, Photolithography, Simulations, Sensors, Scanning Electron..., Electronics, Engineering, C, Etching, C++, Lithography, Pspice, Verilog, PCB design, Testing, Simulink, AutoCAD
Education
The Ohio State University 2005 — 2008
Master, Electrical Engineering
The Ohio State University 2002 — 2005
Bachelor's degree, Electrical Engineering
Lingling Pu's Hermes Microvision Inc. Experience May 2015 - Present
Job Sr. Image Processing Engineer at HermesMicrovision, Inc.
Industry Research
Experience
Hermes-Microvision, Inc. May 2015 - Present
The University of Arizona 2010 - November 2014
UofA June 2007 - June 2010
Skills
Matlab, Algorithms, Simulations, Signal Processing, Image Processing, Statistics, video compression, computer vision, c/c++, Machine Learning, LaTeX, Pattern Recognition, Mathematical Modeling
Education
University of Arizona 2002 — 2007
Ph.D, ECE
North Dakota State University 2000 — 2002
M.S., ECE
University of Science and Technology of China 1994 — 1999
B.S., ECE
Hermes-Microvision, Inc. May 2015 - Present
The University of Arizona 2010 - November 2014
UofA June 2007 - June 2010
Skills
Matlab, Algorithms, Simulations, Signal Processing, Image Processing, Statistics, video compression, computer vision, c/c++, Machine Learning, LaTeX, Pattern Recognition, Mathematical Modeling
Education
University of Arizona 2002 — 2007
Ph.D, ECE
North Dakota State University 2000 — 2002
M.S., ECE
University of Science and Technology of China 1994 — 1999
B.S., ECE
Paladin Tai's Hermes Microvision Inc. Experience 2005 - Present
Job Hermes microvision Inc
Industry Semiconductors
Experience
Hermes microvision Inc 2005 - Present
Alcatel-Lucent August 1998 - June 2000
Skills
Debugging
Education
Oklahoma City University 2001 — 2003
Master's degree, Computer, A
Tunghai University 1992 — 1996
Bachelor's degree, Computer and Information Sciences, General
Hermes microvision Inc 2005 - Present
Alcatel-Lucent August 1998 - June 2000
Skills
Debugging
Education
Oklahoma City University 2001 — 2003
Master's degree, Computer, A
Tunghai University 1992 — 1996
Bachelor's degree, Computer and Information Sciences, General
Luis Chaname's Hermes Microvision Inc. Experience January 2013 - Present
Job Filed Service Engineer at HermesMicrovision Inc.
Industry Semiconductors
Experience
Hermes-Microvision Inc. January 2013 - Present
Nikon Precision Inc. October 2011 - April 2012
DNS Electronics October 1995 - January 2011
Skills
Metrology, Semiconductors
Education
Heald College
ASSOCIATES DEGREE IN APPLIED SCIENCE, ELECTRONICS
Hermes-Microvision Inc. January 2013 - Present
Nikon Precision Inc. October 2011 - April 2012
DNS Electronics October 1995 - January 2011
Skills
Metrology, Semiconductors
Education
Heald College
ASSOCIATES DEGREE IN APPLIED SCIENCE, ELECTRONICS
Futang Peng's Hermes Microvision Inc. Experience August 2008 - November 2011
Job Software Engineer Google
Industry Computer Software
Experience
Google June 2015 - Present
Amazon Lab126 November 2013 - May 2015
Hermes Microvision Inc. August 2008 - November 2011
Skills
Computer Vision,..., Data Mining, Computer..., Audio/Video Codec,..., Image Processing, Python, Algorithms, Pattern Recognition, Machine Learning, C#, Signal Processing, GDS Layout Analysis, C, Programming
Education
Tsinghua University 2005 — 2008
Master, Computer Vision, Image Processing
Beijing Information Technology Institute 2001 — 2005
Bachelor, Communication Engineering
Anfu High School
Google June 2015 - Present
Amazon Lab126 November 2013 - May 2015
Hermes Microvision Inc. August 2008 - November 2011
Skills
Computer Vision,..., Data Mining, Computer..., Audio/Video Codec,..., Image Processing, Python, Algorithms, Pattern Recognition, Machine Learning, C#, Signal Processing, GDS Layout Analysis, C, Programming
Education
Tsinghua University 2005 — 2008
Master, Computer Vision, Image Processing
Beijing Information Technology Institute 2001 — 2005
Bachelor, Communication Engineering
Anfu High School
Youfei Jiang's Hermes Microvision Inc. Experience February 2015 - Present
Job Electron Optics Engineer
Industry Electrical/Electronic Manufacturing
Experience
Hermes-Microvision, Inc. February 2015 - Present
UNC Charlotte August 2013 - December 2014
UNC Charlotte August 2009 - December 2014
Chongqing University September 2008 - July 2009
Skills
Characterization, Nanotechnology, Scanning Electron..., Materials Science, Spectroscopy, Nanomaterials, AFM, Research, Solidworks, Nanoindentation, Labview, Matlab
Education
University of North Carolina at Charlotte 2009 — 2015
Doctor of Philosophy (PhD), Nanotechnology
UNC Charlotte 2009 — 2011
Master's degree, Mechanical Engineering
Chongqing University 2005 — 2009
Bachelor's degree, Applied Physics
Hermes-Microvision, Inc. February 2015 - Present
UNC Charlotte August 2013 - December 2014
UNC Charlotte August 2009 - December 2014
Chongqing University September 2008 - July 2009
Skills
Characterization, Nanotechnology, Scanning Electron..., Materials Science, Spectroscopy, Nanomaterials, AFM, Research, Solidworks, Nanoindentation, Labview, Matlab
Education
University of North Carolina at Charlotte 2009 — 2015
Doctor of Philosophy (PhD), Nanotechnology
UNC Charlotte 2009 — 2011
Master's degree, Mechanical Engineering
Chongqing University 2005 — 2009
Bachelor's degree, Applied Physics
Xuefeng Zeng's Hermes Microvision Inc. Experience October 2011 - September 2012
Job Senior Engineer at Globalfoundries US Inc.
Industry Information Technology and Services
Experience
Globalfoundries US Inc. September 2012 - Present
Hermes Microvision Inc. October 2011 - September 2012
Institute for Systems Biology January 2011 - October 2011
University of Wisconsin-Platteville August 2010 - January 2011
University of Wisconsin-Madison September 2009 - December 2010
Skills
Microfabrication, Microfluidics, MEMS, Optics, Electronics, Semiconductor Process, Design of Experiments, SPC, Yield Management, Defect Elimination, ebeam inspection, Semiconductor Failure..., Project Management, Sensors, Characterization, Simulations, R&D, Semiconductors, Matlab, Nanotechnology, Silicon, Thin Films, Process Simulation, ANSYS, Photonics, Medical Devices, Laser
Education
University of Wisconsin-Madison 2005 — 2009
Ph.D., Electrical Engineering
Tsinghua University 2002 — 2005
MS, Microelectronics & Solid State Electronics
Tianjin University 1998 — 2002
BS, Microelectronics & Solid State Electronics
Globalfoundries US Inc. September 2012 - Present
Hermes Microvision Inc. October 2011 - September 2012
Institute for Systems Biology January 2011 - October 2011
University of Wisconsin-Platteville August 2010 - January 2011
University of Wisconsin-Madison September 2009 - December 2010
Skills
Microfabrication, Microfluidics, MEMS, Optics, Electronics, Semiconductor Process, Design of Experiments, SPC, Yield Management, Defect Elimination, ebeam inspection, Semiconductor Failure..., Project Management, Sensors, Characterization, Simulations, R&D, Semiconductors, Matlab, Nanotechnology, Silicon, Thin Films, Process Simulation, ANSYS, Photonics, Medical Devices, Laser
Education
University of Wisconsin-Madison 2005 — 2009
Ph.D., Electrical Engineering
Tsinghua University 2002 — 2005
MS, Microelectronics & Solid State Electronics
Tianjin University 1998 — 2002
BS, Microelectronics & Solid State Electronics
Vicky Chung's Hermes Microvision Inc. Experience March 2014 - Present
Job Material and Production Planner
Industry Semiconductors
Experience
Hermes Microvision, Inc. March 2014 - Present
Taiwanese American Professionals (TAP) February 2014 - Present
Education
University of California, Irvine 2006 — 2010
BA, International Studies
The University of Hong Kong 2008 — 2009
Business Administration, Social Sciences
Hermes Microvision, Inc. March 2014 - Present
Taiwanese American Professionals (TAP) February 2014 - Present
Education
University of California, Irvine 2006 — 2010
BA, International Studies
The University of Hong Kong 2008 — 2009
Business Administration, Social Sciences
Nan Lei's Hermes Microvision Inc. Experience June 2012 - Present
Job Application Engineer
Industry Semiconductors
Experience
Hermes Microvision Inc. June 2012 - Present
Microfluidics Lab in WSUV August 2010 - May 2012
Washington State University August 2010 - May 2012
Beihang University of Aeronautics and Astronautics August 2008 - September 2009
Skills
Microfluidics, Electro-Mechanical..., Microfabrication, Solidworks, MEMS, LabVIEW, Semiconductor Process, System Modeling, SEM, Manufacturing, ANSYS, Photolithography, Matlab, Research, MEMS design, C, Team Leadership, Excel, Wet Chemical Etching, PVD, CVD
Education
Washington State University 2010 — 2012
M.S, Mechanical Engineering
Beihang University 2006 — 2010
Bachelor's degree, Aerospace, Aeronautical and Astronautical Engineering, 3.7
Hermes Microvision Inc. June 2012 - Present
Microfluidics Lab in WSUV August 2010 - May 2012
Washington State University August 2010 - May 2012
Beihang University of Aeronautics and Astronautics August 2008 - September 2009
Skills
Microfluidics, Electro-Mechanical..., Microfabrication, Solidworks, MEMS, LabVIEW, Semiconductor Process, System Modeling, SEM, Manufacturing, ANSYS, Photolithography, Matlab, Research, MEMS design, C, Team Leadership, Excel, Wet Chemical Etching, PVD, CVD
Education
Washington State University 2010 — 2012
M.S, Mechanical Engineering
Beihang University 2006 — 2010
Bachelor's degree, Aerospace, Aeronautical and Astronautical Engineering, 3.7
chun-shiang lin's Hermes Microvision Inc. Experience June 2012 - Present
Job Sr.Mechanical Engineer at HermesMicrovision Inc
Industry Higher Education
Experience
Hermes-Microvision Inc June 2012 - Present
Hermes-Microvision.Inc June 2012 - April 2014
University of Michigan June 2010 - June 2012
Skills
Matlab, Research, Statistics, SPSS, PowerPoint, Microsoft Office, C++, Public Speaking, Data Analysis, Higher Education, Microsoft Excel, Microsoft Word, Teaching, Social Media, Python, Molecular Biology, C, LaTeX, Cell Culture, R
Education
University of Michigan 2010 — 2012
Master's degree, Mechanical Engineering
National Taiwan University 2005 — 2009
Bachelor's degree, Mechanical Engineering
Hermes-Microvision Inc June 2012 - Present
Hermes-Microvision.Inc June 2012 - April 2014
University of Michigan June 2010 - June 2012
Skills
Matlab, Research, Statistics, SPSS, PowerPoint, Microsoft Office, C++, Public Speaking, Data Analysis, Higher Education, Microsoft Excel, Microsoft Word, Teaching, Social Media, Python, Molecular Biology, C, LaTeX, Cell Culture, R
Education
University of Michigan 2010 — 2012
Master's degree, Mechanical Engineering
National Taiwan University 2005 — 2009
Bachelor's degree, Mechanical Engineering
Echo Zeng's Hermes Microvision Inc. Experience April 2005 - Present
Job Senior Electrical Engineer
Industry Semiconductors
Experience
Hermes Microvision Inc. April 2005 - Present
Huawei Technologies 2006 - 2012
Skills
Embedded Systems, Microcontrollers, C, Electronics, FPGA, Electrical Engineering, Debugging, Instrumentation
Education
Santa Clara University
EE, control
Hermes Microvision Inc. April 2005 - Present
Huawei Technologies 2006 - 2012
Skills
Embedded Systems, Microcontrollers, C, Electronics, FPGA, Electrical Engineering, Debugging, Instrumentation
Education
Santa Clara University
EE, control
I-En (Brian) Chen's Hermes Microvision Inc. Experience August 2013 - February 2015
Job NPI Process Engineer at Prysm Inc.
Industry Electrical/Electronic Manufacturing
Experience
Prysm Inc. September 2015 - Present
Hermes Microvision, Inc. August 2013 - February 2015
Hermes Microvision, Inc. April 2012 - August 2013
SGS North America Inc., Consumer Testing Service September 2011 - February 2012
Department of Mechanical Engineering, Stevens Institute of Technology September 2009 - June 2010
Skills
Microsoft Office, C language, Matlab, AutoCAD, Solidworks, Arena Simulation..., Scanning Electron..., Lithography, Engineering, Mechanical Engineering, Semiconductor Industry, Manufacturing, System Integration..., Project Engineering, Vacuum Chambers, Vacuum Pumps, Pneumatics, Machining, Quality Assurance, System Testing, MEMS, Nanotechnology, Troubleshooting, Electroplating, Product Support, Leak Testing, PVD, Failure Analysis, Semiconductors
Education
Stevens Institute of Technology 2009 — 2011
Master of Engineering (M.Eng.), Mechanical Engineering
National Chung-Hsing University 2003 — 2007
Bachelor of Science (B.S.), Mechanical Engineering
Prysm Inc. September 2015 - Present
Hermes Microvision, Inc. August 2013 - February 2015
Hermes Microvision, Inc. April 2012 - August 2013
SGS North America Inc., Consumer Testing Service September 2011 - February 2012
Department of Mechanical Engineering, Stevens Institute of Technology September 2009 - June 2010
Skills
Microsoft Office, C language, Matlab, AutoCAD, Solidworks, Arena Simulation..., Scanning Electron..., Lithography, Engineering, Mechanical Engineering, Semiconductor Industry, Manufacturing, System Integration..., Project Engineering, Vacuum Chambers, Vacuum Pumps, Pneumatics, Machining, Quality Assurance, System Testing, MEMS, Nanotechnology, Troubleshooting, Electroplating, Product Support, Leak Testing, PVD, Failure Analysis, Semiconductors
Education
Stevens Institute of Technology 2009 — 2011
Master of Engineering (M.Eng.), Mechanical Engineering
National Chung-Hsing University 2003 — 2007
Bachelor of Science (B.S.), Mechanical Engineering
Chan-Rong Lin's Hermes Microvision Inc. Experience September 2013 - Present
Job System Engineer at Hermes Microvision Inc.
Industry Semiconductors
Experience
Hermes Microvision Inc. September 2013 - Present
DMG / Mori Seiki USA July 2013 - September 2013
Shiny G&M Associated Co., Ltd June 2012 - August 2012
National Taiwan University December 2010 - July 2011
Combined Logistics School, Army of Taiwan R.O.C. August 2009 - July 2010
Education
University of Michigan 2011 — 2013
Master of Science (M.S.), Mechanical Engineering
National Tsing Hua University 2005 — 2009
Bachelor of Science (B.S.), Power Mechanical Engineering
Hermes Microvision Inc. September 2013 - Present
DMG / Mori Seiki USA July 2013 - September 2013
Shiny G&M Associated Co., Ltd June 2012 - August 2012
National Taiwan University December 2010 - July 2011
Combined Logistics School, Army of Taiwan R.O.C. August 2009 - July 2010
Education
University of Michigan 2011 — 2013
Master of Science (M.S.), Mechanical Engineering
National Tsing Hua University 2005 — 2009
Bachelor of Science (B.S.), Power Mechanical Engineering
Crystal Shen's Hermes Microvision Inc. Experience February 2005 - Present
Job Testing Engineer at Hermes Microvision Inc.
Industry Semiconductors
Experience
Hermes Microvision Inc. February 2005 - Present
Education
University of California, Irvine 1999 — 2004
Bachelor of Science (B.S.), Electrical and Electronics Engineering
Hermes Microvision Inc. February 2005 - Present
Education
University of California, Irvine 1999 — 2004
Bachelor of Science (B.S.), Electrical and Electronics Engineering
Lynn Teng's Hermes Microvision Inc. Experience September 2013 - Present
Job Field Service Engineer at Hermes Microvision Inc
Industry Semiconductors
Experience
Hermes Microvision Inc September 2013 - Present
FIRST Robotics Team 2102 November 2012 - June 2013
Skills
Troubleshooting, Employee Training, Team Coordination, Interpersonal..., Software Engineering, Algorithms, Java, C, C++, Python, Linux, Computer Science, HTML, Programming, Distributed Systems
Education
University of California, Santa Cruz 2007 — 2013
Bachelor of Science (BS), Computer Engineering
International Christian University 2011 — 2012
Study Abroad, Numerical Analysis and Japanese
Hermes Microvision Inc September 2013 - Present
FIRST Robotics Team 2102 November 2012 - June 2013
Skills
Troubleshooting, Employee Training, Team Coordination, Interpersonal..., Software Engineering, Algorithms, Java, C, C++, Python, Linux, Computer Science, HTML, Programming, Distributed Systems
Education
University of California, Santa Cruz 2007 — 2013
Bachelor of Science (BS), Computer Engineering
International Christian University 2011 — 2012
Study Abroad, Numerical Analysis and Japanese
shang-chien chen's Hermes Microvision Inc. Experience May 2013 - August 2013
Job Master Candidate at University of Pennsylvania
Industry Nanotechnology
Experience
Hermes Microvision Inc. May 2013 - August 2013
Academia Sinica December 2011 - July 2012
Skills
Chemical Engineering, Materials Science, Vacuum Chambers, Laser, Optics, Semiconductor Process, Semiconductor..., Organic Semiconductors, Semiconductor Device, Semiconductor Industry, PHP, MySQL, Solidworks, Matlab, Chinese, English, SEM
Education
University of Pennsylvania 2012 — 2014
Master Candidate, Materials Science and Engineering
National Taiwan University 2006 — 2010
Bachelor's degree, Chemical Engineering
Hermes Microvision Inc. May 2013 - August 2013
Academia Sinica December 2011 - July 2012
Skills
Chemical Engineering, Materials Science, Vacuum Chambers, Laser, Optics, Semiconductor Process, Semiconductor..., Organic Semiconductors, Semiconductor Device, Semiconductor Industry, PHP, MySQL, Solidworks, Matlab, Chinese, English, SEM
Education
University of Pennsylvania 2012 — 2014
Master Candidate, Materials Science and Engineering
National Taiwan University 2006 — 2010
Bachelor's degree, Chemical Engineering
Deloitte
PwC
Ernst & Young
Walgreens
Procter & Gamble
KPMG
PricewaterhouseCoopers
EY