FlipChip International

Industry: Company

Description

Headquarters: Phoenix, AZ Founded: 1996 Subsidiaries: FlipChip Millennium Shanghai, Millennium Microtech Holding Corporation Parent organization: Tianshui Huatian Technology Co., Ltd.FeedbackDisclaimer Claim this knowledge panel Knowledge ResultSee outside Moved, closed, or was never hereReportFlipChip InternationalWebsiteDirections Saved (0) Saved Save 7 Google reviews Corporate office Address: 3701 E University Dr, Phoenix, AZ 85034 Phone: (602) 431-6020Category: : : Place name: : Website: Hours: : : : Website: http://www.flipchip.com/ Category: Corporate office Suggest an editUnable to add this file. Please check that it is a valid photo. Unable to add this file. Please check that it is a valid photo. · Own this business?Add missing informationAdd business hours Unable to add this file. Please check that it is a valid photo. Questions & answers Ask a questionBe the first to ask a question Add a photoThanks for sharing!Your photo will be posted publicly on Google.Contribute MoreDoneUpload public photos of FlipChip International Posting publicly on the Web Write a review Reviews 7 Google reviews

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FlipChip International Employees

Employee
Years
Job
Industry
Joe Brogdon Joe Brogdon Phoenix, Arizona Area Details
Joe Brogdon's FlipChip International Experience December 2005 - January 2012
Job Engineering Technician at Intel Corporation
Industry Semiconductors
Experience
Intel Corporation  February 2013 - Present
FlipChip International   December 2005 - January 2012
IC Sservices   July 2004 - December 2005
Freescale Semiconductor  August 2001 - December 2003
Motorola  September 1998 - December 2000

Skills
Semiconductors, Electronics, Manufacturing, Testing, Embedded Systems, Microsoft Office, Product Development, SPC, Troubleshooting, Metrology, Photolithography, Metals, Management, Wafer Fab, Electronics Packaging

Education
Mesa Community College   2003 — 2004

Cynthia Trone Cynthia Trone Mesa, Arizona Details
Cynthia Trone's FlipChip International Experience August 2013 - Present
Job Manufacturing Technician at FlipChip International
Industry Semiconductors
Experience
FlipChip International   August 2013 - Present
Deseret Industries  November 2012 - August 2013
Vangent, Inc.   February 2010 - June 2010
Microsemi  August 2007 - April 2008

Skills
Team Leadership, Training, Leadership, Team Building, Project Management, Public Relations, Event Management, Analysis, Process Improvement, Program Management, Leadership Development, Coaching, Customer Satisfaction, Customer Service, Inventory Management, Operations Management

Education
Mesa Community College   2005 — 2006
Associates, Digital Animation

Pavel Laptev Pavel Laptev Greater Los Angeles Area Details
Pavel Laptev's FlipChip International Experience 2012 - 2013
Job Director of Equipment Engineering and Equipment Sustain
Industry Semiconductors
Experience
Innovative Micro Technology  2010 - Present
FlipChip International   2012 - 2013
FlipChip International   2012 - 2013
Tegal Corporation  September 2007 - April 2010
Tegal Corporation  May 2002 - August 2007

Skills
CVD, Semiconductor Industry, Thin Films, Product Engineering, Metrology, PVD, Engineering Management, Design of Experiments, Electronics, R&D, Semiconductors, MEMS, Silicon, Cross-functional Team..., Embedded Systems, Characterization, Process Engineering, Failure Analysis, IC, Photolithography, Semiconductor Process, JMP, Process Simulation, SPC, Manufacturing, Vacuum, Nanotechnology, Automation, Analog, Sensors, Design for Manufacturing, Lithography, Engineering, Product Management, Product Development, Lean Manufacturing, Materials Science

Education
Moscow Institute of Electronic Technology (Technical University) (MIET)   1980 — 1986
M.S., Physics, Electronics

Jaime Chacon Jaime Chacon Phoenix, Arizona Area Details
Jaime Chacon's FlipChip International Experience 2005 - 2012
Job QC Mortgage Loan Processor at Interthinx, a subsidiary of First American Financial Corporation (NYSE: FAF)
Industry Financial Services
Experience
Interthinx, a subsidiary of First American Financial Corporation (NYSE: FAF)   2013 - Present
JPMorgan Chase  2012 - 2012
FlipChip International   2005 - 2012
Motorola  1997 - 2005
Blockbuster  1996 - 1997
Champs Sports  1992 - 1996

Skills
Leadership, Management, Operations Management, Training, Manufacturing, Customer Service, Customer Satisfaction, Time Management, Product Development, Team Management, Retail, Employee Relations

Education
Vanguard University of Southern California   1990 — 1991
Finance

International Business College   1984 — 1985
Diploma, Computer Accounting

Timothy Franks Timothy Franks Phoenix, Arizona Area Details
Timothy Franks's FlipChip International Experience November 2010 - January 2015
Job LRV Maintenance Technician II at Valley Metro RPTA
Industry Transportation/Trucking/Railroad
Experience
Valley Metro RPTA  January 2015 - Present
FlipChip International   November 2010 - January 2015
LMS Intellibound, Inc.   May 2009 - December 2010
Shamrock Foods  November 2007 - June 2008

Skills
Semiconductor Industry, Semiconductors, Engineering, Automation, Warehousing, Java, Shipping, Electronics, Manufacturing, Preventive Maintenance, Continuous Improvement, ISO, FMEA, Six Sigma, Engineering Management, Design of Experiments

Education
DeVry University   2007 — 2010
Bachelor of Science in Electronics Engineering, Electronics Engineering

Thunderbird High school   2003 — 2007
High School Diploma

Brian King MBA, PMP Brian King MBA, PMP Phoenix, Arizona Area Details
Brian King MBA, PMP's FlipChip International Experience January 2001 - January 2005
Job Sr Program Manager at ViaSat ~ Top performing PM executive ~ Revenue Growth ~ Cross Functional Leader ~ Contracts
Industry Semiconductors
Experience
ViaSat  December 2012 - Present
Freescale Semiconductor  January 2005 - December 2012
FlipChip International   January 2001 - January 2005
Motorola Computer Group, Motorola Mobility   January 1999 - January 2001
Motorola Automotive Advanced SmartMos Products   January 1998 - January 1999
Motorola Sensor Products Division   January 1996 - January 1998
Motorola  January 1995 - January 1996

Skills
Program Management, Cross-functional Team..., Semiconductors, International Project..., Process Improvement, Risk Management, Engineering Management, Product Development, Project Management, Management, Risk Assessment, PMP, Engineering, PMO, Product Management, PMO Management, Black Belt, Subcontracting, Manage Design Win to..., Microsoft Project/..., Cost Reduction/ Budget..., Profit/ Loss Performance, Subcontractor Management, PMP Certification, Six Sigma, Electronics, Testing

Education
Arizona State University
Master of Business Administration (MBA), Management of Technology

Arizona State University
Bachelor of Science, Chemical Engineering

The George Washington University
Master's Certificate, Project Management

Bob Gosliak Bob Gosliak Phoenix, Arizona Area Details
Bob Gosliak's FlipChip International Experience July 2004 - May 2007
Job Experienced Manager • Critical Thinker • Operations • Lean/TOC • Iterative • Technical
Industry Electrical/Electronic Manufacturing
Experience
Compunetics  September 2009 - Present
Phototooling Data Services   March 1993 - September 2009
HEI Inc  March 2007 - July 2008
FlipChip International   July 2004 - May 2007
HEI Inc  March 1999 - July 2004
Nelco Products, Inc.   March 1994 - August 1999
Dynaco Corporation   January 1984 - March 1994

Skills
Front-end, Information Systems, Manufacturing, Product Development, System Administration, Electronics, Engineering, Cross-functional Team..., Design for Manufacturing, Product Management, ISO, Manufacturing..., Program Management

Education
University of Phoenix   2011 — 2014
Bachelor's Degree, Information Technology, 3.95

Chandler Gilbert Community College   2003 — 2003
Visual Basic, Unix, 4.00

Phoenix College
BSIT/BSCS Course Work, 3.33

Vale Technical College
Associate in Specialized Technology, Automotive Techniques & Management, 3.5

Kris Geier Kris Geier Phoenix, Arizona Area Details
Kris Geier's FlipChip International Experience August 1999 - May 2013
Job
Industry Semiconductors
Experience
FlipChip International   August 1999 - May 2013
FlipChip International   January 2012 - April 2013
FlipChip International   August 1999 - January 2004
Southwest Airlines  May 1996 - October 1999

Skills
Failure Analysis, Engineering, Semiconductors, Electronics, Design of Experiments, IC, Thin Films, SPC, Manufacturing, Continuous Improvement, Process Improvement, Troubleshooting, ISO 14001, Root Cause Analysis, FMEA, Testing, Software Documentation, Process Engineering, Engineering Management, JMP, Test Equipment, SharePoint, CATSWeb, Plasma Etch, Analog, Reliability

Education
Dynamic Worldwide Training   2013 — 2014
Certified in Word and Excel, Certified Medical Administrative Assistant/Billing and Coding Specialist

Chandler/Gilbert Community College   1996 — 1999
AA, Semiconductor Manufacturing Technology

University of North Texas   1974 — 1976
Bachelor of Science (BS), Housing

Rey Alvarado Rey Alvarado San Diego, California Details
Rey Alvarado's FlipChip International Experience May 2000 - August 2007
Job QTI, WLP Characterization group
Industry Semiconductors
Experience
Qualcomm  July 2012 - Present
Maxim Integrated Products  April 2008 - July 2012
FlipChip International   May 2000 - August 2007
JME (Johnson Matthey Electronics)   June 1996 - April 2000
Texas Instruments, Philippines, Inc   April 1983 - May 1996

Skills
Product Engineering, Semiconductors, IC, Program Management, Semiconductor Industry, Failure Analysis, Design of Experiments, JMP, Manufacturing, PCB design, Reliability, Six Sigma, ASIC, Analog, Analog Circuit Design, CMOS, Characterization, Continuous Improvement, Cross-functional Team..., Electronics, Engineering Management, MEMS, Mixed Signal, Process Engineering, R, Root Cause Analysis, SPC, Signal Integrity, Silicon

Education
Mapua Institute of Technology   1977 — 1983

Pam Broadhurst Pam Broadhurst Sarasota, Florida Area Details
Pam Broadhurst's FlipChip International Experience October 1996 - Present
Job Mask Designer at FlipChip International
Industry Semiconductors
Experience
FlipChip International   October 1996 - Present
SGS  September 1995 - October 1996
US Airways  February 1988 - December 1995
US Navy  April 1981 - April 1985

Education
University of Phoenix
BS-Marketing

Chorrushi-patino R-r Chorrushi-patino R-r Phoenix, Arizona Area Details
Chorrushi-patino R-r's FlipChip International Experience October 2009 - Present
Job Quality Engineering Manager and Owner, Patino Investments
Industry Wholesale
Experience
FlipChip International   October 2009 - Present
Avago Technologies  October 2008 - October 2009
Freescale Semiconductor  June 1999 - October 2008

Education
Arizona State University   1993 — 1998

David Luttrull David Luttrull Phoenix, Arizona Details
David Luttrull's FlipChip International Experience 2004 - 2007
Job Partner LP Analytical
Industry Research
Experience
LP Analytical, LLC   July 2014 - Present
Clear Path Technologies, Inc.   May 2008 - Present
Malcolm Grey, LLC   July 2007 - Present
Isola Group  January 2010 - November 2013
Flipchip International   2004 - 2007
Park Electrochemical Corporation   1997 - 2003
Nalco Chemical Company  1992 - 1995
National Science Foundation (NSF) Center for Charge Transfer Studies   1991 - 1992

Skills
R&D, Product Development, Cross-functional Team..., Continuous Improvement, Management, Semiconductors, Product Management, Product Marketing, Manufacturing, Strategic Planning, Program Management, Electronics, Project Management, Process Optimization, Business Intelligence, Analysis

Education
University of Rochester   1991 — 1992
Postdoctoral Fellow, Photochemistry

Arizona State University   1987 — 1991
Ph.D., Physical-Organic Chemistry

Bowling Green State University   1985 — 1987
M.S., Organic Chemistry

Point Loma Nazarene University   1982 — 1985
BA, Chemistry

Bernie Adams Bernie Adams San Diego, California Details
Bernie Adams's FlipChip International Experience 1998 - 2000
Job Director, Marketing (Qualcomm), Advanced Wafer Level,Products & Technology Marketing, STATS ChipPAC Inc.
Industry Semiconductors
Experience
STATS ChipPAC  January 2013 - Present
Cleanpart US LLC, Hohnloser Group   August 2011 - November 2012
Adams Brothers Inc.   June 2010 - July 2011
QuantumClean  2007 - June 2010
Adams Acquisitions LLC   April 2005 - April 2007
Leica Microsystems (Vistec)   January 2001 - April 2005
Electroglas  2000 - 2001
Flipchip International   1998 - 2000
Kulicke and Soffa Industries  1997 - 1998

Skills
Semiconductors, Manufacturing, Cross-functional Team..., ISO Certifications, Product Development, Sales Operations, Strategy, Selling, Leadership, Engineering, Business Development, Account Management, Sales, Forecasting, Supply Chain, Marketing Strategy, Project Management, Sales Process, B2B, Negotiation, Budgets, Product Management, Manufacture

Education
University of Pittsburgh - Joseph M. Katz Graduate School of Business   1993 — 1994
EMBA, International Finance

Purdue University   1978 — 1982
BS, Electrical Engineering

Michelle Monroe Michelle Monroe Chandler, Arizona Details
Michelle Monroe's FlipChip International Experience June 2012 - October 2014
Job Manufacturing Technician at FlipChip International
Industry Semiconductors
Experience
Freeport-McMoRan  May 2015 - Present
FlipChip International   June 2012 - October 2014

Education
Computer Career Center a division of Vista College   2010 — 2011
Network and System Administration/Administrator

Ryan Rieck Ryan Rieck Phoenix, Arizona Details
Ryan Rieck's FlipChip International Experience January 2006 - Present
Job Design Engineer at FlipChip International
Industry Semiconductors
Experience
FlipChip International   January 2006 - Present
Laminate Technologies Inc.  May 1998 - September 2005
Dynaco Corp   June 1987 - May 1998

Skills
Semiconductors, Semiconductor Industry, IC, CMOS, Design of Experiments

Education
ITT Technical Institute-Phoenix   1986 — 1987
Associate's degree, Computer Aided Design

David Wilkie David Wilkie Phoenix, Arizona Area Details
David Wilkie's FlipChip International Experience September 2013 - April 2015
Job Director of Product Supply Chain Planning at Microchip Technology Inc
Industry Semiconductors
Experience
Microchip Technology  April 2015 - Present
FlipChip International   September 2013 - April 2015
Microchip Technology  January 2010 - August 2013
Microchip Technology  March 2007 - January 2010
Microchip Technology  May 1999 - May 2007
Microchip Technology  1996 - 1999
Microchip Technology  October 1991 - 1996

Skills
Semiconductors, Semiconductor Industry, IC, ASIC, Manufacturing, Embedded Systems, Mixed Signal, Electronics, Engineering Management, Product Engineering, Debugging, Design of Experiments, Analog, Memory, EEPROM, Flash Memory, Business Strategy, New Business Development, Process Improvement, Program Management, CMOS, Product Development, System Architecture, Firmware, Testing, EDA, Reliability, Packaging

Education
Cranfield University   1990 — 1991
MSc, Astronautics and Space Engineering

The University of Edinburgh   1986 — 1990
BSc (Hons), Astrophysics

Richard Redburn Richard Redburn Phoenix, Arizona Area Details
Richard Redburn's FlipChip International Experience February 2007 - October 2012
Job Applications Engineer Photolithography
Industry Semiconductors
Experience
Global Communication Semiconductors,Inc.   March 2013 - February 2015
FlipChip International   February 2007 - October 2012
FlipChip International   January 2005 - February 2007
California Micro Devices  2002 - 2004
California Micro Devices  January 1996 - January 2002
Motorola  June 1995 - January 1996
GTE Microcircuits / California Micro Devices   October 1991 - June 1995

Skills
Semiconductor Industry, Packaging Engineering, Photolithography, Plasma Etch, Wet Chemical Etching, WLCSP, Semiconductors, SPC, Design of Experiments, Continuous Improvement, Six Sigma, Root Cause Analysis, Product Development, Engineering, Product Engineering, Process Engineering, Silicon, Reliability, Manufacturing, Failure Analysis, Process Simulation, Yield, Metrology, Thin Films, CMOS, Manufacturing..., JMP, Process Integration, Electronics, Testing, PECVD, Microelectronics, Lean Manufacturing, R&D, PVD, Characterization, Analog, Mixed Signal, Semiconductor..., IC, Etching, MEMS, CVD, Test Engineering, ASIC, PCB design, FMEA, Semiconductor Process, Engineering Management, Power Management

Education
Arizona State University   1994 — 2000
Bachelor of Science, Electrical Engineering

Robert Walesa, MSE, CSSGB Robert Walesa, MSE, CSSGB Tempe, Arizona Details
Robert Walesa, MSE, CSSGB's FlipChip International Experience April 2007 - May 2008
Job Sr. Process Development Engineer at Honeywell Aerospace
Industry Machinery
Experience
Honeywell Aerospace  April 2014 - October 2014
Stryker Sustainability Solutions  May 2013 - December 2013
Peter Wolters of America  July 2010 - October 2012
MicroPower Global Limited  September 2008 - August 2010
FlipChip International   April 2007 - May 2008
SpeedFam-IPEC  1998 - 2001
AGI, inc  1996 - 1997
AGI, inc  1996 - 1997

Skills
Materials Science, R&D, Process Engineering, Design of Experiments, CSSGB, Semiconductors, Thin Films, Characterization, Silicon, Failure Analysis, Process Simulation, SPC, Nanotechnology, PECVD, Sputtering, Six Sigma, Process Improvement, Manufacturing, PVD, Photolithography, Lean Manufacturing, FMEA

Education
Arizona State University
Master's Degree, Materials Engineering, 3.64/4.00

Arizona State University
Bachelor's Degree, Material Science Engineering

Fasil Tiru Fasil Tiru Greater Los Angeles Area Details
Fasil Tiru's FlipChip International Experience November 2009 - August 2011
Job Senior GIS Support Analyst at Esri
Industry Information Technology and Services
Experience
Esri  October 2012 - Present
Arizona State University, School of Geographical Sciences and Urban Planning   May 2012 - October 2012
FlipChip International   November 2009 - August 2011
Intel Corporation  May 2006 - January 2009

Skills
GIS, ArcGIS, GPS, ESRI, Geography, Remote Sensing, Spatial Analysis, AutoCAD, Cartography, Microsoft Office, Python, Google Earth, Data Management, ArcMap, Data Analysis, Data Collection

Education
Arizona State University   2011 — 2012
Masters of Advanced Study in Geographic Information Systems (MAS-GIS), Geographical Information Systems (GIS)

Arizona State University   2007 — 2011
BSc, Urban Planning and GIS

Arizona State University   2006 — 2008
Architectural Studies

Addis Ababa University   2000 — 2002
Architecture and Urban Planning

Andrew Strandjord Andrew Strandjord Sioux Falls, South Dakota Details
Andrew Strandjord's FlipChip International Experience February 2005 - January 2007
Job Professor of Organic Chemistry at Augustana College (SD)
Industry Higher Education
Experience
Augustana College (SD)   May 2014 - Present
PacTech   January 2008 - May 2014
WLCSP Forum   January 2009 - December 2012
dpiX  May 2007 - November 2007
Starkey Hearing Technologies  January 2007 - May 2007
International Microelectronics and Packaging Society   January 2005 - May 2007
FlipChip International   February 2005 - January 2007
IC Interconnect  July 1998 - February 2005
The Dow Chemical Company  October 1984 - July 1998
MCNC  August 1995 - July 1996

Skills
Manufacturing, Semiconductors, Design of Experiments, Semiconductor Industry, R&D, Electronics, Coatings, Characterization, Polymers, Materials Science, Failure Analysis, Microelectronics, IC, SPC, Silicon, Thin Films, Metrology

Education
University of Minnesota-Twin Cities   1979 — 1984
Doctor of Philosophy (Ph.D.), Organic Chemistry

Luther College   1975 — 1979
Bachelor's Degree, Chemistry, Physics, Biology

Moorhead High School   1971 — 1975
High School

Jon-Paul Enoch Jon-Paul Enoch Tempe, Arizona Details
Jon-Paul Enoch's FlipChip International Experience April 2000 - November 2001
Job Manufacturing Operations and Logistics Manager at Medtronic
Industry Medical Devices
Experience
Medtronic  July 2006 - Present
Medtronic  October 2003 - July 2006
Target  November 2001 - October 2003
FlipChip International   April 2000 - November 2001
Motorola  April 1998 - April 2000
Motorola  April 1993 - March 1998

Skills
Lean Sigma Green Belt..., Knowledge of Import..., Mentoring, Coaching,..., Experienced with ISO..., International Air..., Resource Conservation..., Occupational Safety..., Capacity Utilization, Utilized Theories of..., Proficient in...

Education
University of Phoenix   1999 — 2001
Master of Business Administration (MBA), Business Administration and Management, General

Huston-Tillotson University   1994 — 1996
Bachelor of Arts (BA), Business Administration and Management, General

Central Arizona College   1989 — 1991
Associate of Arts (AA), Business Administration and Management, General

Bret Trimmer Bret Trimmer Cleveland/Akron, Ohio Area Details
Bret Trimmer's FlipChip International Experience 2000 - 2007
Job ETM Applications Engineering Manager (Electronic Thermal Management for Consumer Electronics) at GrafTech International
Industry Electrical/Electronic Manufacturing
Experience
GrafTech International  April 2010 - Present
Radio Datacom, Inc.   January 2009 - July 2010
Amkor Technology  January 2008 - November 2008
FlipChip International   2000 - 2007
Flip Chip Technologies   2000 - 2004
Arch Chemicals  1996 - 2000
Olin Corporation  1996 - 2000
Teepak LLC  1987 - 1996

Skills
Semiconductors, Manufacturing, Product Development, Product Management, Sales, Electronics, Failure Analysis, Marketing, Engineering, Product Engineering, Semiconductor Industry, Design of Experiments, Engineering Management, Lean Manufacturing, Cross-functional Team..., Process Engineering, R&D, Continuous Improvement, SPC, Characterization, Program Management, Six Sigma, Testing, Root Cause Analysis, Reliability, Graphite TIMs, Graphite Heat Spreaders

Education
University of Colorado Boulder   1978 — 1984
BS, Chemical Engineering

University of Phoenix at Phoenix   1997 — 2000
MBA, Business

Dave Burroughs Dave Burroughs Tempe, Arizona Details
Dave Burroughs's FlipChip International Experience July 2007 - February 2011
Job Quality Engineer at SDC Materials, INC
Industry Nanotechnology
Experience
SDC Materials, INC  June 2015 - Present
SDC Materials   February 2011 - April 2015
FlipChip International   July 2007 - February 2011
Freescale Semiconductor  March 2006 - June 2007
Motorola Semiconductor  1997 - 2003
Motorola  1990 - 1996
Signetics  July 1987 - May 1990
Intel Corporation  May 1984 - July 1987
Anderson Clayton & Co   August 1982 - May 1984

Skills
Semiconductor Industry, Engineering Management, Process Engineering, Plasma Etch, Semiconductors, CVD, Design of Experiments, Manufacturing, SPC, PECVD, Cross-functional Team..., Failure Analysis, Six Sigma, Diffusion, Electronics, Continuous Improvement, Engineering, JMP, Lean Manufacturing, Metrology, Thin Films, Silicon, R&D, Characterization, Yield, FMEA, IC, Product Engineering, Process Simulation, Leadership, Photolithography, PVD, Materials Science, Plasma Physics, Intel, Microelectronics, MEMS, Nanotechnology, CMOS, Root Cause Analysis, Process Integration, Etching, Lithography, Coatings, Semiconductor Process, Powder X-ray Diffraction, Atomic Layer Deposition, Electroplating, Semiconductor..., Device Characterization

Education
Arizona State University   1980 — 1982
BSE

Heather Lawrence Heather Lawrence Phoenix, Arizona Area Details
Heather Lawrence's FlipChip International Experience February 2001 - May 2005
Job Project Manager at Fujitsu
Industry Real Estate
Experience
Fujitsu  February 2012 - Present
Solutions Real Estate  April 2011 - Present
Keller Williams Integrity First Realty  October 2009 - April 2011
Honeywell Aerospace  September 2008 - November 2008
Honeywell Information Systems  September 2005 - October 2006
FlipChip International   February 2001 - May 2005
DCI Management   January 2000 - February 2001
Lawrence Semiconductor Laboratories Marketing & Sales, Inc.   September 1989 - September 1998

Skills
Project Management, Customer Service, Sales, Process Improvement, Semiconductors, Management, Vendor Management, Human Resources, Operations Management, Payroll, SAP, PMO, Manufacturing, Marketing, Cross-functional Team..., Finance, Contract Negotiation, Infrastructure, Testing, Negotiation, Leadership, Retail, Databases, Auditing, Real Estate, Program Management, New Business Development, Invoicing, Problem Solving, Residential Homes, Data Center, Accounting, Integration, Sales Management, Business Development, Six Sigma

Education
Arizona State University
Family Resources & Human Development, Human Development and Family Studies, General

Brian Storment Brian Storment Gilbert, Arizona Details
Brian Storment's FlipChip International Experience September 2007 - Present
Job President/CEO at Torment CNC Machining
Industry Semiconductors
Experience
Torment CNC Machining   September 2009 - Present
FlipChip International   September 2007 - Present
Lam Research  February 1995 - September 2007

Skills
Semiconductors, Photolithography, Silicon, Semiconductor Industry, Electronics, Manufacturing, Failure Analysis, Continuous Improvement, Design of Experiments, SPC, Metrology, Six Sigma, Cross-functional Team..., Lean Manufacturing, Engineering, Troubleshooting, Root Cause Analysis, Engineering Management, CVD, Process Engineering, Testing, IC, FMEA, Automation, Thin Films, Analog, Robotics, PVD, Reliability, Product Development, R, Manufacturing..., ISO, Product Engineering

Education
DeVry University Phoenix, AZ   1992 — 1994
Associate's degree, Electrical and Electronics Engineering

Michael Wahlbrink Michael Wahlbrink Greater Seattle Area Details
Michael Wahlbrink's FlipChip International Experience March 2005 - December 2006
Job Experienced Human Resources Champion/Sr. Certified Military Enrollment Advisor
Industry Human Resources
Experience
University of Phoenix  August 2010 - Present
Creative Human Resources   January 2007 - August 2008
FlipChip International   March 2005 - December 2006
Captive Plastics  August 1997 - February 2005

Skills
Employee Relations, Change Management, Human Resources, Succession Planning, Employee Benefits, Program Management, HR Consulting, Organizational..., Team Building, Leadership Development, Strategic Planning, Performance Management, Labor Relations, Coaching, Mergers, Management, Leadership

Education
University of Phoenix   1996 — 1998
MBA, International Business

Park College   1990 — 1992
BS, HR Management

William Beaty William Beaty Phoenix, Arizona Area Details
William Beaty's FlipChip International Experience January 2005 - January 2008
Job Test Specialist at Raytheon
Industry Electrical/Electronic Manufacturing
Experience
Raytheon  March 2015 - Present
GT Advanced Technologies  January 2014 - November 2014
Jabil  July 2010 - January 2014
Nutraceutical Corporation  July 2009 - July 2010
2Wire  November 2008 - July 2009
FlipChip International   January 2005 - January 2008
Intel Corporation  June 2000 - January 2005

Skills
SMT, Test Equipment, Electronics, Soldering, Electronics..., Power Supplies, Multimeter, Electronics Repair, Oscilloscope, Electro-mechanical, Spectrum Analyzer, Calibration, Signal Generators, Schematic, Test Engineering, Digital Electronics, Electrical..., PCB design, Wiring, Equipment Repair, Electronic Engineering, Failure Analysis, Hand Tools, Equipment Maintenance, Metrology, Equipment Installation, ESD control, Pneumatics, Power Electronics, Analog, PLC Allen Bradley, AC/DC, RF, PLC Ladder Logic, Schematic Capture, Components, Orcad, Preventive Maintenance, PCB Design, Manufacturing, Lean Manufacturing

Education
Arizona State University   2006 — 2008
Bachelor's Degree, Operations Management and Supervision, 3.89

Mesa Community College   1998 — 2000
Associate's degree, Electrical, Electronic and Communications Engineering Technology/Technician

michael trone michael trone Tempe, Arizona Details
michael trone's FlipChip International Experience February 2012 - Present
Job manufacturing technician at FlipChip International
Industry Semiconductors
Experience
FlipChip International   February 2012 - Present
International Rectifier  February 2011 - January 2012
Microsemi Corporation  October 2004 - December 2010

Skills
Semiconductors, Semiconductor Industry, Business Intelligence, Economics, Business, Manufacturing, Access, Process Engineering, Cross-functional Team..., FMEA, Continuous Improvement, Failure Analysis, Root Cause Analysis, Engineering Management, Lean Manufacturing, Six Sigma, Design of Experiments, Electronics, SPC

Education
Arizona State University   2001 — 2014
Bachelor's Degree, Interdisciplinary Studies Business/Economics, Senior

Cindy Petronis Cindy Petronis Phoenix, Arizona Area Details
Cindy Petronis's FlipChip International Experience 2013 - Present
Job Product Engineer at FlipChip International
Industry Semiconductors
Experience
FlipChip International   2013 - Present
SUMCO USA  2008 - 2013
STMicroelectronics  1998 - 2008
CFM Technologies  1996 - 1998

Skills
Silicon, Semiconductor Industry, Etching, Plasma Etch, Materials Science, Process Engineering, SPC, Semiconductors, Design of Experiments, Failure Analysis, Metrology, Thin Films, FMEA, JMP, CVD, Etch, CMOS, Process Integration, Characterization, Manufacturing, Root Cause Analysis, ISO, TS16949, Auditing, Quality System, 8D Problem Solving, Change Control, Environmental Monitoring, BiCMOS, Lean Manufacturing, PVD

Education
Lehigh University   1994 — 1996
M.S., Materials Science and Engineering

Rensselaer Polytechnic Institute   1990 — 1994
B.S., Materials Engineering

Brian Rooney Brian Rooney Raleigh-Durham, North Carolina Area Details
Brian Rooney's FlipChip International Experience February 1999 - July 2004
Job
Industry Computer Software
Experience
PRA Health Sciences  July 2014 - Present
Quintiles  October 2011 - June 2014
FileONE  March 2011 - September 2011
CREE, Inc  November 2008 - March 2011
Wachovia Securities  February 2008 - November 2008
CIRCUIT CITY STORES  October 2006 - February 2008
INFINEON TECHNOLOGIES / QIMONDA   August 2004 - October 2006
FlipChip International   February 1999 - July 2004
Brooks Automation  January 1998 - September 1998
Motorola Solutions  May 1996 - January 1998

Skills
Business Analysis, Requirements Gathering, Requirements Analysis, Requirements Management, Agile, SDLC, Testing, User Acceptance Testing, Data Analysis, Software Project..., SQL, SQL Server, Six Sigma, Problem Solving, Business Process..., Documentation, Microsoft SQL Server, Software Documentation, XML, Unix, Business Process, Visual Basic, Visio, Agile Methodologies

Education
University of Florida   1989 — 1992
BS, Materials Science Engineering

University of Phoenix
Masters, Business Administration

Aveta Business Institute
Green Belt Certification, Six Sigma

Fred E. Hickman III Fred E. Hickman III Phoenix, Arizona Area Details
Fred E. Hickman III's FlipChip International Experience September 2005 - September 2007
Job Product Director at Isola Group
Industry Semiconductors
Experience
Isola Group  October 2007 - Present
FlipChip International   September 2005 - September 2007
Carolina Circuits   1987 - 1991
Hadco  1983 - 1987

Skills
Certified Arizona Home..., Notary Public, Master Redwood Carver, Product Marketing, Manufacturing, Product Development, Electronics, Cross-functional Team...

Education
University of South Carolina-Columbia   1975 — 1980
Bachelor of Science (BS), Chemistry

University of South Carolina-Columbia

University of South Carolina-Columbia

Kenneth Wolf Kenneth Wolf Phoenix, Arizona Area Details
Kenneth Wolf's FlipChip International Experience 1996 - 1999
Job Director of Quality at Icon Injection Molding
Industry Consumer Goods
Experience
Icon Injection Molding   June 2015 - Present
Colonial Saw   January 2011 - January 2015
Wright Machine Tool   January 2008 - May 2011
Intel  January 2004 - March 2007
FlipChip International   1996 - 1999

Skills
Wide range of..., Recognized Team..., Operational Risk..., Strategic planning, Value Stream Mapping, SPC, Leadership, Organization, Strategic Planning, Manufacturing..., Operations Management, Engineering, Cross-functional Team..., Lean Manufacturing, Semiconductors, Kaizen, Manufacturing Operations, Team Building, Continuous Improvement, Six Sigma, Manufacturing...

Education
University of Phoenix   1994 — 1999
Bachelor of Science (BS), Business Administration, Management and Operations

University of Phoenix   1992 — 1996
Bachelor of Science (B.S.), Business Administration and Management, General

James Zaccardi James Zaccardi Phoenix, Arizona Area Details
James Zaccardi's FlipChip International Experience April 2013 - Present
Job Senior R&D Engineer Flipchip International
Industry Electrical/Electronic Manufacturing
Experience
FlipChip International   April 2013 - Present
Microsemi  February 2002 - April 2013
FlipChip International   1998 - 2002
FlipChip Technologies/KNS FCD   1998 - 2002

Skills
Failure Analysis, Manufacturing, R&D, Engineering, Product Development, Test Equipment, Yield, Materials, Medical Devices, Semiconductors, Validation, Design of Experiments

Education
University of Pittsburgh   1986 — 1990
Bachelor of Science (BS), Chemistry

Joshua Schubert Joshua Schubert Phoenix, Arizona Area Details
Joshua Schubert's FlipChip International Experience September 2007 - December 2008
Job Professional "Headline"
Industry Information Technology and Services
Experience
GoDaddy.com  April 2009 - Present
FlipChip International   September 2007 - December 2008
FlipChip International   October 2003 - September 2007

Education
Devry University   2002 — 2005
bs, Technical Management

DeVry University Phoenix   2001 — 2004
bs, Technical Management

Bonnie Kosatka Bonnie Kosatka Phoenix, Arizona Area Details
Bonnie Kosatka's FlipChip International Experience November 1996 - February 2008
Job RAW MATERIALS BUYER at Northstar Aerospace
Industry Semiconductors
Experience
Northstar Aerospace  June 2008 - Present
D-Velco Manufacturing of Arizona   June 2008 - June 2011
FlipChip International   November 1996 - February 2008

Skills
Manufacturing, Semiconductor Industry, Six Sigma, Continuous Improvement, Lean Manufacturing, Purchasing, Semiconductors, SPC, Cross-functional Team..., Supply Chain Management, Root Cause Analysis, MRP, FMEA, Supply Management, ISO, 5S, DMAIC, AS9100, Engineering Management, Quality System, Value Stream Mapping, Engineering, Process Engineering, Black Belt, APQP, TQM, Supplier Quality, Process Improvement

Education
University of Phoenix   1976 — 1996

Cheryl Sherwood Cheryl Sherwood Phoenix, Arizona Area Details
Cheryl Sherwood's FlipChip International Experience August 2009 - September 2014
Job Process Technician at FlipChip International
Industry Semiconductors
Experience
FlipChip International   August 2009 - September 2014
Freescale Semiconductor  2002 - 2008
Motorola Semiconductor  1994 - 2002
Motorola Semiconductor  1992 - 1994
Motorola Semiconductor  1989 - 1992

Skills
Process Engineering, Electronics, Manufacturing, Troubleshooting, Process Improvement, Testing, CMOS, Semiconductors, Semiconductor Industry, SPC, Silicon, ASIC, Leadership, Plasma Etch, Metrology, Equipment Maintenance, Root Cause Analysis, Automation, Process Integration, Preventive Maintenance, PCB design, Engineering Management, Design of Experiments, Sensors, Lean Manufacturing, Lithography, Product Engineering, Project Management, Electricians, Oscilloscope, Software Documentation, RF, Electrical Engineering, JMP, Yield, Process Simulation, Microelectronics, Reliability, PVD, DMAIC, Manufacturing..., IC, Failure Analysis

Education
Glendale Community College   1986 — 1989
AAS, Computer Electronics

Darryl Hill Darryl Hill Phoenix, Arizona Area Details
Darryl Hill's FlipChip International Experience 2003 - 2004
Job Automation Manager at WD, a Western Digital company
Industry Semiconductors
Experience
WD, a Western Digital company  February 2011 - Present
ST Microelectronics  January 2007 - February 2011
Microchip Technology  2004 - 2006
FlipChip International   2003 - 2004
Brooks Automation  1999 - 2003
Electronic Data Systems  1995 - 1999
Electronic Data Systems  1991 - 1995
Electronic Data Systems  1987 - 1991

Skills
System Architecture, Software Development, Automation, Semiconductor Industry, C#, Object Oriented Design, SQL, Agile Methodologies, Testing, Integration, Debugging, Program Management, Manufacturing, Microsoft SQL Server, Continuous Improvement, Troubleshooting, Unix, Cross-functional Team..., Process Improvement, Storage, IC, Perl, Hardware, Linux, TCL, SPC

Education
Anderson University   1982 — 1986
Bachelor’s Degree, Mathematics

Tom Strothmann Tom Strothmann Greater Philadelphia Area Details
Tom Strothmann's FlipChip International Experience February 2004 - February 2008
Job Advanced Packaging Marketing Director at Kulicke and Soffa
Industry Electrical/Electronic Manufacturing
Experience
Kulicke and Soffa  July 2014 - Present
STATS ChipPAC  April 2008 - July 2014
FlipChip International   February 2004 - February 2008
Flipchip Technologies   October 1996 - February 2004

Skills
Start-ups, Semiconductors, Business Development, IC, Product Development, Semiconductor Industry, Manufacturing, Silicon, Design of Experiments, SPC, Product Engineering, R&D, Electronics, Engineering Management, Continuous Improvement

Education
University of Kansas

Joan Vrtis, Ph.D. Joan Vrtis, Ph.D. Phoenix, Arizona Area Details
Joan Vrtis, Ph.D.'s FlipChip International Experience February 2004 - August 2006
Job Sr. Director of Interconnect Technology Center at Flextronics
Industry Biotechnology
Experience
Multek  January 2015 - Present
Flextronics  May 2013 - December 2014
Shocking Technologies, Inc.   June 2011 - March 2013
eKubik Consulting, LLC   May 2002 - August 2011
Kemeta, LLC   February 2010 - January 2011
Kemeta, LLC   2007 - 2010
FlipChip International   February 2004 - August 2006
Intel  1994 - 2003

Skills
Semiconductors, Product Development, Cross-functional Team..., R&D, Manufacturing, Product Management, Engineering Management, Start-ups, Product Marketing, Process Engineering, Engineering, Electronics, Program Management, Six Sigma, Strategic Partnerships, Lean Manufacturing, Medical Devices, New Business Development

Education
University of Massachusetts, Amherst   1990 — 1994
PhD, Polymer Science & Engineering

University of Massachusetts, Amherst   1990 — 1992
MS, Polymer Science and Engineering

Illinois Institute of Technology   1986 — 1990
MS, Metallurgical and Materials Engineering

DePaul University - Charles H. Kellstadt Graduate School of Business   1986 — 1989
MBA, Entrepreneurship

University of Illinois at Chicago   1976 — 1981
BS, Chemistry

Charles/Chuck Schneider Charles/Chuck Schneider Gilbert, Arizona Details
Charles/Chuck Schneider's FlipChip International Experience May 1997 - November 1999
Job president at Schneider Development
Industry Construction
Experience
Schneider Development General contracting   September 2005 - Present
Phoenician Creative Environments   September 2005 - Present
United Sustainable Energy   April 2008 - February 2010
PurePak Technology   November 1999 - November 2002
FlipChip International   May 1997 - November 1999
Air Products and Chemicals  May 1991 - May 1997
Intel Corporation  January 1986 - May 1991

Skills
Product Development, Manufacturing, Cross-functional Team..., Operations Management, Strategic Planning, Process Improvement, Continuous Improvement, Lean Manufacturing, Contract Negotiation, New Business Development, Troubleshooting, Design of Experiments, Residential Homes, Program Management, Semiconductors, Business Strategy, Project Planning, Restoration, Negotiation, Competitive Analysis, Electronics, Solar Energy, Start-ups, Semiconductor Industry, R&D, Business Development, Business Planning, Strategy, Product Management, Process Engineering, Engineering Management, Engineering

Education
University of Arizona   1974 — 1978
Bachelor of Applied Science (BASc), Chemistry/Psychology

Camelback High School   1969 — 1973
science

David Hays David Hays Raleigh-Durham, North Carolina Area Details
David Hays's FlipChip International Experience September 2012 - June 2013
Job Director Business Development at Process Technology
Industry Semiconductors
Experience
Process Technology  June 2015 - Present
Carsem  June 2014 - May 2015
FlipChip International   September 2012 - June 2013
Progression Solutions   January 2010 - September 2012
Amkor Technology  June 2003 - June 2009
Miller Heiman  2003 - 2003
Semitool  1995 - 2002
Intergraph  1989 - 1995
Teradyne  1979 - 1985
Hewlett Packard (now Agilent Technologies)   1977 - 1979

Skills
Semiconductors, Manufacturing, Electronics, Semiconductor Industry, New Business Development, Strategy, Testing, Direct Sales, SPC, Product Management, IC, Lithography, RF, Metrology, Semiconductor Packaging, Sales Management, Electroplating, Sales Process, Entrepreneurship, Instrumentation, Capital Equipment, Account Management, Director level, Leadership, Capital Equipment Sales, Miller-Heiman Strategic..., Global Account..., Electronics..., Customer service..., Entrepreneur, Company Representation, 3D Packaging, WLP, CAD/CAM software, IC packaging

Education
Purdue University   1973 — 1977
BSEE, Electrical Engineering

Jon Aday Jon Aday Greater San Diego Area Details
Jon Aday's FlipChip International Experience August 2012 - October 2013
Job Senior Staff Engineer at Qualcomm
Industry Semiconductors
Experience
Qualcomm  October 2013 - Present
FlipChip International   August 2012 - October 2013
Amkor Technology  November 1999 - April 2012
Medtronic  February 1999 - November 1999
Motorola Semiconductor  August 1996 - February 1999
Motorola  October 1994 - August 1996

Skills
Product Development, Substrates, Flip Chip, Semiconductors, Microelectronics, Semiconductor Packaging, Supply Management, Packaging, Supply Chain Management, Electronics Packaging, IC, Silicon, JMP, Design of Experiments

Education
Auburn University   1992 — 1994
Masters, Electrical Engineering

Auburn University   1987 — 1992
Bachelors, EE

Marcus Crayon Marcus Crayon Phoenix, Arizona Area Details
Marcus Crayon's FlipChip International Experience February 2007 - January 2010
Job Customer Quality Engineering at Freescale Semiconductor
Industry Semiconductors
Experience
Freescale Semiconductor  2010 - Present
FlipChip International   February 2007 - January 2010
Freescale Semiconductor  2005 - February 2007
Motorola Semiconductor  1998 - 2005
Motorola Semiconductor  1990 - 1998

Skills
Manufacturing, Continuous Improvement, Flip Chip, WLP, Semiconductors, SPC, Design of Experiments, Six Sigma, Semiconductor Industry, Electronics, Cross-functional Team..., Failure Analysis, Lean Manufacturing, Process Engineering, Reliability, Management, Engineering Management, Process Improvement, Product Development, JMP, Customer Service, Program Management, FMEA, Yield, Quality Assurance, Analog, Root Cause Analysis, Engineering, Reliability Engineering, Statistics, Contract Negotiation, IC, DMAIC

Education
Arizona State University

University of Phoenix

Brett Martin, CPA Brett Martin, CPA Phoenix, Arizona Area Details
Brett Martin, CPA's FlipChip International Experience November 2005 - March 2007
Job Senior Accountant at Southwest College of Naturopathic Medicine
Industry Accounting
Experience
Southwest College of Naturopathic Medicine  May 2012 - Present
US Airways  March 2007 - 2012
FlipChip International   November 2005 - March 2007
Thornwood furniture Mfg   September 2003 - November 2005
Office of the Auditor General of Arizona  January 2000 - September 2003

Education
Mesa Community College   1984 — 2019

University of Phoenix   1997 — 1999
BS, Accounting and Business/Management

Robert Constantine Robert Constantine Phoenix, Arizona Area Details
Robert Constantine's FlipChip International Experience March 2012 - Present
Job Equipment Engineer at FlipChip International
Industry Semiconductors
Experience
FlipChip International   March 2012 - Present
Western Digital  May 2011 - March 2012
ST Microelectronics  January 2000 - May 2011
STEAG Microelectronics   November 1995 - January 2000
IBM  January 1984 - October 1995

Skills
Semiconductors, Failure Analysis, Analog, Microelectronics, SPC, Semiconductor Industry, CVD, Silicon, IC, CMOS, PVD, Metrology, Thin Films, Design of Experiments, Electronics, Field Service, ASIC, FMEA, Debugging, Mixed Signal, Engineering Management, Sputtering, Etching, Plasma Etch, SoC, Characterization, Sensors, Vacuum, Robotics, Manufacturing, Yield, R&D, Semiconductor Process, Product Engineering, Process Engineering, Reliability, Labview, Nanotechnology, MEMS, JMP, Equipment Maintenance, Electro-mechanical, PECVD, Intel, Test Equipment, Photolithography, RF, Clean Rooms, Process Simulation, Diffusion

Education
State University of New York at Stony Brook   1979 — 1983
Bachelors of Science, Electrical Engineering

Ray Lawrence Ray Lawrence Phoenix, Arizona Area Details
Ray Lawrence's FlipChip International Experience November 2009 - Present
Job at FlipChip International
Industry Semiconductors
Experience
FlipChip International   November 2009 - Present
Freescale Semiconductor  December 1997 - December 2009
Motorola Semiconductor  September 1993 - August 1997

Education
Arizona State University   1993 — 1999
BS, Mechanical Engineering

Tony Curtis Tony Curtis Phoenix, Arizona Area Details
Tony Curtis's FlipChip International Experience August 2015 - Present
Job Deputy General Manager at FlipChip International
Industry Semiconductors
Experience
FlipChip International   August 2015 - Present
FlipChip International   January 2013 - August 2015
FlipChip International   January 2005 - January 2013
FlipChip International   September 2000 - January 2005
Motorola  June 1995 - September 2000

Skills
Technical Product Sales, Wafer Level Packaging, New Business Development, Strategic Marketing, Business Strategy, Corporate Branding, Wafer Fab, Photolithography, Wireless Industry..., Semiconductors, Mobile Devices, Design of Experiments, Failure Analysis, Semiconductor Industry, SPC, Reliability, Research and Development, Silicon, Material..., Engineering Management, Root Cause Analysis, IC, Electronics, Manufacturing

Education
Grand Canyon University   1994 — 1996
Bachelor's Degree, Biology

cliff crull cliff crull Phoenix, Arizona Area Details
cliff crull's FlipChip International Experience 1998 - 1999
Job associate at VWR
Industry Aviation & Aerospace
Experience
VWR  September 2010 - Present
Goodrich  2006 - 2009
Rogers Corporation  2000 - 2006
FlipChip International   1998 - 1999
Honeywell  1988 - 1998

Skills
Engineering, Six Sigma, Manufacturing, Design of Experiments, Process Engineering, Failure Analysis, R&D, Lean Manufacturing, Materials Science, Product Development, Materials, SPC, Green Belt, Testing, Process Simulation, Water Treatment

Education
University of Newcastle
Bachelor's Degree, Materials Engineering

Shannon Buzard Shannon Buzard Phoenix, Arizona Area Details
Shannon Buzard's FlipChip International Experience January 2010 - Present
Job Advanced Product Engineer at FlipChip International
Industry Semiconductors
Experience
FlipChip International   January 2010 - Present
Cypress Semiconductor  April 2002 - September 2009
Andigilog  2000 - 2001
ON Semiconductor  1997 - 2001
Motorola Semiconductor  1992 - 1997

Skills
Semiconductors, Mixed Signal, IC, Product Engineering, Engineering Management, SPC, Product Management, CMOS, SoC, Debugging, Firmware, Electronics, Analog Circuit Design, Semiconductor Industry, Silicon, Yield, Analog, Failure Analysis, PCB design, ASIC

Education
Arizona State University   1990 — 1993
BSE, Electrical Engineering

Mary Farnum Mary Farnum Greater Detroit Area Details
Mary Farnum's FlipChip International Experience September 2000 - May 2001
Job Material Planner 2 at Yazaki North America
Industry Automotive
Experience
Yazaki North America  February 2013 - Present
FANUC Robotics  August 2010 - February 2013
Inteva Products - Orion Cockpit Ops   February 2009 - June 2009
Microchip Technology  May 2007 - February 2009
PSI Repair Services, Inc. @ Freescale Semiconductor   October 2006 - May 2007
SPX Contech (former Ryken Tube Mfg.)   December 2004 - October 2006
Meridian Automotive Systems  March 2004 - October 2004
Contract  June 2002 - October 2002
FlipChip International   September 2000 - May 2001
California Micro Devices  June 1997 - September 2000

Skills
Continuous Improvement, Materials Management, Automotive, Lean Manufacturing, Manufacturing, Management, Engineering, ISO/TS 16949, MRP, Root Cause Analysis, SAP, PPAP, Product Development, Six Sigma

Education
University of Phoenix   2009 — 2011
MS, Master of Science in Accountancy, 3.0

Michigan State University   1984 — 1989
BA, Materials & Logistics Mgt--Purchasing & Operations, 3.3

Barbara Landini Barbara Landini Phoenix, Arizona Area Details
Barbara Landini's FlipChip International Experience 2004 - 2006
Job Business and Development Manager at Sumika Electronic Materials
Industry Semiconductors
Experience
Sumika Electronic Materials  2010 - Present
Kemeta   2007 - 2010
FlipChip International   2004 - 2006
Kopin Corporation  2000 - 2004
Advanced Technology Materials, Inc.   1995 - 2000

Skills
Crystal Growth, Materials Science, Semiconductors, Characterization, Product Development, Thin Films, R&D, Metrology, Manufacturing, Device Characterization, Semiconductor Industry, Electronics, Optics, Sensors, SPC, Epitaxy, Solar Cells, Materials, Silicon, MOCVD, Laser, Nanomaterials, Design of Experiments, Photovoltaics, IC, MEMS, Failure Analysis, Microelectronics, GaN, GAAS, Photonics, JMP, Sputtering, Etching, Mixed Signal, PECVD, Analog, Product Engineering, Nanotechnology, PVD, CVD, Yield, Optoelectronics, CMOS, Engineering Management, Photolithography

Education
University of Massachusetts, Amherst
Ph.D., M.S., B.S., Electrical Engineering

Gene Stout Gene Stout Phoenix, Arizona Area Details
Gene Stout's FlipChip International Experience
Job Senior Product Engineer at FlipChip International
Industry Electrical/Electronic Manufacturing
Experience
FlipChip International  

Skills
SPC, Manufacturing, FMEA, Design of Experiments, Lean Manufacturing, Six Sigma, Root Cause Analysis, Engineering, Semiconductors, Manufacturing...

Education
DePaul University   2001 — 2004
Master of Business Administration (MBA)

University of Illinois at Urbana-Champaign   1995 — 1997
Master of Science (M.S.), Theoretical and Applied Mechanics

Rensselaer Polytechnic Institute   1990 — 1994
Bachelor of Science (BS), Mechanical Engineering

University High School

Mark Dhaenens Mark Dhaenens Phoenix, Arizona Area Details
Mark Dhaenens's FlipChip International Experience January 2008 - February 2011
Job Engineering Manager at Isola Group
Industry Semiconductors
Experience
Isola Group  February 2011 - Present
FlipChip International   January 2008 - February 2011
FlipChip International   September 2005 - January 2008
Park Electrochemical (Neltec)   October 1998 - September 2005

Skills
Process Engineering, SPC, Manufacturing, Design of Experiments, Project Management, Continuous Improvement, Six Sigma, DMAIC, Value Stream Mapping, Product Development, Engineering, Process Improvement, Engineering Management, 5S, Failure Analysis, Management, Cross-functional Team..., Lean Manufacturing, Semiconductors, Silicon, Semiconductor Industry, ISO, Testing, Kaizen, Thin Films, Electronics, Manufacturing..., R&D, PVD, Root Cause Analysis, Product Engineering, Metrology, FMEA, Manufacturing..., Design for Manufacturing, Plasma Etch, Yield, Process Simulation, Process Integration, PECVD, CVD, Photolithography, Etching

Education
Arizona State University   1979 — 1983
Bachelor of Science

Mario Moreno Mario Moreno Phoenix, Arizona Area Details
Mario Moreno's FlipChip International Experience January 2001 - November 2007
Job Pharmacy Operations Manager at Express Scripts
Industry Semiconductors
Experience
Express Scripts  February 2015 - Present
GT Advanced Technologies  March 2014 - February 2015
International Rectifier  April 2010 - March 2014
Microsemi Corp Scottsdale   2007 - April 2010
FlipChip International   January 2001 - November 2007
Motorola  1996 - 2001

Skills
Process Engineering, Distribution Center..., Silicon, Engineering, Continuous Improvement, Cross-functional Team..., Design of Experiments, Electronics, Engineering Management, FMEA, Failure Analysis, Kaizen, Lean Manufacturing, Automation, MRP, Manufacturing, Manufacturing..., Manufacturing..., Metrology, Power Supplies, SPC, Semiconductor Industry, Root Cause Analysis, Semiconductors, Supply Chain, Supply Chain Management, Six Sigma, Thin Films, Troubleshooting

Education
University of Phoenix   2008 — 2012
BBM, Business Administration, Management and Operations

Mesa Community College   1997 — 2000
Associate of Arts (A.A.), general study

Shayna Morrow Shayna Morrow Phoenix, Arizona Details
Shayna Morrow's FlipChip International Experience August 2015 - Present
Job Planning and Logistics at FlipChip International
Industry Semiconductors
Experience
FlipChip International   August 2015 - Present
FlipChip International   March 2015 - August 2015
FlipChip International   July 2012 - March 2015
FlipChip International   April 2011 - July 2012
FlipChip International   October 2010 - April 2011

Skills
Semiconductors, SPC, Silicon, Semiconductor Industry, Photolithography, Electronics, Manufacturing, Process Engineering, Engineering Management, Engineering, Continuous Improvement, Root Cause Analysis, Troubleshooting, Preventive Maintenance, Automation, ISO, Metrology, FMEA, Design of Experiments, Failure Analysis, Lean Manufacturing, Cross-functional Team...

Education
DeVry University Phoenix   2012 — 2013
Bachelors of Science in Technical Management

DeVry University   2008 — 2010
AAS in Computer Science, Electronics

Thong Dang Thong Dang Summerfield, North Carolina Details
Thong Dang's FlipChip International Experience 2000 - 2001
Job Staff Packaging Engineer at QORVO
Industry Semiconductors
Experience
Qorvo (RFMD)   June 2007 - Present
Amkor Technology  2004 - June 2007
California Micro Devices  2001 - 2004
FlipChip International   2000 - 2001
Motorola  1994 - 2000

Education
University of Phoenix   1997 — 2000
Master of Business Administration (M.B.A.)

Arizona State University   1988 — 1991
Bachelor of Science (B.S.)

Beren Deatherage Beren Deatherage Scottsdale, Arizona Details
Beren Deatherage's FlipChip International Experience July 2012 - Present
Job Electrical/Electronic Manufacturing Professional
Industry Electrical/Electronic Manufacturing
Experience
FlipChip International   July 2012 - Present
L-3 communications  July 2003 - July 2012
Motorola  June 1997 - February 2003

Skills
Preventive Maintenance, Electrical..., Electronics, Clean Rooms, Manufacturing, Automation, Calibration, Continuous Improvement, Cross-functional Team..., Design of Experiments, Electro-mechanical, Equipment Maintenance, Failure Analysis, Field Service, Inspection, Lean Manufacturing, Maintenance, Pneumatics, Pumps, Robotics, SPC, Semiconductor Industry, Semiconductors, Six Sigma, Soldering, Test Equipment, Troubleshooting

Education
Mesa Community College   2009 — 2012
Associate's degree, Accounting and Business/Management, 3.6

Mesa Community College   2008 — 2012
Associate's degree, Business/Computer Information Systems, 3.6

Mesa Community College   1997 — 2003
Associate of Applied Science, Electronic Engineering Technology, 3.33

Mijael Gutierrez Mijael Gutierrez Tempe, Arizona Details
Mijael Gutierrez's FlipChip International Experience June 2000 - Present
Job Equipment Engineer at FlipChip International
Industry Semiconductors
Experience
FlipChip International   June 2000 - Present
Micron Technology  November 1997 - June 2000

Skills
Semiconductors, Semiconductor Industry, Photolithography, Design of Experiments, Silicon, CVD, Engineering, Etching, Failure Analysis, Manufacturing, Thin Films, Plasma Etch, Root Cause Analysis, Continuous Improvement, SPC, Six Sigma, Electronics, Metrology, Cross-functional Team..., Process Engineering, Troubleshooting, JMP, Engineering Management, Process Integration, PECVD, Reliability, Yield, Testing, Test Equipment, CMOS, Automation, Product Engineering, PVD, Vacuum, ISO, R&D, Analog, Diffusion, Microelectronics, Preventive Maintenance, Manufacturing..., Semiconductor Process, Robotics, FMEA, IC, Characterization

Education
DeVry University Phoenix   1995 — 1997
Associate's degree, Electrical and Electronics Engineering

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