IBM Microelectronics
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IBM Microelectronics Employees
Employee
Years
Job
Industry
Leigh Price Leigh Price's IBM Microelectronics Experience 2003 - 2005
Job Vice President, Mergers & Acquisitions at IBM Corporation
Industry Computer Hardware
Experience
IBM Corporation January 2007 - Present
IBM Printing Systems Division 2005 - 2007
IBM Microelectronics 2003 - 2005
IBM 2002 - 2003
Zucotto Wireless 2000 - 2002
CommQuest Technologies 1999 - 2000
Saturn Corporation 1985 - 1987
Skills
Corporate Development, Due Diligence, Mergers & Acquisitions, Finance, Business Strategy, Acquisition Integration, Corporate Finance, Restructuring, Cross-functional Team..., Acquisitions, Competitive Analysis, Business Planning, Financial Modeling, Venture Capital, Strategy, Business Development, Start-ups, Divestitures, Mergers, M&A experience, Negotiation, Private Equity, Strategic Partnerships
Education
University of Pennsylvania - The Wharton School 1987 — 1989
MBA, Finance
Rensselaer Polytechnic Institute 1981 — 1985
BS, Chemical Engineering
Amity High School
IBM Corporation January 2007 - Present
IBM Printing Systems Division 2005 - 2007
IBM Microelectronics 2003 - 2005
IBM 2002 - 2003
Zucotto Wireless 2000 - 2002
CommQuest Technologies 1999 - 2000
Saturn Corporation 1985 - 1987
Skills
Corporate Development, Due Diligence, Mergers & Acquisitions, Finance, Business Strategy, Acquisition Integration, Corporate Finance, Restructuring, Cross-functional Team..., Acquisitions, Competitive Analysis, Business Planning, Financial Modeling, Venture Capital, Strategy, Business Development, Start-ups, Divestitures, Mergers, M&A experience, Negotiation, Private Equity, Strategic Partnerships
Education
University of Pennsylvania - The Wharton School 1987 — 1989
MBA, Finance
Rensselaer Polytechnic Institute 1981 — 1985
BS, Chemical Engineering
Amity High School
David Light David Light's IBM Microelectronics Experience May 1986 - May 1997
Job VP Packaging Technology at IDEX ASA
Industry Electrical/Electronic Manufacturing
Experience
IDEX ASA November 2014 - Present
Light Technical Consulting April 2001 - Present
Neoconix June 2012 - August 2013
Neoconix February 2011 - June 2012
Neoconix September 2009 - March 2011
KES Systems July 2003 - August 2007
Flex2Chip April 2001 - July 2003
Tessera May 1997 - April 2001
IBM Microelectronics May 1986 - May 1997
IBM TJ Watson Research Center November 1980 - May 1986
Skills
R&D, Electronics, Manufacturing, Semiconductors, Engineering Management, PCB design, Process Engineering, Product Development, Patents, Materials Science, Design of Experiments, Failure Analysis, Start-ups, Testing, Engineering, Program Management, Cross-functional Team..., Process Simulation, Technology Transfer, Product Management, Design for Manufacturing, SPC, Six Sigma, Sensors, Product Engineering, Electronics Packaging, Quality Management, Supply Chain Management, Reliability, Lean Manufacturing, RF, Materials, Continuous Improvement, Quality System, Microelectronics, MEMS, Root Cause Analysis, Semiconductor Industry, Business Development, Nanotechnology, IC, Characterization, Process Improvement, Product Design, Manufacturing..., Wireless, Product Marketing, Silicon, PCB Design
Education
Stanford University 1975 — 1979
BA, Human Biology
Marine Biological Laboratory, Woods Hole, Massachusetts 1980 — 1980
Coursework and Independent Research, Marine Ecology
IDEX ASA November 2014 - Present
Light Technical Consulting April 2001 - Present
Neoconix June 2012 - August 2013
Neoconix February 2011 - June 2012
Neoconix September 2009 - March 2011
KES Systems July 2003 - August 2007
Flex2Chip April 2001 - July 2003
Tessera May 1997 - April 2001
IBM Microelectronics May 1986 - May 1997
IBM TJ Watson Research Center November 1980 - May 1986
Skills
R&D, Electronics, Manufacturing, Semiconductors, Engineering Management, PCB design, Process Engineering, Product Development, Patents, Materials Science, Design of Experiments, Failure Analysis, Start-ups, Testing, Engineering, Program Management, Cross-functional Team..., Process Simulation, Technology Transfer, Product Management, Design for Manufacturing, SPC, Six Sigma, Sensors, Product Engineering, Electronics Packaging, Quality Management, Supply Chain Management, Reliability, Lean Manufacturing, RF, Materials, Continuous Improvement, Quality System, Microelectronics, MEMS, Root Cause Analysis, Semiconductor Industry, Business Development, Nanotechnology, IC, Characterization, Process Improvement, Product Design, Manufacturing..., Wireless, Product Marketing, Silicon, PCB Design
Education
Stanford University 1975 — 1979
BA, Human Biology
Marine Biological Laboratory, Woods Hole, Massachusetts 1980 — 1980
Coursework and Independent Research, Marine Ecology
Timothy Dell Timothy Dell's IBM Microelectronics Experience 1997 - 2002
Job SSD Quality and CrossBrand Product Engineering
Industry Computer Hardware
Experience
Saint Michael's College January 2012 - Present
IBM April 2013 - April 2014
IBM Server Group August 2002 - March 2013
IBM MicroElectronics 1997 - 2002
IBM 1991 - 1997
Skills
Memory Architecture, Error Correcting Codes, Quality and Test, Storage, System Architecture, Logic Design, Hardware Design, Servers, Memory, Hardware Architecture, IC, ASIC, EDA, Computer Architecture, Debugging, Microprocessors, DFT, CMOS, VLSI, Semiconductors, Reliability Engineering, Memory Test
Education
Rensselaer Polytechnic Institute 1980 — 1984
MS
Rensselaer Polytechnic Institute 1976 — 1980
BS
Saint Michael's College January 2012 - Present
IBM April 2013 - April 2014
IBM Server Group August 2002 - March 2013
IBM MicroElectronics 1997 - 2002
IBM 1991 - 1997
Skills
Memory Architecture, Error Correcting Codes, Quality and Test, Storage, System Architecture, Logic Design, Hardware Design, Servers, Memory, Hardware Architecture, IC, ASIC, EDA, Computer Architecture, Debugging, Microprocessors, DFT, CMOS, VLSI, Semiconductors, Reliability Engineering, Memory Test
Education
Rensselaer Polytechnic Institute 1980 — 1984
MS
Rensselaer Polytechnic Institute 1976 — 1980
BS
Ted Tewksbury Ted Tewksbury's IBM Microelectronics Experience 1997 - 1999
Job Business Builder and Turnaround Specialist
Industry Semiconductors
Experience
Jariet Technologies August 2015 - Present
MaxLinear May 2015 - Present
Tewksbury Partners, LLC November 2013 - Present
Entropic Communications November 2014 - April 2015
Entropic Communications September 2010 - April 2015
Global Semiconductor Alliance February 2011 - August 2013
IDT April 2008 - August 2013
AMI Semiconductor October 2006 - February 2008
Maxim Integrated Products February 2000 - August 2006
IBM Microelectronics 1997 - 1999
Skills
Semiconductors, ASIC, Semiconductor Industry, IC, Analog, Mixed Signal, SoC, Electrical Engineering, Wireless, RF, EDA, Strategy, Product Engineering, Analog Circuit Design, Engineering Management, Electronics, Embedded Systems, Simulations, Circuit Design, Mobile Devices, Sensors, Silicon, CMOS, Management, Integrated Circuit..., Manufacturing, Digital Signal..., FPGA, Characterization, PCB design, Verilog, Hardware Architecture, Signal Processing, Processors, Failure Analysis, Microprocessors, Start-ups, PCB Design, Microelectronics
Education
Massachusetts Institute of Technology 1975 — 1997
Ph.D, Electrical Engineering
Jariet Technologies August 2015 - Present
MaxLinear May 2015 - Present
Tewksbury Partners, LLC November 2013 - Present
Entropic Communications November 2014 - April 2015
Entropic Communications September 2010 - April 2015
Global Semiconductor Alliance February 2011 - August 2013
IDT April 2008 - August 2013
AMI Semiconductor October 2006 - February 2008
Maxim Integrated Products February 2000 - August 2006
IBM Microelectronics 1997 - 1999
Skills
Semiconductors, ASIC, Semiconductor Industry, IC, Analog, Mixed Signal, SoC, Electrical Engineering, Wireless, RF, EDA, Strategy, Product Engineering, Analog Circuit Design, Engineering Management, Electronics, Embedded Systems, Simulations, Circuit Design, Mobile Devices, Sensors, Silicon, CMOS, Management, Integrated Circuit..., Manufacturing, Digital Signal..., FPGA, Characterization, PCB design, Verilog, Hardware Architecture, Signal Processing, Processors, Failure Analysis, Microprocessors, Start-ups, PCB Design, Microelectronics
Education
Massachusetts Institute of Technology 1975 — 1997
Ph.D, Electrical Engineering
Lisa Wenthe's IBM Microelectronics Experience June 2000 - June 2002
Job Chemical Engineer
Industry Semiconductors
Experience
Classical Conversations (sole proprietorship) June 2012 - May 2014
Classical Conversations, Burlington VT campus June 2007 - June 2012
IBM Microelectronics June 2000 - June 2002
Frito Lay Research and Development May 1999 - August 1999
ExxonMobil May 1998 - August 1998
Skills
Microsoft Office, Microsoft Excel, Microsoft Word, PowerPoint, English, Windows, Research, Outlook, Teaching, Chemical Engineering
Education
Purdue University 1996 — 2000
Bachelor’s Degree, Chemical Engineering
Classical Conversations (sole proprietorship) June 2012 - May 2014
Classical Conversations, Burlington VT campus June 2007 - June 2012
IBM Microelectronics June 2000 - June 2002
Frito Lay Research and Development May 1999 - August 1999
ExxonMobil May 1998 - August 1998
Skills
Microsoft Office, Microsoft Excel, Microsoft Word, PowerPoint, English, Windows, Research, Outlook, Teaching, Chemical Engineering
Education
Purdue University 1996 — 2000
Bachelor’s Degree, Chemical Engineering
Natalie Gaensbauer Natalie Gaensbauer's IBM Microelectronics Experience March 2015 - Present
Job Equipment Engineer at IBM Microelectronics
Industry Mechanical or Industrial Engineering
Experience
IBM Microelectronics March 2015 - Present
Logan Aluminum July 2013 - February 2015
Boston Engineering July 2012 - December 2012
Novelis July 2011 - December 2011
Lexitek, Inc. May 2010 - December 2010
Skills
Solidworks, Mechanical Engineering, Manufacturing, Matlab, Engineering, Continuous Improvement, Solid Modeling, ANSYS, AutoCAD, Metal Fabrication, Industrial Safety, Pro Engineer, French, Microsoft Office, CAD, Maple, CNC manufacturing, 5S, VBA, Microsoft Excel
Education
Northeastern University 2009 — 2013
Bachelor of Applied Science (B.A.Sc.), Mechanical Engineering, 3.74
IBM Microelectronics March 2015 - Present
Logan Aluminum July 2013 - February 2015
Boston Engineering July 2012 - December 2012
Novelis July 2011 - December 2011
Lexitek, Inc. May 2010 - December 2010
Skills
Solidworks, Mechanical Engineering, Manufacturing, Matlab, Engineering, Continuous Improvement, Solid Modeling, ANSYS, AutoCAD, Metal Fabrication, Industrial Safety, Pro Engineer, French, Microsoft Office, CAD, Maple, CNC manufacturing, 5S, VBA, Microsoft Excel
Education
Northeastern University 2009 — 2013
Bachelor of Applied Science (B.A.Sc.), Mechanical Engineering, 3.74
JAY H. ANDERSON JAY H. ANDERSON's IBM Microelectronics Experience July 1998 - November 2005
Job Patent Attorney
Industry Law Practice
Experience
Guntin & Gust, PLC October 2012 - Present
Wiggin and Dana LLP March 2008 - October 2012
Greenberg Traurig, LLP November 2005 - March 2008
IBM Microelectronics July 1998 - November 2005
Fitzpatrick, Cella, Harper & Scinto January 1996 - July 1998
Fitzpatrick, Cella, Harper & Scinto March 1993 - December 1995
Skills
Patents, Patent Prosecution, Patentability, Legal Opinions, Legal Issues, Intellectual Property, Licensing, Legal Research, Prosecution, Litigation Support, Client Counseling, Legal Writing, Contract Negotiation
Education
Pace University School of Law 1992 — 1996
J.D. cum laude
University of Illinois at Urbana-Champaign 1973 — 1981
M.S., EE, Physics
Massachusetts Institute of Technology 1969 — 1973
S.B., Physics
Guntin & Gust, PLC October 2012 - Present
Wiggin and Dana LLP March 2008 - October 2012
Greenberg Traurig, LLP November 2005 - March 2008
IBM Microelectronics July 1998 - November 2005
Fitzpatrick, Cella, Harper & Scinto January 1996 - July 1998
Fitzpatrick, Cella, Harper & Scinto March 1993 - December 1995
Skills
Patents, Patent Prosecution, Patentability, Legal Opinions, Legal Issues, Intellectual Property, Licensing, Legal Research, Prosecution, Litigation Support, Client Counseling, Legal Writing, Contract Negotiation
Education
Pace University School of Law 1992 — 1996
J.D. cum laude
University of Illinois at Urbana-Champaign 1973 — 1981
M.S., EE, Physics
Massachusetts Institute of Technology 1969 — 1973
S.B., Physics
Niki McClymonds's IBM Microelectronics Experience 2008 - Present
Job Product Engineering, OEM Microprocessor Packaging
Industry Semiconductors
Experience
IBM February 2008 - Present
IBM Microelectronics 2008 - Present
IBM 1999 - 2008
Skills
Product Engineering, Microprocessors, Semiconductors, Testing, Design of Experiments, Failure Analysis, Cross-functional Team..., Process Engineering, Program Management, Engineering Management
Education
Purdue University 1994 — 1999
IBM February 2008 - Present
IBM Microelectronics 2008 - Present
IBM 1999 - 2008
Skills
Product Engineering, Microprocessors, Semiconductors, Testing, Design of Experiments, Failure Analysis, Cross-functional Team..., Process Engineering, Program Management, Engineering Management
Education
Purdue University 1994 — 1999
Scott Decker Scott Decker's IBM Microelectronics Experience 2007 - 2009
Job Career STEM Professional
Industry Electrical/Electronic Manufacturing
Experience
Self-Employed 2011 - Present
Camino de Santiago August 2014 - November 2014
Self-Unemployed 2009 - 2012
IBM Microelectronics 2007 - 2009
IBM Microelectronics 2000 - 2007
IBM Microelectronics 2000 - 2007
IBM Microelectronics 1992 - 2000
Wang Laboratories 1990 - 1991
Wang Laboratories 1987 - 1991
Teradyne 1981 - 1986
Skills
Testing, Semiconductors, Manufacturing, Hardware, Debugging, Engineering, Training, Technical Documentation, Test Engineering, Product Development, Technical Writing, Copy Editing, Device Characterization, Project Management, Electrical Engineering, Failure Analysis, Product Engineering, Integration, Customer Technical..., Software Quality..., Circuit Board Test, Mentoring New Engineers, Instrumentation, Technical Support, Embedded Systems, Electronics, IC
Education
The University of Connecticut 1976 — 1981
BSEE, Electrical Engineering, add'l courses in Mechanical Engineering and Computer Science
Norwalk (Connecticut) High School 1972 — 1976
Self-Employed 2011 - Present
Camino de Santiago August 2014 - November 2014
Self-Unemployed 2009 - 2012
IBM Microelectronics 2007 - 2009
IBM Microelectronics 2000 - 2007
IBM Microelectronics 2000 - 2007
IBM Microelectronics 1992 - 2000
Wang Laboratories 1990 - 1991
Wang Laboratories 1987 - 1991
Teradyne 1981 - 1986
Skills
Testing, Semiconductors, Manufacturing, Hardware, Debugging, Engineering, Training, Technical Documentation, Test Engineering, Product Development, Technical Writing, Copy Editing, Device Characterization, Project Management, Electrical Engineering, Failure Analysis, Product Engineering, Integration, Customer Technical..., Software Quality..., Circuit Board Test, Mentoring New Engineers, Instrumentation, Technical Support, Embedded Systems, Electronics, IC
Education
The University of Connecticut 1976 — 1981
BSEE, Electrical Engineering, add'l courses in Mechanical Engineering and Computer Science
Norwalk (Connecticut) High School 1972 — 1976
Andy Doe Andy Doe's IBM Microelectronics Experience June 1983 - June 2011
Job Principle; Mansfield Engineering LLC
Industry Construction
Experience
Mansfield Engineering LLC January 2014 - Present
NEHP Inc. June 2011 - November 2013
IBM Microelectronics June 1983 - June 2011
Skills
AutoCAD, Piping, Welding, CAD, Project Management, Semiconductors, Construction Management, Contract Negotiation, Engineering, Construction, Weld, Program Management, Project Estimation, Testing, Semiconductor Industry, Engineering Management, Manufacturing, Process Engineering, MS Project, Project Engineering, Project Planning, Six Sigma, Contract Management, Cross-functional Team..., Materials, Manufacturing..., Process Simulation, Lean Manufacturing, Microsoft Project
Education
University of Idaho 1988 — 1990
Master's degree (incomplete), Solar Engineering
Rochester Institute of Technology 1981 — 1983
Bachelor of Science (BS), Mechanical Engineering
SUNY Canton 1979 — 1981
Associate of Science (AS), Engineering Science
Mansfield Engineering LLC January 2014 - Present
NEHP Inc. June 2011 - November 2013
IBM Microelectronics June 1983 - June 2011
Skills
AutoCAD, Piping, Welding, CAD, Project Management, Semiconductors, Construction Management, Contract Negotiation, Engineering, Construction, Weld, Program Management, Project Estimation, Testing, Semiconductor Industry, Engineering Management, Manufacturing, Process Engineering, MS Project, Project Engineering, Project Planning, Six Sigma, Contract Management, Cross-functional Team..., Materials, Manufacturing..., Process Simulation, Lean Manufacturing, Microsoft Project
Education
University of Idaho 1988 — 1990
Master's degree (incomplete), Solar Engineering
Rochester Institute of Technology 1981 — 1983
Bachelor of Science (BS), Mechanical Engineering
SUNY Canton 1979 — 1981
Associate of Science (AS), Engineering Science
Craig Luhrmann Craig Luhrmann's IBM Microelectronics Experience 2004 - 2010
Job VP of Sales, Japan and Korea
Industry Semiconductors
Experience
GLOBALFOUNDRIES August 2010 - Present
IBM Microelectronics 2004 - 2010
IBM Microelectronics 1995 - 2004
Hitachi Semiconductor 1989 - 1995
Hitachi 1989 - 1995
SMSC January 1986 - July 1989
General Instrument (now MicroChip) December 1982 - December 1985
General Electric July 1980 - December 1982
Skills
ASIC, Sales Operations, Channel, Semiconductors, Product Marketing, International Sales, Analog Circuit Design, Integrated Circuit..., Wireless, Semiconductor Industry, Sales, Go-to-market Strategy, Consumer Electronics, Cross-functional Team..., Management, Key Account Management, Business Development, Marketing Strategy, Product Management, Solution Selling, SoC, Contract Negotiation, IC, Strategic Partnerships, EDA, Sales Enablement, Start-ups, Microelectronics, Sales Management, Product Development, Business Alliances, Product Launch
Education
University of Dayton 1976 — 1980
B.E.E., Electrical Engineering
Wayne HS 1972 — 1976
HS Diploma, College prep
GLOBALFOUNDRIES August 2010 - Present
IBM Microelectronics 2004 - 2010
IBM Microelectronics 1995 - 2004
Hitachi Semiconductor 1989 - 1995
Hitachi 1989 - 1995
SMSC January 1986 - July 1989
General Instrument (now MicroChip) December 1982 - December 1985
General Electric July 1980 - December 1982
Skills
ASIC, Sales Operations, Channel, Semiconductors, Product Marketing, International Sales, Analog Circuit Design, Integrated Circuit..., Wireless, Semiconductor Industry, Sales, Go-to-market Strategy, Consumer Electronics, Cross-functional Team..., Management, Key Account Management, Business Development, Marketing Strategy, Product Management, Solution Selling, SoC, Contract Negotiation, IC, Strategic Partnerships, EDA, Sales Enablement, Start-ups, Microelectronics, Sales Management, Product Development, Business Alliances, Product Launch
Education
University of Dayton 1976 — 1980
B.E.E., Electrical Engineering
Wayne HS 1972 — 1976
HS Diploma, College prep
Lori G. Peterson Lori G. Peterson's IBM Microelectronics Experience 1981 - 1992
Job Program Director at IBM: Cloud, Data & Analytics, Integrated Marketing, CrossFunctional Leadership, Partner Recruiting
Industry Information Technology and Services
Experience
IBM 2014 - Present
IBM February 2010 - 2013
IBM Software Division September 2003 - January 2010
IBM January 1993 - December 2003
IBM Microelectronics 1981 - 1992
Skills
Sales Enablement, Program Management, Demand Generation, Product Management, Product Launch, Product Marketing, Strategic Planning, Marketing Management, Marketing Strategy, C-suite / C-level..., Cloud Marketing, Cross-functional Team..., Go-to-market Strategy, Digital Marketing, Start-ups, Events, Business Partner..., Business Development, Global Leadership
Education
Penn State University
Bachelor of Science (B.S.), Computer Science and Engineering, 3.7
IBM 2014 - Present
IBM February 2010 - 2013
IBM Software Division September 2003 - January 2010
IBM January 1993 - December 2003
IBM Microelectronics 1981 - 1992
Skills
Sales Enablement, Program Management, Demand Generation, Product Management, Product Launch, Product Marketing, Strategic Planning, Marketing Management, Marketing Strategy, C-suite / C-level..., Cloud Marketing, Cross-functional Team..., Go-to-market Strategy, Digital Marketing, Start-ups, Events, Business Partner..., Business Development, Global Leadership
Education
Penn State University
Bachelor of Science (B.S.), Computer Science and Engineering, 3.7
Dan Mellinger, PE, LC Dan Mellinger, PE, LC's IBM Microelectronics Experience June 1999 - January 2005
Job Lighting Strategy Manager at Vermont Energy Investment Corporation
Industry Utilities
Experience
Vermont Energy Investment Corporation March 2009 - Present
Vermont Energy Investment Corporation January 2005 - March 2009
IBM Microelectronics June 1999 - January 2005
Education
Michigan State University 1995 — 1999
BS
Vermont Energy Investment Corporation March 2009 - Present
Vermont Energy Investment Corporation January 2005 - March 2009
IBM Microelectronics June 1999 - January 2005
Education
Michigan State University 1995 — 1999
BS
Dave Danner's IBM Microelectronics Experience June 1997 - September 1998
Job Sr. Customer Technology Manager at Lam Research
Industry Semiconductors
Experience
Lam Research September 2011 - Present
IBM November 2007 - April 2009
IBM June 2005 - November 2007
IBM December 2000 - May 2005
IBM Microelectroncis September 1998 - December 2000
IBM Microelectronics June 1997 - September 1998
IBM Microelectronics December 1994 - May 1997
IBM Microelectronics November 1993 - November 1994
IBM Microelectronics January 1993 - November 1993
IBM Research April 1992 - December 1992
Skills
Process Engineering, Plasma Etch, Thin Films, Mergers & Acquisitions, Analysis, Competitive Analysis, Business Strategy, Semiconductors, Cross-functional Team..., Strategy, Process Simulation, Product Development
Education
University of California, Berkeley 1979 — 1984
Ph.D., Chemical Engineering
Virginia Polytechnic Institute and State University 1975 — 1979
B.S., Chemical Engineering
Lam Research September 2011 - Present
IBM November 2007 - April 2009
IBM June 2005 - November 2007
IBM December 2000 - May 2005
IBM Microelectroncis September 1998 - December 2000
IBM Microelectronics June 1997 - September 1998
IBM Microelectronics December 1994 - May 1997
IBM Microelectronics November 1993 - November 1994
IBM Microelectronics January 1993 - November 1993
IBM Research April 1992 - December 1992
Skills
Process Engineering, Plasma Etch, Thin Films, Mergers & Acquisitions, Analysis, Competitive Analysis, Business Strategy, Semiconductors, Cross-functional Team..., Strategy, Process Simulation, Product Development
Education
University of California, Berkeley 1979 — 1984
Ph.D., Chemical Engineering
Virginia Polytechnic Institute and State University 1975 — 1979
B.S., Chemical Engineering
Dennis Wilkerson Dennis Wilkerson's IBM Microelectronics Experience 1990 - Present
Job Design Engineer at IBM
Industry Computer Hardware
Experience
IBM January 1996 - Present
IBM 1995 - Present
IBM Microelectronics 1990 - Present
Skills
Logic Design, Functional Verification, SystemVerilog, Static Timing Analysis, Timing Closure, VHDL, Verilog, Simulation
Education
NCSU 1987 — 1989
BS Electrical Engineering, Digital Circuits
North Carolina State University 1987 — 1989
IBM January 1996 - Present
IBM 1995 - Present
IBM Microelectronics 1990 - Present
Skills
Logic Design, Functional Verification, SystemVerilog, Static Timing Analysis, Timing Closure, VHDL, Verilog, Simulation
Education
NCSU 1987 — 1989
BS Electrical Engineering, Digital Circuits
North Carolina State University 1987 — 1989
Stephen Colley Stephen Colley's IBM Microelectronics Experience 2001 - 2002
Job Electronics Design/Engineering Management
Industry Defense & Space
Experience
Subaru Telescope August 2003 - March 2013
IBM Microelectronics 2001 - 2002
Access Dynamics, Inc. 1991 - 2001
National Solar Observatory 1986 - 1991
Skills
Science, FPGA, Labview, Physics, Analog, Data Acquisition, Microcontrollers, Simulations, Instrumentation
Education
University of California Santa Barbara
Master of Science (MS), Scientific Instrumentation, Graduated with highest honors
University of California, Santa Barbara
Bachelor's degree, History
Villanova University
Masters Certificate, Project Management
Subaru Telescope August 2003 - March 2013
IBM Microelectronics 2001 - 2002
Access Dynamics, Inc. 1991 - 2001
National Solar Observatory 1986 - 1991
Skills
Science, FPGA, Labview, Physics, Analog, Data Acquisition, Microcontrollers, Simulations, Instrumentation
Education
University of California Santa Barbara
Master of Science (MS), Scientific Instrumentation, Graduated with highest honors
University of California, Santa Barbara
Bachelor's degree, History
Villanova University
Masters Certificate, Project Management
Yujun Li Yujun Li's IBM Microelectronics Experience September 2000 - June 2004
Job Corporate Strategy at IBM
Industry Semiconductors
Experience
IBM September 2011 - Present
IBM January 2008 - September 2011
IBM March 2005 - December 2007
IBM June 2004 - March 2005
IBM Microelectronics September 2000 - June 2004
IBM Microelectronics June 1997 - September 2000
Skills
Technology Development, Semiconductors, Business Strategy, Characterization, Analysis, Program Management, IC, Semiconductor Industry, Cross-functional Team..., Product Management, Strategy, Strategic Partnerships, Go-to-market Strategy, Integration, Management, IT Strategy, Processors, Process Engineering, Enterprise Software, Cloud Computing
Education
Yale University 1992 — 1997
Ph.D, Electrical Engineering
University of Science and Technology of China 1988 — 1992
B.S., Physics
Su Zhou High School 1986 — 1988
IBM September 2011 - Present
IBM January 2008 - September 2011
IBM March 2005 - December 2007
IBM June 2004 - March 2005
IBM Microelectronics September 2000 - June 2004
IBM Microelectronics June 1997 - September 2000
Skills
Technology Development, Semiconductors, Business Strategy, Characterization, Analysis, Program Management, IC, Semiconductor Industry, Cross-functional Team..., Product Management, Strategy, Strategic Partnerships, Go-to-market Strategy, Integration, Management, IT Strategy, Processors, Process Engineering, Enterprise Software, Cloud Computing
Education
Yale University 1992 — 1997
Ph.D, Electrical Engineering
University of Science and Technology of China 1988 — 1992
B.S., Physics
Su Zhou High School 1986 — 1988
Jared Yanofsky Jared Yanofsky's IBM Microelectronics Experience May 2011 - March 2014
Job Lead Global Service Manufacturing Process and Quality Engineer at Brooks Automation
Industry Semiconductors
Experience
Brooks Automation April 2014 - Present
IBM Microelectronics May 2011 - March 2014
Nexx Systems August 2010 - January 2011
Northeastern University April 2010 - July 2010
Genzyme June 2009 - December 2009
Northeastern University January 2009 - April 2009
Advanced Electron Beams May 2008 - April 2009
Building Media Group June 2007 - August 2007
Levinsky Landscaping and Property Management April 2007 - July 2007
Dunkin' Brands May 2005 - November 2006
Skills
Process Engineering, Matlab, Chemical Engineering, Design of Experiments, Six Sigma, Labview, Quality Control, AutoCAD, Invention, Lean Manufacturing, Continuous Improvement, Process Improvement, Microsoft Office, Solidworks, Wireshark, Manufacturing, Simulations, 8D Problem Solving, Minitab, Aspen HYSYS, Gauge R&R, SPC, 5S, FMEA, Mathematica, HTML, SQL, Electromigration, CSS, Polymath, Java, HTOL, 3D Studio Max, Blender, Visual Basic, Debian, AutoIt, CVS Bath Analysis, Negative Bias..., Hot Carrier, Voltage Breakdown, High Temp Storage, Cryogenics, Vacuum Chambers, Filmetrics, Thermocycle, HAST, Gas Chromatography, Weibull Analysis, Oracle
Education
Northeastern University 2006 — 2011
Bachelor of Science (BS), Chemical Engineering, Magna Cum Laude (High Honors)
Brooks Automation April 2014 - Present
IBM Microelectronics May 2011 - March 2014
Nexx Systems August 2010 - January 2011
Northeastern University April 2010 - July 2010
Genzyme June 2009 - December 2009
Northeastern University January 2009 - April 2009
Advanced Electron Beams May 2008 - April 2009
Building Media Group June 2007 - August 2007
Levinsky Landscaping and Property Management April 2007 - July 2007
Dunkin' Brands May 2005 - November 2006
Skills
Process Engineering, Matlab, Chemical Engineering, Design of Experiments, Six Sigma, Labview, Quality Control, AutoCAD, Invention, Lean Manufacturing, Continuous Improvement, Process Improvement, Microsoft Office, Solidworks, Wireshark, Manufacturing, Simulations, 8D Problem Solving, Minitab, Aspen HYSYS, Gauge R&R, SPC, 5S, FMEA, Mathematica, HTML, SQL, Electromigration, CSS, Polymath, Java, HTOL, 3D Studio Max, Blender, Visual Basic, Debian, AutoIt, CVS Bath Analysis, Negative Bias..., Hot Carrier, Voltage Breakdown, High Temp Storage, Cryogenics, Vacuum Chambers, Filmetrics, Thermocycle, HAST, Gas Chromatography, Weibull Analysis, Oracle
Education
Northeastern University 2006 — 2011
Bachelor of Science (BS), Chemical Engineering, Magna Cum Laude (High Honors)
Eva McCauley's IBM Microelectronics Experience June 1983 - August 1983
Job Sales Engineer, Semiconductor industry
Industry Semiconductors
Experience
Freescale Semiconductor January 1985 - Present
Motorola Semiconductor 1985 - 2004
General Instrument 1992 - 1999
Commodore 1986 - 1992
AT&T Bell Labs 1984 - 1984
IBM microelectronics June 1983 - August 1983
Skills
Telecommunications, Semiconductors, Electrical Engineering, Wireless, Ethernet, Industrial networking,..., Development of..., Embedded Systems, Mobile Devices, Semiconductor Industry, IC, Processors, RF, ASIC, Analog, FPGA, Hardware Architecture
Education
West Chester University of Pennsylvania 2006 — 2010
MBA
Pennsylvania State University-Great Valley Graduate Center 1989 — 1992
MS, Eng Sci
Penn State University 1981 — 1985
BS, MS Eng Sc, Electrical Engineering
Freescale Semiconductor January 1985 - Present
Motorola Semiconductor 1985 - 2004
General Instrument 1992 - 1999
Commodore 1986 - 1992
AT&T Bell Labs 1984 - 1984
IBM microelectronics June 1983 - August 1983
Skills
Telecommunications, Semiconductors, Electrical Engineering, Wireless, Ethernet, Industrial networking,..., Development of..., Embedded Systems, Mobile Devices, Semiconductor Industry, IC, Processors, RF, ASIC, Analog, FPGA, Hardware Architecture
Education
West Chester University of Pennsylvania 2006 — 2010
MBA
Pennsylvania State University-Great Valley Graduate Center 1989 — 1992
MS, Eng Sci
Penn State University 1981 — 1985
BS, MS Eng Sc, Electrical Engineering
Ananthan Raghunathan Ananthan Raghunathan's IBM Microelectronics Experience May 2013 - Present
Job Advisory R&D Engineer at IBM
Industry Nanotechnology
Experience
IBM Microelectronics May 2013 - Present
College of Nanoscale Science and Engineering of the University at Albany August 2007 - May 2013
GLOBALFOUNDRIES June 2010 - September 2010
Skills
Electron Beam..., Semiconductor Process, Lithography, Nanofabrication, Nanotechnology, Semiconductors, Electrical Engineering, Modeling, Scanning Electron..., Microfabrication, Metrology, Thin Films, Characterization, R&D, Materials Science, CMOS, Design of Experiments, Matlab, Simulations
Education
State University of New York at Albany 2007 — 2013
Doctor of Philosophy (PhD), Nano Science and Engineering
State University of New York at Albany 2007 — 2009
Master of Science (MS), Nanoscience and Engineering
Shanmugha Arts, Science, Technology and Research Academy
IBM Microelectronics May 2013 - Present
College of Nanoscale Science and Engineering of the University at Albany August 2007 - May 2013
GLOBALFOUNDRIES June 2010 - September 2010
Skills
Electron Beam..., Semiconductor Process, Lithography, Nanofabrication, Nanotechnology, Semiconductors, Electrical Engineering, Modeling, Scanning Electron..., Microfabrication, Metrology, Thin Films, Characterization, R&D, Materials Science, CMOS, Design of Experiments, Matlab, Simulations
Education
State University of New York at Albany 2007 — 2013
Doctor of Philosophy (PhD), Nano Science and Engineering
State University of New York at Albany 2007 — 2009
Master of Science (MS), Nanoscience and Engineering
Shanmugha Arts, Science, Technology and Research Academy
Roger W. Cheek Roger W. Cheek's IBM Microelectronics Experience May 1994 - July 2004
Job Senior Engineer at IBM Research
Industry Semiconductors
Experience
IBM TJ Watson Research Center July 2004 - Present
IBM Microelectronics May 1994 - July 2004
Skills
Data Mining, Semiconductors, Data Analysis, Microelectronics, Statistics, Thin Films, Surface Chemistry, Data Modeling, SAS programming, Perl, Characterization, Materials Science, Nanofabrication, Design of Experiments, Analytical Chemistry, Statistical Software, SPSS, NI LabVIEW, Pascal, DB2, Instrumentation...
Education
University of North Texas 1989 — 1993
Doctor of Philosophy (Ph.D.), Chemistry (analytical)
University of North Texas 1976 — 1981
B.S., Chemistry
IBM TJ Watson Research Center July 2004 - Present
IBM Microelectronics May 1994 - July 2004
Skills
Data Mining, Semiconductors, Data Analysis, Microelectronics, Statistics, Thin Films, Surface Chemistry, Data Modeling, SAS programming, Perl, Characterization, Materials Science, Nanofabrication, Design of Experiments, Analytical Chemistry, Statistical Software, SPSS, NI LabVIEW, Pascal, DB2, Instrumentation...
Education
University of North Texas 1989 — 1993
Doctor of Philosophy (Ph.D.), Chemistry (analytical)
University of North Texas 1976 — 1981
B.S., Chemistry
Michael Chudzik Michael Chudzik's IBM Microelectronics Experience January 2000 - January 2002
Job Senior Director, Applied Materials
Industry Semiconductors
Experience
Applied Materials July 2014 - Present
IBM July 2012 - July 2014
IBM March 2011 - July 2012
IBM Semiconductor Research and Development Center February 2009 - July 2011
IBM January 2006 - February 2009
IBM December 2005 - December 2005
IBM Watson Research 2004 - 2005
IBM December 2002 - December 2004
IBM June 2000 - December 2002
IBM Microelectronics January 2000 - January 2002
Skills
ALD, CVD, Semiconductors, Lean Sigma, Materials Science, Electrical Engineering, Capacitors, transistors, Technical Management, People Management, DRAM, CMOS, DOE, Device Physics, Semiconductor..., Thin Films, Process Integration, Process Development, Nanotechnology, Materials, Semiconductor Industry, Physics, Atomic Layer Deposition, Lean Manufacturing, Design of Experiments, Program Management, Process Simulation, Electronics, R&D, Project Management, Management, Process Engineering, Six Sigma, Technical Leadership, Characterization, PVD, Manufacturing, Integration, Embedded Systems, SPC, IC, Engineering, Engineering Management, RF, Technology Management, Team Leadership, Silicon, Simulations, Testing, ASIC
Education
Northwestern University 1995 — 2000
Ph.D, Electrical and Computer Engineering
Northwestern University 1995 — 1998
M.S, Electrical and Computer Engineering
University of Washington 1990 — 1995
BS, Metallurgical Engineering
Applied Materials July 2014 - Present
IBM July 2012 - July 2014
IBM March 2011 - July 2012
IBM Semiconductor Research and Development Center February 2009 - July 2011
IBM January 2006 - February 2009
IBM December 2005 - December 2005
IBM Watson Research 2004 - 2005
IBM December 2002 - December 2004
IBM June 2000 - December 2002
IBM Microelectronics January 2000 - January 2002
Skills
ALD, CVD, Semiconductors, Lean Sigma, Materials Science, Electrical Engineering, Capacitors, transistors, Technical Management, People Management, DRAM, CMOS, DOE, Device Physics, Semiconductor..., Thin Films, Process Integration, Process Development, Nanotechnology, Materials, Semiconductor Industry, Physics, Atomic Layer Deposition, Lean Manufacturing, Design of Experiments, Program Management, Process Simulation, Electronics, R&D, Project Management, Management, Process Engineering, Six Sigma, Technical Leadership, Characterization, PVD, Manufacturing, Integration, Embedded Systems, SPC, IC, Engineering, Engineering Management, RF, Technology Management, Team Leadership, Silicon, Simulations, Testing, ASIC
Education
Northwestern University 1995 — 2000
Ph.D, Electrical and Computer Engineering
Northwestern University 1995 — 1998
M.S, Electrical and Computer Engineering
University of Washington 1990 — 1995
BS, Metallurgical Engineering
Dr. Mike Olson Dr. Mike Olson's IBM Microelectronics Experience 1994 - 2008
Job Vocational / Occupational / Academic Curriculum Development Leader
Industry Education Management
Experience
Vermont Technical College 2013 - Present
Education & Training Consultant January 2009 - Present
SMARTvt 2009 - Present
SMARTvt October 2009 - Present
Vermont Technical College August 1994 - December 2008
IBM - Microelectronics 1994 - 2008
Trace Technologies, Inc December 1990 - August 1994
IntelliSys, Inc April 1986 - December 1990
GE May 1983 - April 1986
Skills
Organizational..., Instructional Design, Curriculum Development, Curriculum Design, E-Learning, Coaching, Designing, Employee Training, Start-ups, Tutoring, Leadership Development, Task Analysis, Training, Teaching, Public Speaking, Higher Education, Project Management, Program Management, Team Building, Strategy, Change Management, Instructional Technology, Program Development, Analysis, Leadership, Distance Learning, Research, Marketing, Project Planning, Strategic Planning, Nonprofits, Proposal Writing, Career Counseling, Process Improvement, Integration, Management, Team Leadership, Organizational..., Executive Coaching, Blended Learning, Entrepreneurship, Adult Education, Staff Development, Technical Writing, Instructor-led Training, Consulting, Workshop Facilitation, Knowledge Management, Organizational Learning, Needs Analysis
Education
Syracuse University 1982 — 1996
Ed.D., Instructional Design Development & Evaluation (Education)
University of Notre Dame 1964 — 1968
BA, Government
Our Lady of Mercy H.S., Rio de Janeiro
H.S. Diploma, College Prepatory
Vermont Technical College 2013 - Present
Education & Training Consultant January 2009 - Present
SMARTvt 2009 - Present
SMARTvt October 2009 - Present
Vermont Technical College August 1994 - December 2008
IBM - Microelectronics 1994 - 2008
Trace Technologies, Inc December 1990 - August 1994
IntelliSys, Inc April 1986 - December 1990
GE May 1983 - April 1986
Skills
Organizational..., Instructional Design, Curriculum Development, Curriculum Design, E-Learning, Coaching, Designing, Employee Training, Start-ups, Tutoring, Leadership Development, Task Analysis, Training, Teaching, Public Speaking, Higher Education, Project Management, Program Management, Team Building, Strategy, Change Management, Instructional Technology, Program Development, Analysis, Leadership, Distance Learning, Research, Marketing, Project Planning, Strategic Planning, Nonprofits, Proposal Writing, Career Counseling, Process Improvement, Integration, Management, Team Leadership, Organizational..., Executive Coaching, Blended Learning, Entrepreneurship, Adult Education, Staff Development, Technical Writing, Instructor-led Training, Consulting, Workshop Facilitation, Knowledge Management, Organizational Learning, Needs Analysis
Education
Syracuse University 1982 — 1996
Ed.D., Instructional Design Development & Evaluation (Education)
University of Notre Dame 1964 — 1968
BA, Government
Our Lady of Mercy H.S., Rio de Janeiro
H.S. Diploma, College Prepatory
Chris Scoville Chris Scoville's IBM Microelectronics Experience June 1998 - July 2007
Job Electrical Engineer
Industry Electrical/Electronic Manufacturing
Experience
BAMC October 2010 - May 2014
ASIC North July 2007 - October 2010
IBM Microelectronics June 1998 - July 2007
Education
Rensselaer Polytechnic Institute 1994 — 1998
MS, BS, Electrical Engineering
BAMC October 2010 - May 2014
ASIC North July 2007 - October 2010
IBM Microelectronics June 1998 - July 2007
Education
Rensselaer Polytechnic Institute 1994 — 1998
MS, BS, Electrical Engineering
Amit Gupta, P.Eng. Amit Gupta, P.Eng.'s IBM Microelectronics Experience May 2004 - May 2007
Job Business Operations
Industry Semiconductors
Experience
AMD August 2011 - Present
Shiv Jyoti Traders Pvt. Ltd. April 2009 - Present
IBM May 2007 - August 2011
IBM Microelectronics May 2004 - May 2007
University of Pittsburgh January 2002 - December 2003
Skills
Semiconductors, Circuit Design, CMOS, Integrated Circuit..., Mixed Signal, RF, Analog, Characterization, Cadence, Testing, Silicon, DRC, Spectre, MEMS, ASIC, Simulations
Education
University of Vermont 2006 — 2010
Pursuing Ph.D, EE
University of Pittsburgh 2001 — 2003
M.S, EE
Nagpur University 1996 — 2000
BS Electronics
AMD August 2011 - Present
Shiv Jyoti Traders Pvt. Ltd. April 2009 - Present
IBM May 2007 - August 2011
IBM Microelectronics May 2004 - May 2007
University of Pittsburgh January 2002 - December 2003
Skills
Semiconductors, Circuit Design, CMOS, Integrated Circuit..., Mixed Signal, RF, Analog, Characterization, Cadence, Testing, Silicon, DRC, Spectre, MEMS, ASIC, Simulations
Education
University of Vermont 2006 — 2010
Pursuing Ph.D, EE
University of Pittsburgh 2001 — 2003
M.S, EE
Nagpur University 1996 — 2000
BS Electronics
Mathias Hotaling Mathias Hotaling's IBM Microelectronics Experience January 2000 - August 2000
Job Applications Engineer at Instrumart
Industry Semiconductors
Experience
Instrumart August 2009 - Present
ASIC North Inc September 2006 - December 2008
IBM April 2004 - August 2006
Micron Technology Inc September 2002 - February 2003
IBM Microelectronics January 2000 - August 2000
Skills
Verilog, Characterization, VLSI, Simulations, VHDL, Testing, ASIC, Perl, LVS, Cadence, DRC, SPICE
Education
Rensselaer Polytechnic Institute 1997 — 2002
B.S.E.E
Vermont Academy 1995 — 1997
HS
Leland & Gray UHS 1993 — 1995
Instrumart August 2009 - Present
ASIC North Inc September 2006 - December 2008
IBM April 2004 - August 2006
Micron Technology Inc September 2002 - February 2003
IBM Microelectronics January 2000 - August 2000
Skills
Verilog, Characterization, VLSI, Simulations, VHDL, Testing, ASIC, Perl, LVS, Cadence, DRC, SPICE
Education
Rensselaer Polytechnic Institute 1997 — 2002
B.S.E.E
Vermont Academy 1995 — 1997
HS
Leland & Gray UHS 1993 — 1995
Herb Sinclair Herb Sinclair's IBM Microelectronics Experience March 2001 - October 2003
Job Freelance Personal IT Consultant
Industry Consumer Electronics
Experience
Smart Device IT September 2013 - Present
Self-Employed June 2009 - July 2011
West Coast Real Estate Co. May 2005 - February 2008
LearniT! June 2007 - January 2008
IBM October 2003 - May 2005
IBM Microelectronics March 2001 - October 2003
Cybersource. Inc. July 1996 - July 1999
The Santa Cruz Operation March 1990 - June 1996
IBM, NAD July 1986 - February 1990
IBM OPD March 1981 - 1986
Skills
Software Development, Engineering, Training, Microsoft Office, Project Management, Business Intelligence, Digital Document..., landscape photographer, Understand CPM/Pert..., Real Estate Transactions, ability and desire to..., Testing, Networking, Linux, Access, Strategy, Operating Systems, Management, Start-ups
Education
Georgia Institute of Technology 1977 — 1980
Industrial and Systems Engineering, Industrial Engineering, 2.7
Morehouse College 1974 — 1980
Bachelor of Science (BS), Chemistry, Mathematics, Physics, B
Smart Device IT September 2013 - Present
Self-Employed June 2009 - July 2011
West Coast Real Estate Co. May 2005 - February 2008
LearniT! June 2007 - January 2008
IBM October 2003 - May 2005
IBM Microelectronics March 2001 - October 2003
Cybersource. Inc. July 1996 - July 1999
The Santa Cruz Operation March 1990 - June 1996
IBM, NAD July 1986 - February 1990
IBM OPD March 1981 - 1986
Skills
Software Development, Engineering, Training, Microsoft Office, Project Management, Business Intelligence, Digital Document..., landscape photographer, Understand CPM/Pert..., Real Estate Transactions, ability and desire to..., Testing, Networking, Linux, Access, Strategy, Operating Systems, Management, Start-ups
Education
Georgia Institute of Technology 1977 — 1980
Industrial and Systems Engineering, Industrial Engineering, 2.7
Morehouse College 1974 — 1980
Bachelor of Science (BS), Chemistry, Mathematics, Physics, B
Archna Haylock Archna Haylock's IBM Microelectronics Experience February 1998 - February 2000
Job Client Solution Executive
Industry Information Technology and Services
Experience
IBM Global Technology Services April 2012 - Present
IBM System & Technology Group January 2008 - April 2012
IBM December 2006 - January 2008
Self-employed July 2001 - December 2006
Phase 2 Technical Sales January 2001 - July 2001
IBM Microelectronics February 1998 - February 2000
IBM February 1996 - February 1998
Auravision Inc. June 1995 - February 1996
Texas Instruments, Inc. June 1991 - June 1995
Skills
Storage, Business Development, New Business Development, Sales Management, Strategy, Cloud Computing, Management, Business Alliances, Sales Operations, Selling, Sales, SaaS, Product Management
Education
University of Massachusetts at Lowell 1986 — 1990
BSEE, Engineering
IBM Global Technology Services April 2012 - Present
IBM System & Technology Group January 2008 - April 2012
IBM December 2006 - January 2008
Self-employed July 2001 - December 2006
Phase 2 Technical Sales January 2001 - July 2001
IBM Microelectronics February 1998 - February 2000
IBM February 1996 - February 1998
Auravision Inc. June 1995 - February 1996
Texas Instruments, Inc. June 1991 - June 1995
Skills
Storage, Business Development, New Business Development, Sales Management, Strategy, Cloud Computing, Management, Business Alliances, Sales Operations, Selling, Sales, SaaS, Product Management
Education
University of Massachusetts at Lowell 1986 — 1990
BSEE, Engineering
Bob Hannon Bob Hannon's IBM Microelectronics Experience June 1985 - November 2012
Job Retired Senior Engineering Manager
Industry Semiconductors
Experience
IBM Microelectronics June 1985 - November 2012
Skills
Semiconductor Process, Semiconductor..., Semiconductor Packaging, Semiconductor IP, Design of Experiments, Failure Analysis, Characterization, Process Integration, CMOS, Semiconductor Industry, Semiconductors, IC, Materials Science, Thin Films, Nanotechnology, Cross-functional Team..., Process Engineering, Program Management, SPC
Education
Rensselaer Polytechnic Institute
Master of Science (MS), Microelectronics Manufacturing
Penn State University
Master of Science (MS), Materials Science
Penn State University
Bachelor of Science (BS), Ceramic Science and Engineering
IBM Microelectronics June 1985 - November 2012
Skills
Semiconductor Process, Semiconductor..., Semiconductor Packaging, Semiconductor IP, Design of Experiments, Failure Analysis, Characterization, Process Integration, CMOS, Semiconductor Industry, Semiconductors, IC, Materials Science, Thin Films, Nanotechnology, Cross-functional Team..., Process Engineering, Program Management, SPC
Education
Rensselaer Polytechnic Institute
Master of Science (MS), Microelectronics Manufacturing
Penn State University
Master of Science (MS), Materials Science
Penn State University
Bachelor of Science (BS), Ceramic Science and Engineering
Eric Phipps Eric Phipps's IBM Microelectronics Experience August 1998 - August 2002
Job Project Manager at RF Micro Devices
Industry Semiconductors
Experience
RFMD February 2007 - Present
RFMD October 2004 - February 2007
RFMD October 2002 - October 2004
IBM Microelectronics August 1998 - August 2002
University of Virginia June 1996 - June 1998
College of William and Mary June 1995 - August 1995
Skills
Product Management, Process Improvement, Data Analysis, Product Development, Product Marketing, Team Leadership, Team Building, CMOS, Silicon, Leadership, Manufacturing, Circuit Design, Wireless, IC, Yield, Simulations, Engineering Management, Electronics, Analog
Education
University of Virginia Darden School of Business 2007 — 2009
MBA, Business
University of Virginia 1996 — 1998
MS, Electrical Engineering
Miami University 1992 — 1996
BS, Physics
RFMD February 2007 - Present
RFMD October 2004 - February 2007
RFMD October 2002 - October 2004
IBM Microelectronics August 1998 - August 2002
University of Virginia June 1996 - June 1998
College of William and Mary June 1995 - August 1995
Skills
Product Management, Process Improvement, Data Analysis, Product Development, Product Marketing, Team Leadership, Team Building, CMOS, Silicon, Leadership, Manufacturing, Circuit Design, Wireless, IC, Yield, Simulations, Engineering Management, Electronics, Analog
Education
University of Virginia Darden School of Business 2007 — 2009
MBA, Business
University of Virginia 1996 — 1998
MS, Electrical Engineering
Miami University 1992 — 1996
BS, Physics
Kelly J. Raymond Kelly J. Raymond's IBM Microelectronics Experience 1988 - 2001
Job Project Manager: University, NonProfits, Semiconductors
Industry Information Technology and Services
Experience
none 2008 - 2010
Montana State University May 2007 - June 2008
IBM Global Business Services 2003 - 2007
ILX Lightwave 2001 - 2002
IBM 1994 - 2001
IBM 1994 - 2001
IBM 1994 - 2001
IBM Microelectronics 1988 - 2001
Skills
Product Development, Leadership, Project Portfolio..., Business Process, Cross-functional Team..., Program Management, Integration, Semiconductors, Analysis, Risk Management, Software Project..., Human Resources, Testing, Engineering, Project Management, Business Process..., Business Analysis, Team Leadership, Process Improvement
Education
The George Washington University - School of Business 1996 — 1997
Master's Crt, Project Management
Merrimack College 1983 — 1988
BS, Electrical Engineering
none 2008 - 2010
Montana State University May 2007 - June 2008
IBM Global Business Services 2003 - 2007
ILX Lightwave 2001 - 2002
IBM 1994 - 2001
IBM 1994 - 2001
IBM 1994 - 2001
IBM Microelectronics 1988 - 2001
Skills
Product Development, Leadership, Project Portfolio..., Business Process, Cross-functional Team..., Program Management, Integration, Semiconductors, Analysis, Risk Management, Software Project..., Human Resources, Testing, Engineering, Project Management, Business Process..., Business Analysis, Team Leadership, Process Improvement
Education
The George Washington University - School of Business 1996 — 1997
Master's Crt, Project Management
Merrimack College 1983 — 1988
BS, Electrical Engineering
Nandini Ravi, PMP, CSM Nandini Ravi, PMP, CSM's IBM Microelectronics Experience July 2004 - October 2004
Job Agile Project Manager with 9 years of Experience
Industry Information Technology and Services
Experience
ThoughtWorks November 2012 - July 2014
Virtusa May 2010 - February 2012
Disha, Ma Foi Consulting 2009 - 2010
Deloitte Consulting November 2004 - October 2008
IBM Microelectronics July 2004 - October 2004
SensorLogic July 2003 - June 2004
Skills
Project Management, Agile Methodologies, Agile Project Management, Scrum Master, Scrum, Certified Scrum Master, SDLC, PMP, Management Consulting, Release Planning, Requirements Management, Scope Management, Client Service Oriented, Stakeholder Management, Consensus Building, Risk Management, Retrospectives, Onsite-Offshore..., Pre-Sales Consulting, Distributed Team..., Proposal Preparation, T&M, SOW, PnL Management, Revenue Forecasting, Customer Experience..., CRM Integration, Retail Banking, Global E-commerce, Non-profits..., Public Sector, Web Services, Open Source Software, Android Applications, MVC Architecture, Java, REST, EAI, SQL, Databases, Oracle 9i/10g, JIRA, Mingle, Confluence, MS Project, HP Quality Center, Business Analysis, Integration, Requirements Analysis, Software Project...
Education
The University of Texas at Arlington 2000 — 2003
Master of Science, Computer Science, 3.8
University of Madras 1996 — 2000
Bachelor of Technology, Chemical Engineering, First Class
ThoughtWorks November 2012 - July 2014
Virtusa May 2010 - February 2012
Disha, Ma Foi Consulting 2009 - 2010
Deloitte Consulting November 2004 - October 2008
IBM Microelectronics July 2004 - October 2004
SensorLogic July 2003 - June 2004
Skills
Project Management, Agile Methodologies, Agile Project Management, Scrum Master, Scrum, Certified Scrum Master, SDLC, PMP, Management Consulting, Release Planning, Requirements Management, Scope Management, Client Service Oriented, Stakeholder Management, Consensus Building, Risk Management, Retrospectives, Onsite-Offshore..., Pre-Sales Consulting, Distributed Team..., Proposal Preparation, T&M, SOW, PnL Management, Revenue Forecasting, Customer Experience..., CRM Integration, Retail Banking, Global E-commerce, Non-profits..., Public Sector, Web Services, Open Source Software, Android Applications, MVC Architecture, Java, REST, EAI, SQL, Databases, Oracle 9i/10g, JIRA, Mingle, Confluence, MS Project, HP Quality Center, Business Analysis, Integration, Requirements Analysis, Software Project...
Education
The University of Texas at Arlington 2000 — 2003
Master of Science, Computer Science, 3.8
University of Madras 1996 — 2000
Bachelor of Technology, Chemical Engineering, First Class
Marwan Khater's IBM Microelectronics Experience November 2000 - February 2006
Job Senior Engineer/Scientist at IBM T. J. Watson Research Center
Industry Semiconductors
Experience
IBM T. J. Watson Research Center March 2006 - Present
IBM Microelectronics November 2000 - February 2006
Skills
Electrical Engineering, Research, Physics, Microelectronics, Device Physics, Semiconductor..., Nanotechnology, Characterization, Semiconductors, Electronics, CMOS, Silicon, IC, Thin Films, Materials Science, SiGe HBT/BiCMOS..., Plasma Processing
Education
Middle East Technical University
B.S., Physics
Texas State University-San Marcos
M.S., Physics and Computer Science
The University of Texas at Dallas
Ph.D., Electrical Engineering (Microelectronics)
IBM T. J. Watson Research Center March 2006 - Present
IBM Microelectronics November 2000 - February 2006
Skills
Electrical Engineering, Research, Physics, Microelectronics, Device Physics, Semiconductor..., Nanotechnology, Characterization, Semiconductors, Electronics, CMOS, Silicon, IC, Thin Films, Materials Science, SiGe HBT/BiCMOS..., Plasma Processing
Education
Middle East Technical University
B.S., Physics
Texas State University-San Marcos
M.S., Physics and Computer Science
The University of Texas at Dallas
Ph.D., Electrical Engineering (Microelectronics)
Sylvia Zijing Chen Sylvia Zijing Chen's IBM Microelectronics Experience May 2015 - July 2015
Job Process Engineering Intern at GLOBALFOUNDRIES
Industry Chemicals
Experience
GLOBALFOUNDRIES July 2015 - August 2015
IBM Microelectronics May 2015 - July 2015
RPI Dr. Jonathan Dordick’s research group August 2013 - May 2015
Novozymes May 2013 - August 2013
RPI Dr. Joel Plawsky’s laboratory January 2013 - May 2013
RPI Dr. E Bruce Watson’s laboratory January 2013 - May 2013
Dr. Xuejiang Wang’s laboratory, Capital Medical University May 2009 - September 2010
Skills
Process Engineering, Chemical Engineering, Chemistry, R&D, Biotechnology, Design of Experiments, Process Optimization, HPLC, Chromatography, Polymers, Protein Purification, JMP, UV/Vis, Lithography, Microsoft Excel, Protein Assays, DNA quantification, Quantitative Analytics, PCR, SDS-PAGE, Matlab, Protein Expression, Bacterial Cell Culture, Bacterial Transformation, Cell Culture, Liquefaction, SuperPro, NX Unigraphics, CAD, Photoshop, Maple, Project Management, SAS, Semiconductor...
Education
Rensselaer Polytechnic Institute 2014 — 2016
Master of Science (MS), Supply Chain Management
Rensselaer Polytechnic Institute 2011 — 2015
Bachelor of Science (BS), Chemical Engineering
Danmarks Tekniske Universitet 2014 — 2014
Chemical Engineering
GLOBALFOUNDRIES July 2015 - August 2015
IBM Microelectronics May 2015 - July 2015
RPI Dr. Jonathan Dordick’s research group August 2013 - May 2015
Novozymes May 2013 - August 2013
RPI Dr. Joel Plawsky’s laboratory January 2013 - May 2013
RPI Dr. E Bruce Watson’s laboratory January 2013 - May 2013
Dr. Xuejiang Wang’s laboratory, Capital Medical University May 2009 - September 2010
Skills
Process Engineering, Chemical Engineering, Chemistry, R&D, Biotechnology, Design of Experiments, Process Optimization, HPLC, Chromatography, Polymers, Protein Purification, JMP, UV/Vis, Lithography, Microsoft Excel, Protein Assays, DNA quantification, Quantitative Analytics, PCR, SDS-PAGE, Matlab, Protein Expression, Bacterial Cell Culture, Bacterial Transformation, Cell Culture, Liquefaction, SuperPro, NX Unigraphics, CAD, Photoshop, Maple, Project Management, SAS, Semiconductor...
Education
Rensselaer Polytechnic Institute 2014 — 2016
Master of Science (MS), Supply Chain Management
Rensselaer Polytechnic Institute 2011 — 2015
Bachelor of Science (BS), Chemical Engineering
Danmarks Tekniske Universitet 2014 — 2014
Chemical Engineering
Carolyn Nguyen Carolyn Nguyen's IBM Microelectronics Experience August 1997 - April 2000
Job Sr. Engineer, Software Quality at Becton Dickenson
Industry Computer Software
Experience
BD (formerly Carefusion) November 2014 - Present
Microsoft (formerly Nokia) June 2012 - September 2014
Life Technologies October 2008 - December 2011
IBM Microelectronics August 1997 - April 2000
Skills
Quality Assurance, Embedded Systems, Integration, Test Management, Cross-functional Team..., Product Management, Process Improvement, Product Development, Medical Devices, R&D, Software Quality..., Leadership, Requirements Analysis
Education
University of Maryland College Park
Bachelor of Science (BSc)
BD (formerly Carefusion) November 2014 - Present
Microsoft (formerly Nokia) June 2012 - September 2014
Life Technologies October 2008 - December 2011
IBM Microelectronics August 1997 - April 2000
Skills
Quality Assurance, Embedded Systems, Integration, Test Management, Cross-functional Team..., Product Management, Process Improvement, Product Development, Medical Devices, R&D, Software Quality..., Leadership, Requirements Analysis
Education
University of Maryland College Park
Bachelor of Science (BSc)
Kim Carson, RN, BSN, BSEE Kim Carson, RN, BSN, BSEE's IBM Microelectronics Experience June 1991 - July 1995
Job Inpatient Oncology and Chemotherapy Infusion at Centura Health
Industry Hospital & Health Care
Experience
Centura Health January 2013 - Present
Centura Health January 2015 - July 2015
Honeywell June 2010 - May 2011
Intel Corporation June 2005 - March 2008
Intel Corporation June 2003 - June 2005
Intel Corporation June 2000 - June 2003
Intel Corporation August 1995 - June 2000
IBM Microelectronics June 1991 - July 1995
Skills
Semiconductor Industry, EKG Interpretation, Medical/Surgical, Oncology, Registered Nurses, Quality Management, Healthcare, Six Sigma, Hospitals, Nursing, R&D, Root Cause Analysis, Start-ups, Reliability, Medical Devices, Acute Care, BLS, Clinical Research, Engineering, IV, Design of Experiments, EKG, Continuous Improvement, Process Engineering, Cross-functional Team..., Process Improvement, Program Management, Engineering Management
Education
University of Wisconsin-Madison 1988 — 1991
BSEE, Electrical Engineering, 3.3/4.0
University of Colorado at Colorado Springs 2010 — 2012
Bachelor of Science, Nursing, 3.8/4.0
Centura Health January 2013 - Present
Centura Health January 2015 - July 2015
Honeywell June 2010 - May 2011
Intel Corporation June 2005 - March 2008
Intel Corporation June 2003 - June 2005
Intel Corporation June 2000 - June 2003
Intel Corporation August 1995 - June 2000
IBM Microelectronics June 1991 - July 1995
Skills
Semiconductor Industry, EKG Interpretation, Medical/Surgical, Oncology, Registered Nurses, Quality Management, Healthcare, Six Sigma, Hospitals, Nursing, R&D, Root Cause Analysis, Start-ups, Reliability, Medical Devices, Acute Care, BLS, Clinical Research, Engineering, IV, Design of Experiments, EKG, Continuous Improvement, Process Engineering, Cross-functional Team..., Process Improvement, Program Management, Engineering Management
Education
University of Wisconsin-Madison 1988 — 1991
BSEE, Electrical Engineering, 3.3/4.0
University of Colorado at Colorado Springs 2010 — 2012
Bachelor of Science, Nursing, 3.8/4.0
Pieter Kerstens Pieter Kerstens's IBM Microelectronics Experience March 1989 - December 1992
Job
Industry Consumer Electronics
Experience
Velodyne Acoustics, Inc. March 2015 - Present
TDK November 2014 - March 2015
Xicato, Inc September 2010 - September 2014
Cymer, Inc November 2008 - September 2010
Hitachi GST January 2003 - November 2008
IBM Storage Division and IBM Manufacturing Technology Center January 1993 - December 2002
IBM Microelectronics March 1989 - December 1992
Philips Research June 1983 - March 1989
Education
Lehigh University 1985 — 1985
MS, Manufacturing Systems Engineering
Eindhoven University of Technology, The Netherlands 1981 — 1983
MS, Electrical Engineering
Eindhoven University of Technology, The Netherlands 1977 — 1981
BS, Electrical Engineering
Technion - Israel Institute of Technology
Velodyne Acoustics, Inc. March 2015 - Present
TDK November 2014 - March 2015
Xicato, Inc September 2010 - September 2014
Cymer, Inc November 2008 - September 2010
Hitachi GST January 2003 - November 2008
IBM Storage Division and IBM Manufacturing Technology Center January 1993 - December 2002
IBM Microelectronics March 1989 - December 1992
Philips Research June 1983 - March 1989
Education
Lehigh University 1985 — 1985
MS, Manufacturing Systems Engineering
Eindhoven University of Technology, The Netherlands 1981 — 1983
MS, Electrical Engineering
Eindhoven University of Technology, The Netherlands 1977 — 1981
BS, Electrical Engineering
Technion - Israel Institute of Technology
Edward Cooney Edward Cooney's IBM Microelectronics Experience September 1994 - June 2015
Job Microelectronics Engineer at Global Foundries
Industry Information Technology and Services
Experience
Global Foundries July 2015 - Present
IBM Microelectronics September 1994 - June 2015
Education
The University of Connecticut 1981 — 1992
Ph.D., Materials Engineering
Global Foundries July 2015 - Present
IBM Microelectronics September 1994 - June 2015
Education
The University of Connecticut 1981 — 1992
Ph.D., Materials Engineering
Shamit Som Shamit Som's IBM Microelectronics Experience May 2013 - August 2013
Job Design Engineer at MACOM
Industry Electrical/Electronic Manufacturing
Experience
MACOM June 2015 - Present
Lutron Electronics May 2014 - August 2014
IBM Microelectronics May 2013 - August 2013
EMD Millipore May 2012 - January 2013
University of Massachusetts Amherst September 2011 - December 2011
Brandeis University July 2011 - September 2011
Skills
LTSpice, OrCAD Capture, PSpice, Altium Designer, EagleCAD, Solidworks, Verilog, C, Java, C#, Microsoft Office, Adobe Creative Suite, CSS, JavaScript, Windows, Microchip PIC, Atmel AVR, .NET, HTML, NI LabVIEW, MATLAB, Cortex-M0
Education
University of Massachusetts, Amherst 2014 — 2015
Master's Degree, Electrical, Electronics and Communications Engineering
University of Massachusetts, Amherst 2010 — 2014
Bachelor's Degree, Electrical Engineering, Major GPA: 3.911/4.0
Waltham High School 2006 — 2010
MACOM June 2015 - Present
Lutron Electronics May 2014 - August 2014
IBM Microelectronics May 2013 - August 2013
EMD Millipore May 2012 - January 2013
University of Massachusetts Amherst September 2011 - December 2011
Brandeis University July 2011 - September 2011
Skills
LTSpice, OrCAD Capture, PSpice, Altium Designer, EagleCAD, Solidworks, Verilog, C, Java, C#, Microsoft Office, Adobe Creative Suite, CSS, JavaScript, Windows, Microchip PIC, Atmel AVR, .NET, HTML, NI LabVIEW, MATLAB, Cortex-M0
Education
University of Massachusetts, Amherst 2014 — 2015
Master's Degree, Electrical, Electronics and Communications Engineering
University of Massachusetts, Amherst 2010 — 2014
Bachelor's Degree, Electrical Engineering, Major GPA: 3.911/4.0
Waltham High School 2006 — 2010
Gordana Zupanski-Nielsen Gordana Zupanski-Nielsen's IBM Microelectronics Experience January 2001 - December 2006
Job Procurement Engineering Manager at IBM
Industry Semiconductors
Experience
IBM Integrated Supply Chain January 2011 - Present
IBM ISC 2011 - 2015
IBM ISC 2011 - 2015
IBM June 2006 - December 2010
IBM Microelectronics January 2001 - December 2006
Motorola SPS January 1990 - December 2000
Motorola 1990 - 2000
Motorola 1990 - 2000
Skills
CMOS, Reliability, Engineering, Semiconductor..., Materials, Process Integration, Characterization, SPC, Thin Films, MEMS, Process Development, R&D, Design of Experiments, Manufacturing, Integration, Six Sigma, Program Management, Data Analysis, DOE, Process Engineering, Materials Science, Research, Semiconductors, Yield Enhancement, Technology Development, Quality Assurance, Failure Analysis, Metrology, FMEA, Engineering Management, Microelectronics, Technology Transfer, Lean Manufacturing, Cross-functional Team..., Continuous Improvement, Semiconductor Industry, Root Cause Analysis, Cost Reduction, Solar, Etching, PVD, Photovoltaics, Yield, Process Simulation, Solar Energy, Simulations, IC, Nanotechnology, Testing, Electronics
Education
University of Rochester 1982 — 1985
MS, Materiasl Science
Stony Brook University 1978 — 1982
BS Chemistry/Biology, Chemistry/Biology
IBM Integrated Supply Chain January 2011 - Present
IBM ISC 2011 - 2015
IBM ISC 2011 - 2015
IBM June 2006 - December 2010
IBM Microelectronics January 2001 - December 2006
Motorola SPS January 1990 - December 2000
Motorola 1990 - 2000
Motorola 1990 - 2000
Skills
CMOS, Reliability, Engineering, Semiconductor..., Materials, Process Integration, Characterization, SPC, Thin Films, MEMS, Process Development, R&D, Design of Experiments, Manufacturing, Integration, Six Sigma, Program Management, Data Analysis, DOE, Process Engineering, Materials Science, Research, Semiconductors, Yield Enhancement, Technology Development, Quality Assurance, Failure Analysis, Metrology, FMEA, Engineering Management, Microelectronics, Technology Transfer, Lean Manufacturing, Cross-functional Team..., Continuous Improvement, Semiconductor Industry, Root Cause Analysis, Cost Reduction, Solar, Etching, PVD, Photovoltaics, Yield, Process Simulation, Solar Energy, Simulations, IC, Nanotechnology, Testing, Electronics
Education
University of Rochester 1982 — 1985
MS, Materiasl Science
Stony Brook University 1978 — 1982
BS Chemistry/Biology, Chemistry/Biology
Paul Zucco Paul Zucco's IBM Microelectronics Experience March 1988 - August 2008
Job Experienced Engineering Professional with a Quality Focus
Industry Chemicals
Experience
Bridgestone June 2012 - Present
Bridgestone 2012 - 2013
Henniges Automotive Research and Development Center August 2011 - December 2011
CF Training initiative at Roane State-AMTEC 2010 - 2011
IBM Microelectronics March 1988 - August 2008
IBM Research April 2003 - July 2008
Skills
Mechanical property..., Rheology of polymers, Chemical resistance, Patent Analysis, Patent Portfolio..., FTIR, Minitab, Polymer Materials..., Electronic Packaging, Polymers, Testing, Patents, Rubber Compounding, Polymer Blends, Polymer Composites, Design of Experiments, Manufacturing, Process Engineering, Six Sigma, Product Development, Electronics Packaging, Nanotechnology, SPC, Process Simulation, Semiconductors, Materials, Coatings, Materials Science, R&D, Engineering, Chemistry, Electronics, Product Design
Education
Penn State University,University Park
M.S., Material Science and Engineering-Polymer Science
University of Massachusetts, Amherst 1980 — 1983
B.S., Science-Cum Laude, Cum Laude
Pace University School of Law
Audited Law 615, class in Preparation and Prosecution of Patents, Audited
Bridgestone June 2012 - Present
Bridgestone 2012 - 2013
Henniges Automotive Research and Development Center August 2011 - December 2011
CF Training initiative at Roane State-AMTEC 2010 - 2011
IBM Microelectronics March 1988 - August 2008
IBM Research April 2003 - July 2008
Skills
Mechanical property..., Rheology of polymers, Chemical resistance, Patent Analysis, Patent Portfolio..., FTIR, Minitab, Polymer Materials..., Electronic Packaging, Polymers, Testing, Patents, Rubber Compounding, Polymer Blends, Polymer Composites, Design of Experiments, Manufacturing, Process Engineering, Six Sigma, Product Development, Electronics Packaging, Nanotechnology, SPC, Process Simulation, Semiconductors, Materials, Coatings, Materials Science, R&D, Engineering, Chemistry, Electronics, Product Design
Education
Penn State University,University Park
M.S., Material Science and Engineering-Polymer Science
University of Massachusetts, Amherst 1980 — 1983
B.S., Science-Cum Laude, Cum Laude
Pace University School of Law
Audited Law 615, class in Preparation and Prosecution of Patents, Audited
Christopher Ro's IBM Microelectronics Experience June 1994 - July 2013
Job Analog Circuit Design Manager at asicNorth
Industry Consumer Electronics
Experience
asicNorth August 2013 - Present
IBM Microelectronics June 1994 - July 2013
LeCroy Corporation (now Teledyne LeCroy) October 1992 - June 1994
TRW Space & Defense (acquired by Northrop Grumman) November 1990 - October 1992
Hughes Aircraft Company (acquired by Raytheon) August 1988 - November 1990
TRW Space & Defense (acquired by Northrop Grumman) April 1985 - August 1988
Skills
Analog Design, Mixed Signal, Analog, PLL, Analog Circuit Design, CMOS, Integrated Circuit..., Electronics, IC, VLSI, Physical Design, Hardware, EDA, ASIC, SERDES, Circuit Design, SoC, Semiconductors, Verilog, Hardware Architecture, Debugging, Cadence Virtuoso, TCL, VHDL, Logic Design, Microprocessors, Functional Verification, Processors, Signal Integrity, RTL design
Education
University of Southern California 1986 — 1988
MSEE, Electrical Engineering
University of California, Los Angeles 1981 — 1985
BSEE, Electrical Engineering
asicNorth August 2013 - Present
IBM Microelectronics June 1994 - July 2013
LeCroy Corporation (now Teledyne LeCroy) October 1992 - June 1994
TRW Space & Defense (acquired by Northrop Grumman) November 1990 - October 1992
Hughes Aircraft Company (acquired by Raytheon) August 1988 - November 1990
TRW Space & Defense (acquired by Northrop Grumman) April 1985 - August 1988
Skills
Analog Design, Mixed Signal, Analog, PLL, Analog Circuit Design, CMOS, Integrated Circuit..., Electronics, IC, VLSI, Physical Design, Hardware, EDA, ASIC, SERDES, Circuit Design, SoC, Semiconductors, Verilog, Hardware Architecture, Debugging, Cadence Virtuoso, TCL, VHDL, Logic Design, Microprocessors, Functional Verification, Processors, Signal Integrity, RTL design
Education
University of Southern California 1986 — 1988
MSEE, Electrical Engineering
University of California, Los Angeles 1981 — 1985
BSEE, Electrical Engineering
Kirk Berridge Kirk Berridge's IBM Microelectronics Experience June 1981 - January 2014
Job Senior Engineer at IBM Microelectronics
Industry Semiconductors
Experience
IBM Microelectronics June 1981 - January 2014
Skills
Semiconductors, Design of Experiments, Six Sigma, Process Engineering, Software Development, Integration, Enterprise Architecture, Automation, SPC, Manufacturing, Engineering, Process Simulation, Electronics, FMEA, Failure Analysis, Root Cause Analysis, Testing, Engineering Management, Thin Films, Cross-functional Team..., R&D, IC, Systems Engineering, Semiconductor Industry, Simulations
Education
University of Wisconsin-Madison 1988 — 1989
MSMSE, Manufacturing Systems Engineering / Business
Purdue University 1980 — 1981
BSEE, E.E. Computer Systems
Beloit College 1976 — 1980
BA, Engineering /Physics
IBM Microelectronics June 1981 - January 2014
Skills
Semiconductors, Design of Experiments, Six Sigma, Process Engineering, Software Development, Integration, Enterprise Architecture, Automation, SPC, Manufacturing, Engineering, Process Simulation, Electronics, FMEA, Failure Analysis, Root Cause Analysis, Testing, Engineering Management, Thin Films, Cross-functional Team..., R&D, IC, Systems Engineering, Semiconductor Industry, Simulations
Education
University of Wisconsin-Madison 1988 — 1989
MSMSE, Manufacturing Systems Engineering / Business
Purdue University 1980 — 1981
BSEE, E.E. Computer Systems
Beloit College 1976 — 1980
BA, Engineering /Physics
Glenn Pomerantz Glenn Pomerantz's IBM Microelectronics Experience 1988 - Present
Job
Industry
Experience
CHVFOA 1994 - Present
IBM 1988 - Present
IBM Microelectronics 1988 - Present
Skills
Design of Experiments, Technical Leadership, Failure Analysis, Testing, Semiconductors, Engineering, Integration, Team Building, Six Sigma, Process Engineering, Cross-functional Team..., Program Management, Automation, IC, Systems Engineering, Thin Films, Programming, Troubleshooting, Industrial Safety
Education
Walden University 2003 — 2008
MS, electrical engineering, 3.7
SUNY I/T 1982 — 1984
Bachelor of Technology (B.Tech.), Electrical Engineering Technologies/Technicians, 3.8
Ulster County Community College 1980 — 1982
Associate of Arts and Sciences (AAS), Electrical Engineering Technologies/Technicians, 3.8
CHVFOA 1994 - Present
IBM 1988 - Present
IBM Microelectronics 1988 - Present
Skills
Design of Experiments, Technical Leadership, Failure Analysis, Testing, Semiconductors, Engineering, Integration, Team Building, Six Sigma, Process Engineering, Cross-functional Team..., Program Management, Automation, IC, Systems Engineering, Thin Films, Programming, Troubleshooting, Industrial Safety
Education
Walden University 2003 — 2008
MS, electrical engineering, 3.7
SUNY I/T 1982 — 1984
Bachelor of Technology (B.Tech.), Electrical Engineering Technologies/Technicians, 3.8
Ulster County Community College 1980 — 1982
Associate of Arts and Sciences (AAS), Electrical Engineering Technologies/Technicians, 3.8
Derik Breen's IBM Microelectronics Experience December 1995 - January 2009
Job Owner at Boucher Cleaning Services, LLC.
Industry Consumer Services
Experience
Green Mountain Coffee Roasters August 2011 - Present
Boucher Cleaning Services, LLC. October 2002 - Present
IBM Microelectronics December 1995 - January 2009
Culligan International 1992 - 1994
Skills
Team Leadership, Management, Continuous Improvement, Inventory Management, Process Improvement, Team Building, Project Management, Strategy, Change Management, Microsoft Office, Manufacturing, Inventory Control, Purchasing, Customer Service, Lean Manufacturing, Operations Management, Microsoft Technologies, Supply Chain, Train the Trainer..., Leadership Development, Rapid Process..., Crucial Confrontations, 5S, 6S, Algebraic Geometry, Account Reconciliation, RIE, Line Clearance, Troubleshooting, Computer Proficiency
Education
Siena College
Bachelor of Business Administration (BBA), Business
CGCC
Criminal Justice, Criminalistics and Criminal Science
Averill Park High School 1981 — 1985
Green Mountain Coffee Roasters August 2011 - Present
Boucher Cleaning Services, LLC. October 2002 - Present
IBM Microelectronics December 1995 - January 2009
Culligan International 1992 - 1994
Skills
Team Leadership, Management, Continuous Improvement, Inventory Management, Process Improvement, Team Building, Project Management, Strategy, Change Management, Microsoft Office, Manufacturing, Inventory Control, Purchasing, Customer Service, Lean Manufacturing, Operations Management, Microsoft Technologies, Supply Chain, Train the Trainer..., Leadership Development, Rapid Process..., Crucial Confrontations, 5S, 6S, Algebraic Geometry, Account Reconciliation, RIE, Line Clearance, Troubleshooting, Computer Proficiency
Education
Siena College
Bachelor of Business Administration (BBA), Business
CGCC
Criminal Justice, Criminalistics and Criminal Science
Averill Park High School 1981 — 1985
Scott Bukofsky's IBM Microelectronics Experience February 2000 - February 2006
Job Sales and Business Development, Aerospace and Defense at GLOBALFOUNDRIES
Industry Semiconductors
Experience
GLOBALFOUNDRIES July 2015 - Present
IBM January 2013 - June 2015
IBM Semiconductor R&D Center, Systems & Technology Group September 2010 - December 2012
IBM Semiconductor R&D Center, Systems & Technology Group February 2006 - September 2010
IBM Microelectronics February 2000 - February 2006
IBM Microelectronics May 1998 - February 2000
Skills
Semiconductor..., Semiconductor sales, Process Integration, Lithography, Metrology, Optics, Manufacturing, Semiconductor Process, Yield, Program Management, Plasma Etch, IC, CMOS, Integration, Semiconductor Industry, Design of Experiments, ASIC, Thin Films, EDA, SoC, Failure Analysis, Characterization, Strategic Communications, Engineering Management, Semiconductors, R&D, Simulations, Analog, Electronics, SPC, Leadership
Education
Yale University 1993 — 1998
PhD, Electrical Engineering
Rochester Institute of Technology 1987 — 1992
BS, Microelectronic Engineering
GLOBALFOUNDRIES July 2015 - Present
IBM January 2013 - June 2015
IBM Semiconductor R&D Center, Systems & Technology Group September 2010 - December 2012
IBM Semiconductor R&D Center, Systems & Technology Group February 2006 - September 2010
IBM Microelectronics February 2000 - February 2006
IBM Microelectronics May 1998 - February 2000
Skills
Semiconductor..., Semiconductor sales, Process Integration, Lithography, Metrology, Optics, Manufacturing, Semiconductor Process, Yield, Program Management, Plasma Etch, IC, CMOS, Integration, Semiconductor Industry, Design of Experiments, ASIC, Thin Films, EDA, SoC, Failure Analysis, Characterization, Strategic Communications, Engineering Management, Semiconductors, R&D, Simulations, Analog, Electronics, SPC, Leadership
Education
Yale University 1993 — 1998
PhD, Electrical Engineering
Rochester Institute of Technology 1987 — 1992
BS, Microelectronic Engineering
Christopher Sanetra Christopher Sanetra's IBM Microelectronics Experience June 1981 - June 2015
Job Manufacturing Yield Engineer at GLOBALFOUNDRIES
Industry Semiconductors
Experience
GLOBALFOUNDRIES July 2015 - Present
IBM Microelectronics June 1981 - June 2015
IBM May 1980 - August 1980
Skills
Characterization, Semiconductors, Failure Analysis, Yield, Process Engineering, Data Analysis, SAS programming, Reliability, Statistics, Analysis, Process Improvement, Microsoft Office, Lean Manufacturing, Project Management, ASIC
Education
University of Illinois at Urbana-Champaign 1977 — 1981
BS, Chemical Engineering, 3.9/4.0
GLOBALFOUNDRIES July 2015 - Present
IBM Microelectronics June 1981 - June 2015
IBM May 1980 - August 1980
Skills
Characterization, Semiconductors, Failure Analysis, Yield, Process Engineering, Data Analysis, SAS programming, Reliability, Statistics, Analysis, Process Improvement, Microsoft Office, Lean Manufacturing, Project Management, ASIC
Education
University of Illinois at Urbana-Champaign 1977 — 1981
BS, Chemical Engineering, 3.9/4.0
Lisa Nguyen Lisa Nguyen's IBM Microelectronics Experience 1998 - 1998
Job
Industry Medical Devices
Experience
HeartWare Inc June 2013 - Present
Intuitive Surgical June 2010 - May 2013
Edwards Lifesciences August 2007 - June 2010
Guidant / Boston Scientific January 2006 - July 2007
IBM June 2001 - December 2005
IBM 2000 - 2000
IBM Global Services 1999 - 1999
IBM Microelectronics 1998 - 1998
Education
The Ohio State University 1997 — 2001
BS
HeartWare Inc June 2013 - Present
Intuitive Surgical June 2010 - May 2013
Edwards Lifesciences August 2007 - June 2010
Guidant / Boston Scientific January 2006 - July 2007
IBM June 2001 - December 2005
IBM 2000 - 2000
IBM Global Services 1999 - 1999
IBM Microelectronics 1998 - 1998
Education
The Ohio State University 1997 — 2001
BS
Sean Broderick Sean Broderick's IBM Microelectronics Experience May 1998 - January 2000
Job Mobile Applications at ScrollMotion
Industry Wireless
Experience
ScrollMotion January 2011 - Present
STA Applications September 2012 - August 2013
UI Magic Inc August 2005 - December 2010
Disney Mobile February 2004 - August 2005
Wavecom April 2001 - February 2004
Neopoint January 2000 - September 2000
IBM Microelectronics May 1998 - January 2000
Nokia Mobile Phones June 1992 - April 1997
Skills
Android, Java, Software Development, Mobile Devices, Program Management, Mobile Applications, Product Management, Management, Leadership, iPhone, GSM, Wireless, Mobile Technology, Business Development, FCC, User Interface Design, Product Development, Mobile Internet, PHP, User Experience, SaaS, PMO, Agile Methodologies, iOS, Fundraising, M2M, Outsourcing Management, Enterprise Software, Manage Client..., Contract Negotiation, APIs, Start-up Environment, Project Management
Education
The College of New Jersey 1984 — 1987
BSEE, Engineering
University of Phoenix
MBA, Technology Management
ScrollMotion January 2011 - Present
STA Applications September 2012 - August 2013
UI Magic Inc August 2005 - December 2010
Disney Mobile February 2004 - August 2005
Wavecom April 2001 - February 2004
Neopoint January 2000 - September 2000
IBM Microelectronics May 1998 - January 2000
Nokia Mobile Phones June 1992 - April 1997
Skills
Android, Java, Software Development, Mobile Devices, Program Management, Mobile Applications, Product Management, Management, Leadership, iPhone, GSM, Wireless, Mobile Technology, Business Development, FCC, User Interface Design, Product Development, Mobile Internet, PHP, User Experience, SaaS, PMO, Agile Methodologies, iOS, Fundraising, M2M, Outsourcing Management, Enterprise Software, Manage Client..., Contract Negotiation, APIs, Start-up Environment, Project Management
Education
The College of New Jersey 1984 — 1987
BSEE, Engineering
University of Phoenix
MBA, Technology Management
Miguel Jimarez Miguel Jimarez's IBM Microelectronics Experience 1986 - 2003
Job VP Emerging Products at AMKOR
Industry Semiconductors
Experience
Amkor Technology August 2003 - Present
Amkor Technology August 2003 - March 2007
IBM March 1986 - August 2003
IBM Microelectronics 1986 - 2003
Skills
Manufacturing, Reliability, Semiconductors, Materials, Engineers, IC, SPC, Assembly, Process Development, Characterization, Engineering Management, Product Engineering, Failure Analysis, Product Development, Problem Solving, Design for Manufacturing, Technology Development, Design of Experiments, Semiconductor Industry, Silicon, DOE, R&D, Six Sigma, Cross-functional Team..., Continuous Improvement, Simulation, Process Engineering, Cost Reduction, Materials Science, FMEA, Microelectronics, JMP, Program Management, Electronics Packaging, Quality Management, Product Management, Electronics, Yield, CMOS, Process Simulation, Mixed Signal, SoC, Root Cause Analysis, Analog, Sensors, EDA, Metrology, CVD, Simulations
Education
New Mexico State University 1983 — 1986
MS, Chemical Engineering
The University of Texas at El Paso 1981 — 1983
MS, Chemistry
The University of Texas at El Paso 1977 — 1983
BS, Chemistry
Amkor Technology August 2003 - Present
Amkor Technology August 2003 - March 2007
IBM March 1986 - August 2003
IBM Microelectronics 1986 - 2003
Skills
Manufacturing, Reliability, Semiconductors, Materials, Engineers, IC, SPC, Assembly, Process Development, Characterization, Engineering Management, Product Engineering, Failure Analysis, Product Development, Problem Solving, Design for Manufacturing, Technology Development, Design of Experiments, Semiconductor Industry, Silicon, DOE, R&D, Six Sigma, Cross-functional Team..., Continuous Improvement, Simulation, Process Engineering, Cost Reduction, Materials Science, FMEA, Microelectronics, JMP, Program Management, Electronics Packaging, Quality Management, Product Management, Electronics, Yield, CMOS, Process Simulation, Mixed Signal, SoC, Root Cause Analysis, Analog, Sensors, EDA, Metrology, CVD, Simulations
Education
New Mexico State University 1983 — 1986
MS, Chemical Engineering
The University of Texas at El Paso 1981 — 1983
MS, Chemistry
The University of Texas at El Paso 1977 — 1983
BS, Chemistry
Rich Burda Rich Burda's IBM Microelectronics Experience May 2001 - July 2003
Job Client Interface Integrated Supply Chain at IBM
Industry Logistics and Supply Chain
Experience
IBM February 2011 - Present
IBM January 2009 - April 2011
IBM 2003 - 2009
IBM Microelectronics May 2001 - July 2003
Kulicke & Soffa Industries 1999 - 2001
Kulicke and Soffa 1997 - 1999
Crown Cork & Seal January 1995 - January 1997
Skills
Manufacturing, Semiconductors, Software Development, Start-ups, Process Engineering, Supply Chain, Integration, Product Marketing, Cross-functional Team..., Automation, Testing, Product Management, Six Sigma, Program Management, Process Improvement, Industrial Engineering, Business Process...
Education
Pennsylvania State University-Great Valley Graduate Center 1996 — 1999
MS, Management
Villanova University 1986 — 1990
BS, Mechanical Engineering
IBM February 2011 - Present
IBM January 2009 - April 2011
IBM 2003 - 2009
IBM Microelectronics May 2001 - July 2003
Kulicke & Soffa Industries 1999 - 2001
Kulicke and Soffa 1997 - 1999
Crown Cork & Seal January 1995 - January 1997
Skills
Manufacturing, Semiconductors, Software Development, Start-ups, Process Engineering, Supply Chain, Integration, Product Marketing, Cross-functional Team..., Automation, Testing, Product Management, Six Sigma, Program Management, Process Improvement, Industrial Engineering, Business Process...
Education
Pennsylvania State University-Great Valley Graduate Center 1996 — 1999
MS, Management
Villanova University 1986 — 1990
BS, Mechanical Engineering
Kenneth Kanhua Liang Kenneth Kanhua Liang's IBM Microelectronics Experience May 2001 - December 2002
Job Microwave Backhaul Engineer at Comsearch
Industry Defense & Space
Experience
Comsearch April 2014 - April 2015
Mantech International Corporation July 2010 - August 2012
MITRE March 2007 - June 2010
Booz Allen Hamilton November 2005 - March 2007
DETECON May 2003 - November 2005
IBM MicroElectronics May 2001 - December 2002
Stanford Telecom Inc August 1997 - August 1999
Skills
RF, Systems Engineering, Antennas, Matlab, System Architecture, Defense, Electrical Engineering, Electromagnetics, Integration, Microwave, RF Engineering, Mathematica, Testing, Wireless, Program Management, Telecommunications, Optimization, Stochastic Processes, Mathematical Programming, Management, Radar, Project Management, Computational..., Mathematical Analysis, Microwaves, Htz Warfare, RF testing, Hardware integration, Computer Hardware..., Computer Hardware..., Computer Hardware..., digital logic and..., Visual Basic, Python, C/C++, SQL
Education
University of Illinois at Urbana-Champaign 1999 — 2003
Master of Science, Electrical Engineering, 3.4
University of Illinois at Urbana-Champaign 1999 — 2003
Master of Business Administration (M.B.A.), Business Administration, 3.4
Virginia Polytechnic Institute and State University 1994 — 1997
Bachelor of Science, Electrical Engineering, 3.7
Shi Xi middle school.
Comsearch April 2014 - April 2015
Mantech International Corporation July 2010 - August 2012
MITRE March 2007 - June 2010
Booz Allen Hamilton November 2005 - March 2007
DETECON May 2003 - November 2005
IBM MicroElectronics May 2001 - December 2002
Stanford Telecom Inc August 1997 - August 1999
Skills
RF, Systems Engineering, Antennas, Matlab, System Architecture, Defense, Electrical Engineering, Electromagnetics, Integration, Microwave, RF Engineering, Mathematica, Testing, Wireless, Program Management, Telecommunications, Optimization, Stochastic Processes, Mathematical Programming, Management, Radar, Project Management, Computational..., Mathematical Analysis, Microwaves, Htz Warfare, RF testing, Hardware integration, Computer Hardware..., Computer Hardware..., Computer Hardware..., digital logic and..., Visual Basic, Python, C/C++, SQL
Education
University of Illinois at Urbana-Champaign 1999 — 2003
Master of Science, Electrical Engineering, 3.4
University of Illinois at Urbana-Champaign 1999 — 2003
Master of Business Administration (M.B.A.), Business Administration, 3.4
Virginia Polytechnic Institute and State University 1994 — 1997
Bachelor of Science, Electrical Engineering, 3.7
Shi Xi middle school.
Nilesh Modi Nilesh Modi's IBM Microelectronics Experience June 2005 - September 2005
Job Senior R & D Software Engineer in Computational Lithography Group at Intel Corporation
Industry Semiconductors
Experience
Intel Corporation March 2011 - Present
VLSI Design and Test Group, University of California-Santa Barbara 2004 - 2010
IBM T J Watson Research Center June 2008 - December 2008
IBM Microelectronics Division June 2007 - September 2007
Cadence Design Systems July 2006 - September 2006
IBM Microelectronics June 2005 - September 2005
Algorithms and Genetics Group, UPC January 2003 - June 2004
GAVINA Research Group, UPC, Barcelona September 2002 - June 2004
Computer Architecture Department, UPC, Barcelona September 2002 - June 2003
Tata Institute of Fundamental Research (TIFR) May 2002 - July 2002
Skills
VLSI, EDA, Algorithms, Data Structures, Computer Engineering, Routing, RTL design, Physical Design, C++, Computational Geometry, Logic Synthesis, Optimization, Optimizations, Distributed Systems, ModelSim, IC, Integrated Circuit..., Verilog, Python, Embedded Systems, Computer Science, Static Timing Analysis, High Performance..., Parallel Programming, Machine Learning, Cadence, SPICE, Algorithm Design, SystemVerilog, CMOS, Simulations, Hardware Architecture, Software Engineering, Compilers, Cadence Virtuoso, Microprocessors, Debugging, Computer Architecture, Parallel Computing, Perl, Java, Matlab, VHDL, FPGA, ASIC, Software Design, TCL, C, Circuit Design
Education
University of California, Santa Barbara 2004 — 2010
Ph.D, Electrical and Computer Engineering
University of California, Santa Barbara 2004 — 2010
M.S., Computer Engineering
Universitat Politècnica de Catalunya 2002 — 2004
M.S, Computer Science
Nirma Institute of Technology, Gujarat University 1998 — 2002
B.Tech., Information Technology (Gold Medalist)
Intel Corporation March 2011 - Present
VLSI Design and Test Group, University of California-Santa Barbara 2004 - 2010
IBM T J Watson Research Center June 2008 - December 2008
IBM Microelectronics Division June 2007 - September 2007
Cadence Design Systems July 2006 - September 2006
IBM Microelectronics June 2005 - September 2005
Algorithms and Genetics Group, UPC January 2003 - June 2004
GAVINA Research Group, UPC, Barcelona September 2002 - June 2004
Computer Architecture Department, UPC, Barcelona September 2002 - June 2003
Tata Institute of Fundamental Research (TIFR) May 2002 - July 2002
Skills
VLSI, EDA, Algorithms, Data Structures, Computer Engineering, Routing, RTL design, Physical Design, C++, Computational Geometry, Logic Synthesis, Optimization, Optimizations, Distributed Systems, ModelSim, IC, Integrated Circuit..., Verilog, Python, Embedded Systems, Computer Science, Static Timing Analysis, High Performance..., Parallel Programming, Machine Learning, Cadence, SPICE, Algorithm Design, SystemVerilog, CMOS, Simulations, Hardware Architecture, Software Engineering, Compilers, Cadence Virtuoso, Microprocessors, Debugging, Computer Architecture, Parallel Computing, Perl, Java, Matlab, VHDL, FPGA, ASIC, Software Design, TCL, C, Circuit Design
Education
University of California, Santa Barbara 2004 — 2010
Ph.D, Electrical and Computer Engineering
University of California, Santa Barbara 2004 — 2010
M.S., Computer Engineering
Universitat Politècnica de Catalunya 2002 — 2004
M.S, Computer Science
Nirma Institute of Technology, Gujarat University 1998 — 2002
B.Tech., Information Technology (Gold Medalist)
Laurance Quach Laurance Quach's IBM Microelectronics Experience July 1998 - October 1999
Job Senior Manager, Programs at NETGEAR
Industry Wireless
Experience
NETGEAR January 2007 - Present
Sierra Wireless, Inc. May 2004 - January 2007
Flextronics October 1999 - May 2004
IBM Microelectronics July 1998 - October 1999
Uniden October 1997 - July 1998
Denso International America, Inc. May 1995 - October 1997
Skills
Cross-functional Team..., WiMAX, CDMA, Wireless, Telecommunications, LTE, WiFi, 3G, Wireless Networking, Cellular, Program Management, Software Development, Mobile, Product Development, Hardware, Requirements Analysis, Embedded Systems, Engineering, C++, SDLC, Programming, Embedded Software, Software Engineering, C, EVDO, Planning, Strategic Planning, Mobile Devices, Cellular Communications, Mobile Applications, Firmware, Product Management, Testing
Education
University of California, San Diego 1992 — 1996
Bachelor of Science
NETGEAR January 2007 - Present
Sierra Wireless, Inc. May 2004 - January 2007
Flextronics October 1999 - May 2004
IBM Microelectronics July 1998 - October 1999
Uniden October 1997 - July 1998
Denso International America, Inc. May 1995 - October 1997
Skills
Cross-functional Team..., WiMAX, CDMA, Wireless, Telecommunications, LTE, WiFi, 3G, Wireless Networking, Cellular, Program Management, Software Development, Mobile, Product Development, Hardware, Requirements Analysis, Embedded Systems, Engineering, C++, SDLC, Programming, Embedded Software, Software Engineering, C, EVDO, Planning, Strategic Planning, Mobile Devices, Cellular Communications, Mobile Applications, Firmware, Product Management, Testing
Education
University of California, San Diego 1992 — 1996
Bachelor of Science
Timothy Brug Timothy Brug's IBM Microelectronics Experience March 1998 - August 1999
Job Senior Account Manager at Mentor Graphics
Industry Semiconductors
Experience
Mentor Graphics July 2011 - Present
Intrinsix January 2009 - July 2011
Mentor Graphics January 2003 - January 2009
Mentor Graphics January 2001 - December 2002
Mentor Graphics August 1999 - December 2001
IBM Microelectronics March 1998 - August 1999
LSI Logic Inc. January 1997 - March 1998
Mentor Graphics August 1992 - December 1996
Allied Signal Microelectronics June 1990 - July 1992
Microprose January 1988 - June 1990
Skills
Sales Process, Sales Management, Start-ups, New Business Development, Solution Selling, Business Development, Strategy, Marketing Strategy, Product Development, Enterprise Software, Electronics, Analysis, Product Marketing
Education
University of Maryland - Robert H. Smith School of Business 1995 — 1999
MBA, Marketing & Entrepreneurship
The Johns Hopkins University 1984 — 1987
MSEE, Digital Signal Processing, Computer Architectures & IC design
University of Detroit Mercy 1979 — 1984
BSEE, Electrical Engineering
Mentor Graphics July 2011 - Present
Intrinsix January 2009 - July 2011
Mentor Graphics January 2003 - January 2009
Mentor Graphics January 2001 - December 2002
Mentor Graphics August 1999 - December 2001
IBM Microelectronics March 1998 - August 1999
LSI Logic Inc. January 1997 - March 1998
Mentor Graphics August 1992 - December 1996
Allied Signal Microelectronics June 1990 - July 1992
Microprose January 1988 - June 1990
Skills
Sales Process, Sales Management, Start-ups, New Business Development, Solution Selling, Business Development, Strategy, Marketing Strategy, Product Development, Enterprise Software, Electronics, Analysis, Product Marketing
Education
University of Maryland - Robert H. Smith School of Business 1995 — 1999
MBA, Marketing & Entrepreneurship
The Johns Hopkins University 1984 — 1987
MSEE, Digital Signal Processing, Computer Architectures & IC design
University of Detroit Mercy 1979 — 1984
BSEE, Electrical Engineering
Roberto Sicconi Roberto Sicconi's IBM Microelectronics Experience April 1998 - May 2000
Job CTO and CoFounder at TeleLingo, Senior Advisor at Infermedica
Industry Information Technology and Services
Experience
TeleLingo January 2014 - Present
Infermedica November 2013 - Present
IBM Research May 2009 - July 2013
IBM Research May 2000 - May 2009
IBM Microelectronics April 1998 - May 2000
IBM Italy December 1985 - March 1998
Skills
Cloud Computing, Speech Recognition, Distributed Systems, Natural Language..., Human Computer..., Wireless, Data Mining, Mobile Applications, Image Processing, Android, Speech Processing, Embedded Systems, Mobile Devices, Automotive, Business Strategy, New Business Development, Multimedia, Computer Security, Strategic Thinking, Start-ups, Question Answering, Automotive Electronics, Navigation Systems, Technology Trends, C++, Microprocessors, Italian, Contact Centers, SoC, Customer Engagement, Machine Translation, NLP, Voice User Interface..., German, Telematics, Speech Synthesis, Data Privacy, Smartphones, Voice & Data Convergence, Computer Graphics, Voice Solutions, Clinical Decision..., Technical Leadership, Information Retrieval, Artificial Intelligence, Computer Science, Mobile Technology, Entrepreneurship, Integration, Management
Education
Politecnico di Milano 1976 — 1985
Dr. Ing., Electronics Engineering
Liceo Scientifico Alessandro Volta
Maturita' Scientifica
TeleLingo January 2014 - Present
Infermedica November 2013 - Present
IBM Research May 2009 - July 2013
IBM Research May 2000 - May 2009
IBM Microelectronics April 1998 - May 2000
IBM Italy December 1985 - March 1998
Skills
Cloud Computing, Speech Recognition, Distributed Systems, Natural Language..., Human Computer..., Wireless, Data Mining, Mobile Applications, Image Processing, Android, Speech Processing, Embedded Systems, Mobile Devices, Automotive, Business Strategy, New Business Development, Multimedia, Computer Security, Strategic Thinking, Start-ups, Question Answering, Automotive Electronics, Navigation Systems, Technology Trends, C++, Microprocessors, Italian, Contact Centers, SoC, Customer Engagement, Machine Translation, NLP, Voice User Interface..., German, Telematics, Speech Synthesis, Data Privacy, Smartphones, Voice & Data Convergence, Computer Graphics, Voice Solutions, Clinical Decision..., Technical Leadership, Information Retrieval, Artificial Intelligence, Computer Science, Mobile Technology, Entrepreneurship, Integration, Management
Education
Politecnico di Milano 1976 — 1985
Dr. Ing., Electronics Engineering
Liceo Scientifico Alessandro Volta
Maturita' Scientifica
Richard Le Sesne's IBM Microelectronics Experience March 2001 - June 2003
Job CoFounder Le Sesne, Inc.
Industry Research
Experience
LeSesne, Inc. January 2013 - Present
ActSense Corporation June 2008 - December 2012
IBM Global Technology Services January 2007 - June 2008
IBM Global Technology Services June 2006 - January 2007
IBM Global Technology Services March 2005 - June 2006
IBM Global Services June 2003 - March 2005
IBM Microelectronics March 2001 - June 2003
IBM Global Services January 1997 - March 2001
IBM Networking June 1995 - December 1996
IBM June 1993 - June 1995
Skills
Custom Business..., Android Application..., Java software..., Nuclear Engineering, Nuclear Radiation..., Programmable Sensors, Protocol Conversion, Smart Phone Security, Arduino, Wiring - Arduino..., Processing - Arduino IDE, BeagleBoard, BeagleBone, Parallax, COTS Software..., Embedded Systems..., 911 Systems..., P25 Trunking Radio, MPT1327 Trunking Radio, RF, RFID, AProtocol (Automation..., XBee, GPS, Geiger Counters, COTS ISR Design, Disruptive Business..., AS400, RPG, ADA, Linux development, Business Strategy, Security, Software Development, Embedded Systems, RFID+, IBM iSeries, Android Development, Sensor Fusion, Leadership, Linux, Cloud Computing, Telecommunications, Strategy, Storage, IT Strategy, Product Development, Enterprise Software, Professional Services, Data Center
Education
Purdue University 1970 — 1975
BSE, Interdisciplinary and Nuclear Engineering
Saint Johns Preparatory 1956 — 1970
High School
LeSesne, Inc. January 2013 - Present
ActSense Corporation June 2008 - December 2012
IBM Global Technology Services January 2007 - June 2008
IBM Global Technology Services June 2006 - January 2007
IBM Global Technology Services March 2005 - June 2006
IBM Global Services June 2003 - March 2005
IBM Microelectronics March 2001 - June 2003
IBM Global Services January 1997 - March 2001
IBM Networking June 1995 - December 1996
IBM June 1993 - June 1995
Skills
Custom Business..., Android Application..., Java software..., Nuclear Engineering, Nuclear Radiation..., Programmable Sensors, Protocol Conversion, Smart Phone Security, Arduino, Wiring - Arduino..., Processing - Arduino IDE, BeagleBoard, BeagleBone, Parallax, COTS Software..., Embedded Systems..., 911 Systems..., P25 Trunking Radio, MPT1327 Trunking Radio, RF, RFID, AProtocol (Automation..., XBee, GPS, Geiger Counters, COTS ISR Design, Disruptive Business..., AS400, RPG, ADA, Linux development, Business Strategy, Security, Software Development, Embedded Systems, RFID+, IBM iSeries, Android Development, Sensor Fusion, Leadership, Linux, Cloud Computing, Telecommunications, Strategy, Storage, IT Strategy, Product Development, Enterprise Software, Professional Services, Data Center
Education
Purdue University 1970 — 1975
BSE, Interdisciplinary and Nuclear Engineering
Saint Johns Preparatory 1956 — 1970
High School
Jim Tackett's IBM Microelectronics Experience May 1995 - December 1997
Job Physical Design Engineer at Intel Corporation
Industry Semiconductors
Experience
Intel Corporation July 2014 - Present
Microsemi July 2013 - July 2014
Qualcomm January 2013 - July 2013
AMD December 2011 - November 2012
Broadcom November 2008 - October 2011
AMD October 2006 - October 2008
ATI June 2002 - September 2006
NxtWave Communications September 2001 - May 2002
3Com December 1997 - September 2001
IBM Microelectronics May 1995 - December 1997
Skills
Physical Design, Perl, EDA, GNU Make, SoC, Floorplanning, Timing Closure, Static Timing Analysis, Clock Tree Synthesis, Physical Verification, Primetime, IC, LVS
Education
The Johns Hopkins University 1990 — 1993
MS, Electrical Engineering
Mississippi State University 1984 — 1987
BS, Electrical Engineering
Intel Corporation July 2014 - Present
Microsemi July 2013 - July 2014
Qualcomm January 2013 - July 2013
AMD December 2011 - November 2012
Broadcom November 2008 - October 2011
AMD October 2006 - October 2008
ATI June 2002 - September 2006
NxtWave Communications September 2001 - May 2002
3Com December 1997 - September 2001
IBM Microelectronics May 1995 - December 1997
Skills
Physical Design, Perl, EDA, GNU Make, SoC, Floorplanning, Timing Closure, Static Timing Analysis, Clock Tree Synthesis, Physical Verification, Primetime, IC, LVS
Education
The Johns Hopkins University 1990 — 1993
MS, Electrical Engineering
Mississippi State University 1984 — 1987
BS, Electrical Engineering
Bart Bergman's IBM Microelectronics Experience 2005 - 2006
Job PD Engineer at CTG/IBM
Industry Semiconductors
Experience
CTG/IBM March 2015 - Present
G&B Environmental, Inc. October 2013 - Present
Randstad/Seagate July 2014 - November 2014
Silicon Space Technology April 2012 - June 2013
Exar Corporation January 2010 - January 2012
Arrowsmith Research March 2002 - January 2010
IBM Microelectronics 2005 - 2006
Virtual Silicon June 2001 - June 2002
Digital Mediacom 1998 - 2001
VeriBest 1995 - 1998
Skills
Management, Marketing, ASIC, Semiconductors, EDA, IC, Static Timing Analysis, VHDL, Simulations, Semiconductor Industry, SoC, TCL, CMOS, DFT, Mixed Signal, VLSI, FPGA, SERDES, Integrated Circuit..., Verilog, Microprocessors, Physical Design, ARM, Embedded Systems, Silicon, Hardware Architecture, Processors, Logic Synthesis, Testing, Timing Closure, Debugging
Education
The University of North Dakota 1980 — 1983
BSEE
University of St. Thomas 1978 — 1980
Grand Rapids High School
CTG/IBM March 2015 - Present
G&B Environmental, Inc. October 2013 - Present
Randstad/Seagate July 2014 - November 2014
Silicon Space Technology April 2012 - June 2013
Exar Corporation January 2010 - January 2012
Arrowsmith Research March 2002 - January 2010
IBM Microelectronics 2005 - 2006
Virtual Silicon June 2001 - June 2002
Digital Mediacom 1998 - 2001
VeriBest 1995 - 1998
Skills
Management, Marketing, ASIC, Semiconductors, EDA, IC, Static Timing Analysis, VHDL, Simulations, Semiconductor Industry, SoC, TCL, CMOS, DFT, Mixed Signal, VLSI, FPGA, SERDES, Integrated Circuit..., Verilog, Microprocessors, Physical Design, ARM, Embedded Systems, Silicon, Hardware Architecture, Processors, Logic Synthesis, Testing, Timing Closure, Debugging
Education
The University of North Dakota 1980 — 1983
BSEE
University of St. Thomas 1978 — 1980
Grand Rapids High School
Ed Merrill's IBM Microelectronics Experience February 2001 - Present
Job Retired Enjoying Life
Industry Semiconductors
Experience
IBM Microelectronics February 2001 - Present
IBM February 1997 - February 2001
IBM February 1993 - February 1997
IBM February 1988 - February 1993
IBM April 1979 - February 1988
Johnson Filaments Inc. (Now Asten Johnson) February 1976 - March 1979
Skills
Management, Manufacturing, Cross-functional Team..., Business Process..., Process Improvement, Project Management, Employee Management, Business Process, Project Planning, Business Planning, Contract Management, Program Management, Process Engineering, Business Controls and..., Business Process..., Contract Royalty..., Managerial Finance, Patent Sales Management, Human Resoures Education, Contract Exception..., Capital Process..., Development Of Employees, Integration
Education
University of Phoenix 2005 — 2008
Business Management, Management
Rochester Institute of Technology 1991 — 1993
Bachelor of Science (BS), Business Administration, Management and Operations
IBM Microelectronics February 2001 - Present
IBM February 1997 - February 2001
IBM February 1993 - February 1997
IBM February 1988 - February 1993
IBM April 1979 - February 1988
Johnson Filaments Inc. (Now Asten Johnson) February 1976 - March 1979
Skills
Management, Manufacturing, Cross-functional Team..., Business Process..., Process Improvement, Project Management, Employee Management, Business Process, Project Planning, Business Planning, Contract Management, Program Management, Process Engineering, Business Controls and..., Business Process..., Contract Royalty..., Managerial Finance, Patent Sales Management, Human Resoures Education, Contract Exception..., Capital Process..., Development Of Employees, Integration
Education
University of Phoenix 2005 — 2008
Business Management, Management
Rochester Institute of Technology 1991 — 1993
Bachelor of Science (BS), Business Administration, Management and Operations
Sara Mellinger's IBM Microelectronics Experience September 2011 - June 2014
Job Marketing Professional at IBM
Industry Marketing and Advertising
Experience
IBM Sales & Distribution June 2014 - Present
IBM Microelectronics September 2011 - June 2014
IBM Microelectronics February 2008 - August 2009
IBM Microelectronics June 2006 - February 2008
IBM Microelectronics June 2005 - June 2006
IBM Microelectronics August 2000 - June 2005
Skills
Product Marketing, Go-to-market Strategy, Strategy, Cross-functional Team..., Project Management, Marketing, Marketing Communications, Analysis, Semiconductors, Semiconductor Industry, Integrated Marketing, Competitive Analysis, Mobile Devices, Wireless, Product Launch, New Business Development, Sales, Manufacturing, Business Strategy, Written & Oral...
Education
University of Rochester 1996 — 2000
B.S., Chemical Engineering
University of Vermont 2004 — 2006
MBA, Marketing concentration
IBM Sales & Distribution June 2014 - Present
IBM Microelectronics September 2011 - June 2014
IBM Microelectronics February 2008 - August 2009
IBM Microelectronics June 2006 - February 2008
IBM Microelectronics June 2005 - June 2006
IBM Microelectronics August 2000 - June 2005
Skills
Product Marketing, Go-to-market Strategy, Strategy, Cross-functional Team..., Project Management, Marketing, Marketing Communications, Analysis, Semiconductors, Semiconductor Industry, Integrated Marketing, Competitive Analysis, Mobile Devices, Wireless, Product Launch, New Business Development, Sales, Manufacturing, Business Strategy, Written & Oral...
Education
University of Rochester 1996 — 2000
B.S., Chemical Engineering
University of Vermont 2004 — 2006
MBA, Marketing concentration
Joseph Lexa's IBM Microelectronics Experience 1977 - 2003
Job Project Manager at IBM Systems and Technology Group
Industry Computer Hardware
Experience
Freelance January 2005 - Present
IBM January 2008 - September 2009
IBM Corp. Microelectronics, Networks, and Systems November 1977 - February 2003
IBM 1977 - 2003
IBM - Microelectronics 1977 - 2003
Skills
Competitive Analysis, Network design, Microelectronics, Vendor Management, Product Management, Network Design, Project Management, Program Management, Management
Education
Syracuse University 1970 — 1972
MSEE, Computer and Electronic Engineering
Rochester Institute of Technology 1967 — 1970
BSEE, Electrical Engineering
Freelance January 2005 - Present
IBM January 2008 - September 2009
IBM Corp. Microelectronics, Networks, and Systems November 1977 - February 2003
IBM 1977 - 2003
IBM - Microelectronics 1977 - 2003
Skills
Competitive Analysis, Network design, Microelectronics, Vendor Management, Product Management, Network Design, Project Management, Program Management, Management
Education
Syracuse University 1970 — 1972
MSEE, Computer and Electronic Engineering
Rochester Institute of Technology 1967 — 1970
BSEE, Electrical Engineering
Bill Vaillancourt's IBM Microelectronics Experience 1998 - 2002
Job VP and General Manager at Skyworks Solutions
Industry Wireless
Experience
Skyworks Solutions, Inc. June 2011 - Present
SiGe Semiconductor October 2002 - June 2011
IBM Microelectronics 1998 - 2002
Raytheon 1983 - 1998
Skills
Semiconductors, Product Development, RF, IC, Engineering Management, Electronics, Wireless, Team Building, Program Management, Microwave, Consumer Electronics, Product Management, Analog, Product Engineering, Mixed Signal, SoC
Education
University of Massachusetts Lowell 1979 — 1983
MSEE, Electrical Engineering/Microwave
NAHS
Skyworks Solutions, Inc. June 2011 - Present
SiGe Semiconductor October 2002 - June 2011
IBM Microelectronics 1998 - 2002
Raytheon 1983 - 1998
Skills
Semiconductors, Product Development, RF, IC, Engineering Management, Electronics, Wireless, Team Building, Program Management, Microwave, Consumer Electronics, Product Management, Analog, Product Engineering, Mixed Signal, SoC
Education
University of Massachusetts Lowell 1979 — 1983
MSEE, Electrical Engineering/Microwave
NAHS
John Affronti's IBM Microelectronics Experience 1987 - Present
Job Manager at IBM / Manufacturing
Industry Semiconductors
Experience
IBM, Systems and Technology Group, Advanced Semiconductor Solutions 1998 - Present
IBM / Manufacturing May 1987 - Present
IBM 1987 - Present
IBM Microelectronics 1987 - Present
IBM East Fishkill NY 1982 - Present
Skills
Lean Manufacturing, Process Engineering, Six Sigma, Semiconductors, Cross-functional Team..., Process Improvement, Program Management, Supply Chain Management, Manufacturing, Project Management, PMP, Integration, Continuous Improvement, Engineering Management, Team Leadership, Supply Chain, Root Cause Analysis, Strategy, Supply Management, Management, Quality Management, Change Management, Business Process..., Leadership, Troubleshooting, Operations Management, Testing, Outsourcing, Quality Assurance, Business Process, MS Project, Process Simulation, ERP, Operational Excellence, Design of Experiments, Vendor Management, Product Management, Product Development, Project Portfolio..., Failure Analysis, SAP, Electronics, Project Planning
Education
University of Maryland College Park 1978 — 1980
IBM, Systems and Technology Group, Advanced Semiconductor Solutions 1998 - Present
IBM / Manufacturing May 1987 - Present
IBM 1987 - Present
IBM Microelectronics 1987 - Present
IBM East Fishkill NY 1982 - Present
Skills
Lean Manufacturing, Process Engineering, Six Sigma, Semiconductors, Cross-functional Team..., Process Improvement, Program Management, Supply Chain Management, Manufacturing, Project Management, PMP, Integration, Continuous Improvement, Engineering Management, Team Leadership, Supply Chain, Root Cause Analysis, Strategy, Supply Management, Management, Quality Management, Change Management, Business Process..., Leadership, Troubleshooting, Operations Management, Testing, Outsourcing, Quality Assurance, Business Process, MS Project, Process Simulation, ERP, Operational Excellence, Design of Experiments, Vendor Management, Product Management, Product Development, Project Portfolio..., Failure Analysis, SAP, Electronics, Project Planning
Education
University of Maryland College Park 1978 — 1980
Tom Fleischman's IBM Microelectronics Experience 2007 - Present
Job Senior Engineer at IBM
Industry Computer Hardware
Experience
IBM Microelectronics 2007 - Present
IBM Microelectronics Division 2003 - Present
IBM June 1982 - Present
IBM Corporate Licensing 2003 - 2008
Education
New York University - Polytechnic School of Engineering 1978 — 1982
W.T. Clarke 1974 — 1978
IBM Microelectronics 2007 - Present
IBM Microelectronics Division 2003 - Present
IBM June 1982 - Present
IBM Corporate Licensing 2003 - 2008
Education
New York University - Polytechnic School of Engineering 1978 — 1982
W.T. Clarke 1974 — 1978
Bernhard Liegl's IBM Microelectronics Experience February 2003 - December 2005
Job Senior Manufacturing Consultant
Industry Semiconductors
Experience
IBM June 2014 - Present
IBM December 2011 - Present
IBM January 2006 - December 2010
IBM Microelectronics February 2003 - December 2005
Infineon Technologies June 1997 - December 2002
Infineon Technologies January 1998 - March 1999
Skills
structered problem..., Process Simulation, Semiconductors, Six Sigma, CMOS, SPC, FMEA, Continuous Improvement, Quality Management, PMP, Thin Films, Lean Manufacturing, Process Integration, Materials Science, Engineering Management, Semiconductor Industry, Characterization, Design of Experiments, Technical Leadership, DMAIC, Failure Analysis, Cross-functional Team..., Simulations, R&D, Process Engineering, Manufacturing, Program Management, Business Process..., Integration, Product Development, Root Cause Analysis, Process Improvement, Engineering, Testing, Electronics, Manufacturing..., Automation, Operational Excellence, MS Project, Value Stream Mapping, Quality Assurance, Reliability, IC, Process Optimization, Materials, EDA, Software Development, Embedded Systems, Project Portfolio..., Business Process
Education
Universität Regensburg 1991 — 1996
MS Physics, Magnetic Resonance Spectroscopy
Universität Regensburg 1989 — 1990
BA Education, Mathematics and Physics
IBM June 2014 - Present
IBM December 2011 - Present
IBM January 2006 - December 2010
IBM Microelectronics February 2003 - December 2005
Infineon Technologies June 1997 - December 2002
Infineon Technologies January 1998 - March 1999
Skills
structered problem..., Process Simulation, Semiconductors, Six Sigma, CMOS, SPC, FMEA, Continuous Improvement, Quality Management, PMP, Thin Films, Lean Manufacturing, Process Integration, Materials Science, Engineering Management, Semiconductor Industry, Characterization, Design of Experiments, Technical Leadership, DMAIC, Failure Analysis, Cross-functional Team..., Simulations, R&D, Process Engineering, Manufacturing, Program Management, Business Process..., Integration, Product Development, Root Cause Analysis, Process Improvement, Engineering, Testing, Electronics, Manufacturing..., Automation, Operational Excellence, MS Project, Value Stream Mapping, Quality Assurance, Reliability, IC, Process Optimization, Materials, EDA, Software Development, Embedded Systems, Project Portfolio..., Business Process
Education
Universität Regensburg 1991 — 1996
MS Physics, Magnetic Resonance Spectroscopy
Universität Regensburg 1989 — 1990
BA Education, Mathematics and Physics
Merlin Green's IBM Microelectronics Experience 1997 - 1999
Job Analog IC engineer at Peregrine Semiconductor
Industry Design
Experience
Peregrine Semiconductor January 2013 - Present
MIT Lincoln Lab September 2005 - November 2012
Mobilian / Intel November 2002 - April 2005
Innocomm / National Semiconductor June 1999 - April 2002
National Semiconductor 1999 - 2001
National Semiconductor (innoComm Wireless) 1999 - 2001
Commquest / IBM July 1997 - May 1999
CommQuest 1997 - 1999
IBM Microelectronics 1997 - 1999
CommQuest Technologies 1997 - 1999
Skills
Circuit Design, Analog, Mixed Signal, Analog Circuit Design, IC, CMOS
Education
University of Minnesota-Twin Cities 1988 — 2003
Peregrine Semiconductor January 2013 - Present
MIT Lincoln Lab September 2005 - November 2012
Mobilian / Intel November 2002 - April 2005
Innocomm / National Semiconductor June 1999 - April 2002
National Semiconductor 1999 - 2001
National Semiconductor (innoComm Wireless) 1999 - 2001
Commquest / IBM July 1997 - May 1999
CommQuest 1997 - 1999
IBM Microelectronics 1997 - 1999
CommQuest Technologies 1997 - 1999
Skills
Circuit Design, Analog, Mixed Signal, Analog Circuit Design, IC, CMOS
Education
University of Minnesota-Twin Cities 1988 — 2003
Brian Laughlin's IBM Microelectronics Experience 2000 - 2002
Job Technical and R&D supervisor for MCM Advanced Materials at DuPont
Industry Research
Experience
DuPont April 2014 - Present
DuPont 2012 - Present
DuPont Electronics December 2006 - 2012
North Carolina State University October 2002 - November 2006
IBM Microelectronics 2000 - 2002
Intel 1997 - 1997
Skills
Materials Science, Thin Films, Characterization, Powder X-ray Diffraction, Chemistry, R&D, Coatings, Spectroscopy, Scanning Electron..., Design of Experiments, Solar Cells, Electron Microscopy, Physics
Education
North Carolina State University 2002 — 2006
Doctor of Philosophy (Ph.D.), Materials Science and Engineering
North Carolina State University 2002 — 2004
Master of Science (MS), Materials Science and Engineering
North Carolina State University 1995 — 2000
Bachelor of Science (B.S.), Materials Science and Engineering
DuPont April 2014 - Present
DuPont 2012 - Present
DuPont Electronics December 2006 - 2012
North Carolina State University October 2002 - November 2006
IBM Microelectronics 2000 - 2002
Intel 1997 - 1997
Skills
Materials Science, Thin Films, Characterization, Powder X-ray Diffraction, Chemistry, R&D, Coatings, Spectroscopy, Scanning Electron..., Design of Experiments, Solar Cells, Electron Microscopy, Physics
Education
North Carolina State University 2002 — 2006
Doctor of Philosophy (Ph.D.), Materials Science and Engineering
North Carolina State University 2002 — 2004
Master of Science (MS), Materials Science and Engineering
North Carolina State University 1995 — 2000
Bachelor of Science (B.S.), Materials Science and Engineering
Karen H Brown's IBM Microelectronics Experience 1978 - 1998
Job Experienced executive consultant, corporate strategic planning..
Industry Semiconductors
Experience
Idea Industries llc July 2003 - Present
National Institute of Standards and Technology January 1999 - July 2003
SEMATECH 1994 - 1998
IBM 1978 - 1998
IBM MicroElectronics 1978 - 1998
Skills
Program Management, IC, R&D, Characterization, Failure Analysis, Process Engineering, Manufacturing, Cross-functional Team..., EDA, Design of Experiments, Materials Science, Electronics, Semiconductors, Start-ups, Nanotechnology, Lithography
Education
University of Rochester 1967 — 1972
PhD, Chemistry
University of Rochester 1957 — 1961
Bachelor of Arts (B.A.), History and Chemistry
Idea Industries llc July 2003 - Present
National Institute of Standards and Technology January 1999 - July 2003
SEMATECH 1994 - 1998
IBM 1978 - 1998
IBM MicroElectronics 1978 - 1998
Skills
Program Management, IC, R&D, Characterization, Failure Analysis, Process Engineering, Manufacturing, Cross-functional Team..., EDA, Design of Experiments, Materials Science, Electronics, Semiconductors, Start-ups, Nanotechnology, Lithography
Education
University of Rochester 1967 — 1972
PhD, Chemistry
University of Rochester 1957 — 1961
Bachelor of Arts (B.A.), History and Chemistry
Vishwanath Patil's IBM Microelectronics Experience April 2001 - July 2014
Job Analog Mixed Signal Design Engineer at Encore Semi
Industry Semiconductors
Experience
ENCORE SEMI December 2014 - Present
IBM Microelectronics April 2001 - July 2014
Skills
Cadence Virtuoso, Debugging, ASIC, VLSI, SPICE, Analog Circuit Design, Analog, Simulations, Cadence, Static Timing Analysis, PLL, Functional Verification, Spectre, Spectrum Analyzer, Microelectronics, Labview, Silicon, Characterization, Pspice, VCO, Oscilloscope, Timing, CMOS, Circuit Design
Education
Tuskegee University 1999 — 2001
MS, Electrical Engineer
Shivaji University 1993 — 1997
BE, Electrical Engineer
IBM Microelectronics
PMO, Project Management
North Carolina Real Estate Commission
Real Estate Broker
Project Management Academy
PMP, Certified course
ENCORE SEMI December 2014 - Present
IBM Microelectronics April 2001 - July 2014
Skills
Cadence Virtuoso, Debugging, ASIC, VLSI, SPICE, Analog Circuit Design, Analog, Simulations, Cadence, Static Timing Analysis, PLL, Functional Verification, Spectre, Spectrum Analyzer, Microelectronics, Labview, Silicon, Characterization, Pspice, VCO, Oscilloscope, Timing, CMOS, Circuit Design
Education
Tuskegee University 1999 — 2001
MS, Electrical Engineer
Shivaji University 1993 — 1997
BE, Electrical Engineer
IBM Microelectronics
PMO, Project Management
North Carolina Real Estate Commission
Real Estate Broker
Project Management Academy
PMP, Certified course
Michael Nicewicz's IBM Microelectronics Experience 1984 - Present
Job Engineer at IBM
Industry Electrical/Electronic Manufacturing
Experience
IBM 1984 - Present
IBM Microelectronics 1984 - Present
Sperry Univac 1983 - 1983
Skills
CMOS, Cadence Virtuoso, EDA, Cadence, Physical Design, TCL, Simulations, Semiconductors, ASIC, Microprocessors, VLSI, Perl, Verilog, Debugging, Analog, IC, Circuit Design, Static Timing Analysis, SoC
Education
Syracuse University
MS, EE
New York University - Polytechnic School of Engineering 1980 — 1984
BS, EE
IBM 1984 - Present
IBM Microelectronics 1984 - Present
Sperry Univac 1983 - 1983
Skills
CMOS, Cadence Virtuoso, EDA, Cadence, Physical Design, TCL, Simulations, Semiconductors, ASIC, Microprocessors, VLSI, Perl, Verilog, Debugging, Analog, IC, Circuit Design, Static Timing Analysis, SoC
Education
Syracuse University
MS, EE
New York University - Polytechnic School of Engineering 1980 — 1984
BS, EE
Jason Benz's IBM Microelectronics Experience June 2006 - June 2015
Job Failure Analysis Engineer for IBM Microelectronics: World Wide Analytical Services Lab
Industry Semiconductors
Experience
Global Foundries July 2015 - Present
IBM Microelectronics June 2006 - June 2015
IBM Microelectronics 1998 - 2006
Xerox Corporation 1995 - 1996
Skills
AFM, FIB, Failure Analysis, Testing, Semiconductors, ASIC, TEM, Thin Films, Characterization, CMOS, Nanotechnology, Materials Science, IC, Physics, Reliability, Engineering, Simulations, Design of Experiments, SPC, Labview, Cadence
Education
University of Vermont
MS, Materials Science
Rochester Institute of Technology
BS, Microelectronic Engineering
Global Foundries July 2015 - Present
IBM Microelectronics June 2006 - June 2015
IBM Microelectronics 1998 - 2006
Xerox Corporation 1995 - 1996
Skills
AFM, FIB, Failure Analysis, Testing, Semiconductors, ASIC, TEM, Thin Films, Characterization, CMOS, Nanotechnology, Materials Science, IC, Physics, Reliability, Engineering, Simulations, Design of Experiments, SPC, Labview, Cadence
Education
University of Vermont
MS, Materials Science
Rochester Institute of Technology
BS, Microelectronic Engineering
Andy Laidler's IBM Microelectronics Experience 1990 - 1997
Job Test Development Engineering Manager at ON Semiconductor
Industry Semiconductors
Experience
ON Semiconductor 1997 - Present
IBM Microelectronics 1990 - 1997
IBM Poughkeepsie 1986 - 1990
Skills
Mixed Signal, Analog, Engineering Management, Test Automation, SPC, Manufacturing, Microprocessors, CMOS, Test Engineering, Product Engineering, Testing, Test Equipment, Electrical Engineering, Semiconductor Industry, Electronics, Semiconductors, PCB design, VLSI, Power Management, ASIC
Education
University of Rhode Island 2004 — 2009
Master of Science, Electrical Engineering
New York University - Polytechnic School of Engineering 1985 — 1992
Bachelor of Science, Electrical Engineering
ON Semiconductor 1997 - Present
IBM Microelectronics 1990 - 1997
IBM Poughkeepsie 1986 - 1990
Skills
Mixed Signal, Analog, Engineering Management, Test Automation, SPC, Manufacturing, Microprocessors, CMOS, Test Engineering, Product Engineering, Testing, Test Equipment, Electrical Engineering, Semiconductor Industry, Electronics, Semiconductors, PCB design, VLSI, Power Management, ASIC
Education
University of Rhode Island 2004 — 2009
Master of Science, Electrical Engineering
New York University - Polytechnic School of Engineering 1985 — 1992
Bachelor of Science, Electrical Engineering
Dennis Foster's IBM Microelectronics Experience 2008 - June 2015
Job TEST CHIPS at GLOBALFOUNDRIES
Industry Semiconductors
Experience
GLOBALFOUNDRIES July 2015 - Present
IBM March 2008 - June 2015
IBM Microelectronics 2008 - June 2015
IBM Microelectronics Division, Fishkill NY, USA 1988 - June 2015
IBM July 2000 - February 2008
IBM May 1993 - June 2000
Skills
Perl, CMOS, Semiconductors, ASIC, Unix, Linux, Program Management, EDA, Integration, Physical Design, Simulations, Characterization, C++, Technical Leadership, Project Management, C, Software Development, Testing, Shell Scripting, Cross-functional Team..., Embedded Systems, Verilog, VLSI, System Architecture, Static Timing Analysis, IC, Debugging, Manufacturing, Computer Architecture
Education
Polytechnic University 1985 — 1989
BSEE, Electrical, Electronics and Communications Engineering
GLOBALFOUNDRIES July 2015 - Present
IBM March 2008 - June 2015
IBM Microelectronics 2008 - June 2015
IBM Microelectronics Division, Fishkill NY, USA 1988 - June 2015
IBM July 2000 - February 2008
IBM May 1993 - June 2000
Skills
Perl, CMOS, Semiconductors, ASIC, Unix, Linux, Program Management, EDA, Integration, Physical Design, Simulations, Characterization, C++, Technical Leadership, Project Management, C, Software Development, Testing, Shell Scripting, Cross-functional Team..., Embedded Systems, Verilog, VLSI, System Architecture, Static Timing Analysis, IC, Debugging, Manufacturing, Computer Architecture
Education
Polytechnic University 1985 — 1989
BSEE, Electrical, Electronics and Communications Engineering
Tami Vize's IBM Microelectronics Experience 2001 - December 2012
Job Failure Analysis Engineering Manager at IBM
Industry Semiconductors
Experience
Global Foundries Failure Analysis Engineering ManagerIBMDecember 2013 - June 2015
IBM Microelectronics 2001 - December 2012
Skills
Semiconductors, Characterization, Failure Analysis, IC, CMOS, Thin Films, ASIC, Design of Experiments, Simulations, Nanotechnology, Physics, Semiconductor Industry, Electronics, Labview, Materials Science, Circuit Design, R&D, Engineering Management, Analog Circuit Design, Analog, Process Integration, Mixed Signal, VLSI, Debugging, Engineering, SPC, Verilog, SoC
Education
Saint Michael's College 2007 — 2009
Certificate in Administration
University of Vermont 2003 — 2007
M.S., Materials Science
University of Illinois at Urbana-Champaign 1997 — 2001
B.S., Materials Science and Engineering
Global Foundries Failure Analysis Engineering ManagerIBMDecember 2013 - June 2015
IBM Microelectronics 2001 - December 2012
Skills
Semiconductors, Characterization, Failure Analysis, IC, CMOS, Thin Films, ASIC, Design of Experiments, Simulations, Nanotechnology, Physics, Semiconductor Industry, Electronics, Labview, Materials Science, Circuit Design, R&D, Engineering Management, Analog Circuit Design, Analog, Process Integration, Mixed Signal, VLSI, Debugging, Engineering, SPC, Verilog, SoC
Education
Saint Michael's College 2007 — 2009
Certificate in Administration
University of Vermont 2003 — 2007
M.S., Materials Science
University of Illinois at Urbana-Champaign 1997 — 2001
B.S., Materials Science and Engineering
Chris Sheraw's IBM Microelectronics Experience February 2003 - June 2015
Job Senior Engineer at IBM, Semiconductor Process Integration
Industry Semiconductors
Experience
GLOBALFOUNDRIES July 2015 - Present
IBM Microelectronics February 2003 - June 2015
Skills
Semiconductors, CMOS, Integration, Electrical Engineering, IC, Simulations, ASIC, Engineering, Semiconductor Process, Process Integration, VLSI, Process Simulation, Circuit Design, Electronics, Engineering Management
Education
Penn State University 2000 — 2003
Ph.D, Electrical Engineering
Penn State University 1998 — 2000
M.S., Electrical Engineering
Penn State University 1993 — 1997
B.S., Electrical Engineering
GLOBALFOUNDRIES July 2015 - Present
IBM Microelectronics February 2003 - June 2015
Skills
Semiconductors, CMOS, Integration, Electrical Engineering, IC, Simulations, ASIC, Engineering, Semiconductor Process, Process Integration, VLSI, Process Simulation, Circuit Design, Electronics, Engineering Management
Education
Penn State University 2000 — 2003
Ph.D, Electrical Engineering
Penn State University 1998 — 2000
M.S., Electrical Engineering
Penn State University 1993 — 1997
B.S., Electrical Engineering
Bernard T Clark's IBM Microelectronics Experience 1993 - 1995
Job Technology & Management Consultant
Industry Management Consulting
Experience
Technology Consultant 2004 - Present
Photon Dynamics March 2000 - March 2003
IBM Storage Systems October 1995 - March 2000
IBM Microelectronics 1993 - 1995
IBM Microelectronics 1990 - 1993
Skills
Semiconductors, Product Development, Manufacturing, Product Marketing, Failure Analysis, Product Management, Process Development, New Business Development, Customer Relations, Quality Assurance, Business Strategy, Technology Development, 3D Packaging, R&D, Cross-functional Team..., Program Management, Flip Chip, Die Attach, Semiconductor Packaging, Interconnects, WLP, Electronic Cooling, Heat Transfer, Flat Panel Display, Start-ups, Engineering Management, Process Improvement, Engineering, Strategic Planning, Mergers, Semiconductor Failure..., Customer Service, Mergers & Acquisitions, Process Simulation, Semiconductor Industry, Thin Films, Management, IC, Process Engineering, Electronics, Product Lifecycle..., Six Sigma, Design of Experiments
Education
New York University
Bachelor’s Degree, Mechanical, Electrical Engineering & Material Science
Syracuse University
Technology Consultant 2004 - Present
Photon Dynamics March 2000 - March 2003
IBM Storage Systems October 1995 - March 2000
IBM Microelectronics 1993 - 1995
IBM Microelectronics 1990 - 1993
Skills
Semiconductors, Product Development, Manufacturing, Product Marketing, Failure Analysis, Product Management, Process Development, New Business Development, Customer Relations, Quality Assurance, Business Strategy, Technology Development, 3D Packaging, R&D, Cross-functional Team..., Program Management, Flip Chip, Die Attach, Semiconductor Packaging, Interconnects, WLP, Electronic Cooling, Heat Transfer, Flat Panel Display, Start-ups, Engineering Management, Process Improvement, Engineering, Strategic Planning, Mergers, Semiconductor Failure..., Customer Service, Mergers & Acquisitions, Process Simulation, Semiconductor Industry, Thin Films, Management, IC, Process Engineering, Electronics, Product Lifecycle..., Six Sigma, Design of Experiments
Education
New York University
Bachelor’s Degree, Mechanical, Electrical Engineering & Material Science
Syracuse University
Jeffrey Chiecko's IBM Microelectronics Experience 2000 - 2005
Job Research Scientist II at BristolMyers Squibb
Industry Biotechnology
Experience
Bristol-Myers Squibb 2013 - Present
Bristol-Myers Squibb 2011 - 2013
Bristol-Myers Squibb 2010 - 2011
Regeneron Pharmaceuticals 2009 - 2010
University of Massachusetts, Amherst 2006 - 2009
IBM Microelectronics 2000 - 2005
Skills
Biotechnology, Molecular Biology, R&D, Research, Drug Discovery, Lifesciences, Cell, Cell Culture, GLP, Biochemistry, Microscopy, Pharmaceutical Industry, Validation, PCR, Life Sciences, LC-MS
Education
University of Massachusetts, Amherst 2006 — 2009
MS, Molecular Biology
University of Massachusetts, Amherst 1996 — 2000
BS, Electrical Engineering
Bristol-Myers Squibb 2013 - Present
Bristol-Myers Squibb 2011 - 2013
Bristol-Myers Squibb 2010 - 2011
Regeneron Pharmaceuticals 2009 - 2010
University of Massachusetts, Amherst 2006 - 2009
IBM Microelectronics 2000 - 2005
Skills
Biotechnology, Molecular Biology, R&D, Research, Drug Discovery, Lifesciences, Cell, Cell Culture, GLP, Biochemistry, Microscopy, Pharmaceutical Industry, Validation, PCR, Life Sciences, LC-MS
Education
University of Massachusetts, Amherst 2006 — 2009
MS, Molecular Biology
University of Massachusetts, Amherst 1996 — 2000
BS, Electrical Engineering
Randy Mann's IBM Microelectronics Experience 2003 - 2007
Job Principle Member of Technical Staff
Industry Electrical/Electronic Manufacturing
Experience
GLOBALFOUNDRIES October 2010 - Present
QED2 May 2008 - October 2010
RFMD July 2007 - May 2008
RF Micro Devices, Inc. 2007 - 2008
IBM June 1982 - June 2007
IBM Microelectronics 2003 - 2007
Skills
Materials Science, Semiconductor Device, Semiconductors, IC, CMOS, Characterization, Simulations, SoC, Testing, VLSI, Process Integration, Matlab, SRAM, Integrated Circuit..., Yield, Mixed Signal, Silicon, Low-power Design, Semiconductor Industry, Semiconductor Process
Education
UVA 2008 — 2010
Ph.D., Electrical Engineering
University of Notre Dame 1980 — 1982
Master of Science (MS), Metallurgical Engineering
University of North Carolina at Greensboro 1974 — 1979
BS, Chemistry
GLOBALFOUNDRIES October 2010 - Present
QED2 May 2008 - October 2010
RFMD July 2007 - May 2008
RF Micro Devices, Inc. 2007 - 2008
IBM June 1982 - June 2007
IBM Microelectronics 2003 - 2007
Skills
Materials Science, Semiconductor Device, Semiconductors, IC, CMOS, Characterization, Simulations, SoC, Testing, VLSI, Process Integration, Matlab, SRAM, Integrated Circuit..., Yield, Mixed Signal, Silicon, Low-power Design, Semiconductor Industry, Semiconductor Process
Education
UVA 2008 — 2010
Ph.D., Electrical Engineering
University of Notre Dame 1980 — 1982
Master of Science (MS), Metallurgical Engineering
University of North Carolina at Greensboro 1974 — 1979
BS, Chemistry
Jeffery Maxson's IBM Microelectronics Experience August 2014 - June 2015
Job 22nm Characterization Program Manager at GLOBALFOUNDRIES
Industry Semiconductors
Experience
GLOBALFOUNDRIES July 2015 - Present
IBM Microelectronics August 2014 - June 2015
IBM Microelectronics August 2013 - August 2014
IBM Microelectronics November 2009 - August 2013
IBM March 2006 - November 2009
IBM June 2003 - March 2006
IBM June 2001 - June 2003
Skills
Process Integration, Failure Analysis, Materials Science, PECVD, Semiconductors, Lean Manufacturing, Teaching, Process Engineering, Design of Experiments, Six Sigma, Characterization, Integration, Thin Films, Semiconductor Industry, Quality Management, Patents, Engineering, ASIC, Root Cause Analysis, Continuous Improvement, Program Management, CMOS, Physics, SPC, IC, Process Simulation
Education
University of Wisconsin-Madison 1995 — 2001
Ph.D., Materials Science
Oklahoma State University 1991 — 1995
BS, Chemical Engineering
GLOBALFOUNDRIES July 2015 - Present
IBM Microelectronics August 2014 - June 2015
IBM Microelectronics August 2013 - August 2014
IBM Microelectronics November 2009 - August 2013
IBM March 2006 - November 2009
IBM June 2003 - March 2006
IBM June 2001 - June 2003
Skills
Process Integration, Failure Analysis, Materials Science, PECVD, Semiconductors, Lean Manufacturing, Teaching, Process Engineering, Design of Experiments, Six Sigma, Characterization, Integration, Thin Films, Semiconductor Industry, Quality Management, Patents, Engineering, ASIC, Root Cause Analysis, Continuous Improvement, Program Management, CMOS, Physics, SPC, IC, Process Simulation
Education
University of Wisconsin-Madison 1995 — 2001
Ph.D., Materials Science
Oklahoma State University 1991 — 1995
BS, Chemical Engineering
Umar Ahmad's IBM Microelectronics Experience April 1979 - February 2002
Job Computer Hardware Professional
Industry Computer Hardware
Experience
IBM Microelectronics April 1979 - February 2002
Education
New Mexico Institute of Mining and Technology 1972 — 1975
Ph.D., Metallurgy (Physical & Extractive)
IBM Microelectronics April 1979 - February 2002
Education
New Mexico Institute of Mining and Technology 1972 — 1975
Ph.D., Metallurgy (Physical & Extractive)
Peter Ludlow's IBM Microelectronics Experience 1964 - 1994
Job Adjunct Instructor at Marist College
Industry Electrical/Electronic Manufacturing
Experience
Marist College 2006 - Present
Dutchess Community College 2002 - 2006
Engineering Management Associates Inc 1994 - 2002
IBM 1964 - 1994
IBM Microelectronics 1964 - 1994
Skills
Research, Staff Development, Higher Education, Teaching, Program Management, Public Speaking, Management, Leadership Development, Grant Writing, Educational Technology
Education
Syracuse University 1965 — 1974
MSEE, Electronic Circuits and Systems
Union College 1960 — 1964
BSEE, Electrical Engineering
Marist College 2006 - Present
Dutchess Community College 2002 - 2006
Engineering Management Associates Inc 1994 - 2002
IBM 1964 - 1994
IBM Microelectronics 1964 - 1994
Skills
Research, Staff Development, Higher Education, Teaching, Program Management, Public Speaking, Management, Leadership Development, Grant Writing, Educational Technology
Education
Syracuse University 1965 — 1974
MSEE, Electronic Circuits and Systems
Union College 1960 — 1964
BSEE, Electrical Engineering
Philip Theodoseau's IBM Microelectronics Experience June 1979 - June 2004
Job Test Engineering Manager at Viking Technology ( SanminaSci company )
Industry Semiconductors
Experience
Viking Technology, Division of Sanmina-SCI November 2009 - Present
Viking Technology, Division of Sanmina Corporation November 2009 - Present
Qimonda NA June 2007 - November 2008
Infineon / Qimonda 2005 - 2008
Infineon Technologies 2004 - 2008
Qimonda(formerly Infineon) 2004 - 2008
IBM Microelectronics June 1979 - June 2004
IBM 1978 - 2004
IBM MicroElectroics- USA 1979 - 2003
Skills
Testing, Quality Control, Quality Assurance, Semiconductors, Failure Analysis, Engineering, Debugging, Test Engineering, Product Management, Manufacturing, Electronics, Product Development, Integration, Program Management, Software Development, Engineering Management, Test Equipment, DRAM, SSD, Semiconductor Industry, Embedded Systems, Microprocessors, Hardware Architecture, Design of Experiments, ASIC, Characterization, SPC, Analog, Product Engineering, IC, Circuit Design, EDA, DFT, PCB design, SATA, Simulations, CMOS, DDR3
Education
State University of New York College at Oswego 1972 — 1976
BS, Technology Education
Viking Technology, Division of Sanmina-SCI November 2009 - Present
Viking Technology, Division of Sanmina Corporation November 2009 - Present
Qimonda NA June 2007 - November 2008
Infineon / Qimonda 2005 - 2008
Infineon Technologies 2004 - 2008
Qimonda(formerly Infineon) 2004 - 2008
IBM Microelectronics June 1979 - June 2004
IBM 1978 - 2004
IBM MicroElectroics- USA 1979 - 2003
Skills
Testing, Quality Control, Quality Assurance, Semiconductors, Failure Analysis, Engineering, Debugging, Test Engineering, Product Management, Manufacturing, Electronics, Product Development, Integration, Program Management, Software Development, Engineering Management, Test Equipment, DRAM, SSD, Semiconductor Industry, Embedded Systems, Microprocessors, Hardware Architecture, Design of Experiments, ASIC, Characterization, SPC, Analog, Product Engineering, IC, Circuit Design, EDA, DFT, PCB design, SATA, Simulations, CMOS, DDR3
Education
State University of New York College at Oswego 1972 — 1976
BS, Technology Education
Greg Mojzak's IBM Microelectronics Experience 2000 - 2007
Job project engineer at Dow Corning Electronic Materials Group
Industry Electrical/Electronic Manufacturing
Experience
Dow Corning Electronic Materials Group April 2011 - Present
Evergreen Solar September 2008 - March 2010
Qimonda July 2007 - September 2008
IBM Microelectronics 2000 - 2007
LSI Logic 1997 - 1999
National Semiconductor 1994 - 1997
Digital Equipment Corp. 1984 - 1994
Skills
SPC, Design of Experiments, Semiconductors, Six Sigma, Thin Films, Continuous Improvement, Manufacturing, Characterization, Engineering Management, CVD, Product Engineering, Process Integration, Yield, Engineering, Process Improvement, Testing, Manufacturing..., IC
Education
North Carolina State University 1987 — 1989
M.S., Statistics
University of Michigan 1975 — 1979
B.S., Chemical Engineering
Dow Corning Electronic Materials Group April 2011 - Present
Evergreen Solar September 2008 - March 2010
Qimonda July 2007 - September 2008
IBM Microelectronics 2000 - 2007
LSI Logic 1997 - 1999
National Semiconductor 1994 - 1997
Digital Equipment Corp. 1984 - 1994
Skills
SPC, Design of Experiments, Semiconductors, Six Sigma, Thin Films, Continuous Improvement, Manufacturing, Characterization, Engineering Management, CVD, Product Engineering, Process Integration, Yield, Engineering, Process Improvement, Testing, Manufacturing..., IC
Education
North Carolina State University 1987 — 1989
M.S., Statistics
University of Michigan 1975 — 1979
B.S., Chemical Engineering
Ray DiCecco's IBM Microelectronics Experience 1996 - 2004
Job Application Engineer at Texas Instruments
Industry Consumer Electronics
Experience
Texas Instruments January 2014 - Present
Texas Instruments May 2010 - Present
ON Semiconductor 2007 - May 2011
Intersil 2004 - 2007
IBM Microelectronics 1996 - 2004
Philips Semiconductors 1995 - 1996
Cherry Semiconductor 1987 - 1995
Skills
Power Management, IC, Analog, Mixed Signal, Semiconductors, Product Engineering, Semiconductor Industry, Test Engineering, Power Electronics, Analog Circuit Design, RF, DFT, Testing, CMOS, ASIC, Yield, Test Development, Circuit Design, Debugging
Education
University of Rhode Island
BSEE, Electrical Engineering
University of Rhode Island
Bachelor's degree, Electrical Engineering
Texas Instruments January 2014 - Present
Texas Instruments May 2010 - Present
ON Semiconductor 2007 - May 2011
Intersil 2004 - 2007
IBM Microelectronics 1996 - 2004
Philips Semiconductors 1995 - 1996
Cherry Semiconductor 1987 - 1995
Skills
Power Management, IC, Analog, Mixed Signal, Semiconductors, Product Engineering, Semiconductor Industry, Test Engineering, Power Electronics, Analog Circuit Design, RF, DFT, Testing, CMOS, ASIC, Yield, Test Development, Circuit Design, Debugging
Education
University of Rhode Island
BSEE, Electrical Engineering
University of Rhode Island
Bachelor's degree, Electrical Engineering
Patrick Chiumiento's IBM Microelectronics Experience 1992 - 1994
Job
Industry Semiconductors
Experience
Solantro Semiconductor Corp March 2014 - Present
Lucid Technologies, Inc. March 2009 - August 2013
Memsic, Inc January 2007 - December 2008
ChipWrights, Inc. March 2005 - January 2007
Chipwrights, Inc. 2000 - 2005
Wave Systems August 1999 - January 2000
N*Able Technologies, Inc. 1996 - 1999
Databook Corporation 1994 - 1996
IBM Microelectronics 1992 - 1994
Chips and Technologies, Inc. 1987 - 1992
Skills
Managing Start-ups, Global Business..., ASIC, Semiconductors, Sales Management, Marketing Strategy, Product Launch, Start-ups, Product Marketing, SoC, Business Development, Digital Signal..., International Sales, Go-to-market Strategy, Competitive Analysis, IC, Strategic Partnerships, Cross-functional Team..., Product Management, Electronics, Consumer Electronics, Mobile Devices, Product Development, Wireless, EDA, Analog, Hardware Architecture
Education
University of Massachusetts at Lowell 1969 — 1973
BSEE
Solantro Semiconductor Corp March 2014 - Present
Lucid Technologies, Inc. March 2009 - August 2013
Memsic, Inc January 2007 - December 2008
ChipWrights, Inc. March 2005 - January 2007
Chipwrights, Inc. 2000 - 2005
Wave Systems August 1999 - January 2000
N*Able Technologies, Inc. 1996 - 1999
Databook Corporation 1994 - 1996
IBM Microelectronics 1992 - 1994
Chips and Technologies, Inc. 1987 - 1992
Skills
Managing Start-ups, Global Business..., ASIC, Semiconductors, Sales Management, Marketing Strategy, Product Launch, Start-ups, Product Marketing, SoC, Business Development, Digital Signal..., International Sales, Go-to-market Strategy, Competitive Analysis, IC, Strategic Partnerships, Cross-functional Team..., Product Management, Electronics, Consumer Electronics, Mobile Devices, Product Development, Wireless, EDA, Analog, Hardware Architecture
Education
University of Massachusetts at Lowell 1969 — 1973
BSEE
JJ Maloney's IBM Microelectronics Experience 2006 - Present
Job Senior Organic Package Reliability Engineer at IBM
Industry Semiconductors
Experience
IBM January 2006 - Present
IBM Microelectronics 2006 - Present
IBM Systems & Technology Group 2006 - Present
ibm 1981 - 2009
IBM September 1998 - December 2005
IBM September 1993 - August 1998
Education
University of California, Davis 1979 — 1981
M.S., Physical Chemistry
Notre Dame de Namur University 1975 — 1979
B.S., Chemistry
Notre Dame de Namur University 1975 — 1979
B.S., Biology
IBM January 2006 - Present
IBM Microelectronics 2006 - Present
IBM Systems & Technology Group 2006 - Present
ibm 1981 - 2009
IBM September 1998 - December 2005
IBM September 1993 - August 1998
Education
University of California, Davis 1979 — 1981
M.S., Physical Chemistry
Notre Dame de Namur University 1975 — 1979
B.S., Chemistry
Notre Dame de Namur University 1975 — 1979
B.S., Biology
Chris Seguin's IBM Microelectronics Experience July 2009 - March 2014
Job Applications Engineer at Cascade Microtech
Industry Semiconductors
Experience
Cascade Microtech March 2014 - Present
IBM Microelectronics July 2009 - March 2014
IBM 2004 - 2009
IBM 1994 - 2004
IBM June 1987 - 1994
Skills
VLSI, Circuit Design, Visual Basic, Visual Studio, Perl Script, PHP, MySQL, SQL, HTML, JavaScript, Cadence Virtuoso, Cadence Skill, Failure Analysis, Device Characterization, Electrical Engineering, Electrical Equipment, Testing, Test Automation, Regression Testing, Software Development, Root Cause Analysis, Rational Team Concert, Scrum, Agile Methodologies, CMOS, Semiconductors, SPICE, IC, ASIC, Mixed Signal, Analog Circuit Design, Perl, Electronics, Debugging, EDA
Education
University of Illinois Springfield 2007 — 2009
CS, Computer Science
University of Vermont 1989 — 2009
EE (6 more courses left), Electrical Engineering
Vermont Technical College 1985 — 1987
EET, Electronics
Cascade Microtech March 2014 - Present
IBM Microelectronics July 2009 - March 2014
IBM 2004 - 2009
IBM 1994 - 2004
IBM June 1987 - 1994
Skills
VLSI, Circuit Design, Visual Basic, Visual Studio, Perl Script, PHP, MySQL, SQL, HTML, JavaScript, Cadence Virtuoso, Cadence Skill, Failure Analysis, Device Characterization, Electrical Engineering, Electrical Equipment, Testing, Test Automation, Regression Testing, Software Development, Root Cause Analysis, Rational Team Concert, Scrum, Agile Methodologies, CMOS, Semiconductors, SPICE, IC, ASIC, Mixed Signal, Analog Circuit Design, Perl, Electronics, Debugging, EDA
Education
University of Illinois Springfield 2007 — 2009
CS, Computer Science
University of Vermont 1989 — 2009
EE (6 more courses left), Electrical Engineering
Vermont Technical College 1985 — 1987
EET, Electronics
John Ellis-Monaghan's IBM Microelectronics Experience 2006 - August 2015
Job STSM at GLOBALFOUNDRIES
Industry Semiconductors
Experience
GLOBALFOUNDRIES September 2015 - Present
IBM Microelectronics 2006 - August 2015
Skills
CMOS, Semiconductors, Circuit Design, Simulations, ASIC, Testing, Logic Design, Hardware Architecture, Device Engineering, Computer Architecture, Software Development, Perl, Device Characterization, Processors, VLSI, Analog
Education
North Carolina State University
Doctor of Philosophy (PhD), Electrical Engineering
University of Notre Dame
Bachelor of Science (BS), Electrical and Electronics Engineering
University of Vermont
Master of Science (MS), Mathematics
GLOBALFOUNDRIES September 2015 - Present
IBM Microelectronics 2006 - August 2015
Skills
CMOS, Semiconductors, Circuit Design, Simulations, ASIC, Testing, Logic Design, Hardware Architecture, Device Engineering, Computer Architecture, Software Development, Perl, Device Characterization, Processors, VLSI, Analog
Education
North Carolina State University
Doctor of Philosophy (PhD), Electrical Engineering
University of Notre Dame
Bachelor of Science (BS), Electrical and Electronics Engineering
University of Vermont
Master of Science (MS), Mathematics
David Selinger's IBM Microelectronics Experience May 2000 - August 2002
Job Engineering Professional
Industry Electrical/Electronic Manufacturing
Experience
Computer Task Group March 2006 - December 2008
Intellon Corporation June 2004 - September 2005
IBM Microelectronics May 2000 - August 2002
LSI Logic January 1998 - August 1999
Cray Research 1985 - 1987
Education
University of California, Los Angeles 1989 — 1990
Secondary School Teacher's Credential, Education
University of Toronto 1981 — 1985
MSEE, Electronics Engineering
Computer Task Group March 2006 - December 2008
Intellon Corporation June 2004 - September 2005
IBM Microelectronics May 2000 - August 2002
LSI Logic January 1998 - August 1999
Cray Research 1985 - 1987
Education
University of California, Los Angeles 1989 — 1990
Secondary School Teacher's Credential, Education
University of Toronto 1981 — 1985
MSEE, Electronics Engineering
Chuck Griffin's IBM Microelectronics Experience Technology ReliabilityIBM1995 - Present
Job Senior Engineer/Reliability Test Structure Design at IBM Microelectronics
Industry Semiconductors
Experience
IBM Microelectronics Technology ReliabilityIBM1995 - Present
Skills
Physical Design, Testing, Unix, Program Management, Integration, Software Development, Linux, Project Management, Perl, C, Requirements Analysis, Simulations, Electronics, ASIC, Cross-functional Team..., IC, Semiconductors, Circuit Design, C++
Education
Tufts University
Master of Science (MS), Electrical and Electronics Engineering
IBM Microelectronics Technology ReliabilityIBM1995 - Present
Skills
Physical Design, Testing, Unix, Program Management, Integration, Software Development, Linux, Project Management, Perl, C, Requirements Analysis, Simulations, Electronics, ASIC, Cross-functional Team..., IC, Semiconductors, Circuit Design, C++
Education
Tufts University
Master of Science (MS), Electrical and Electronics Engineering
Barbara Wesolowski's IBM Microelectronics Experience 2000 - 2008
Job Senior Director HR Operations at GLOBALFOUNDRIES
Industry Semiconductors
Experience
GLOBALFOUNDRIES April 2011 - Present
GLOBALFOUNDRIES August 2008 - April 2011
IBM Microelectronics 2000 - 2008
IBM 1977 - 2008
Skills
Integration, Program Management, Process Engineering, Business Process..., Cross-functional Team..., Business Transformation, Vendor Management, Process Improvement, ERP, Business Process, Six Sigma, Strategy, SDLC, Project Portfolio..., PMP
Education
University of Scranton
Bachelor of Science (BS), Computer Science
University of Scranton
Bachelor of Science (BS), Accounting
GLOBALFOUNDRIES April 2011 - Present
GLOBALFOUNDRIES August 2008 - April 2011
IBM Microelectronics 2000 - 2008
IBM 1977 - 2008
Skills
Integration, Program Management, Process Engineering, Business Process..., Cross-functional Team..., Business Transformation, Vendor Management, Process Improvement, ERP, Business Process, Six Sigma, Strategy, SDLC, Project Portfolio..., PMP
Education
University of Scranton
Bachelor of Science (BS), Computer Science
University of Scranton
Bachelor of Science (BS), Accounting
David Grubb's IBM Microelectronics Experience 1998 - 2003
Job Test Engineering
Industry Semiconductors
Experience
GLOBALFOUNDRIES March 2011 - Present
IBM 2007 - June 2009
IBM Systems & Technology Group, Semiconductor Solutions 2003 - 2007
IBM Microelectronics 1998 - 2003
IBM Microelectronics 1997 - 1998
IBM Microelectronics 1994 - 1997
IBM 1985 - 1994
IBM Federal Systems Division 1981 - 1985
Daytronic Corp. 1979 - 1981
Skills
Testing, Perl, Integration, Automation, Troubleshooting, Linux, Debugging, Hardware, Operating Systems, Manufacturing, Solaris, SPC, Failure Analysis, C++, Java, ASIC, Servers, PCB design, Engineering, Test Equipment, Embedded Systems, Semiconductors, Semiconductor Industry, CMOS, Unix, Electronics, Networking, IC, Windows, Characterization, Test Automation, C, System Architecture, Design of Experiments, AIX, Product Engineering, Programming, DB2
Education
ITT Technical Institute 1979 — 1981
AS, Electronic Engineering Technology
Ohio University 1977 — 1978
Business
GLOBALFOUNDRIES March 2011 - Present
IBM 2007 - June 2009
IBM Systems & Technology Group, Semiconductor Solutions 2003 - 2007
IBM Microelectronics 1998 - 2003
IBM Microelectronics 1997 - 1998
IBM Microelectronics 1994 - 1997
IBM 1985 - 1994
IBM Federal Systems Division 1981 - 1985
Daytronic Corp. 1979 - 1981
Skills
Testing, Perl, Integration, Automation, Troubleshooting, Linux, Debugging, Hardware, Operating Systems, Manufacturing, Solaris, SPC, Failure Analysis, C++, Java, ASIC, Servers, PCB design, Engineering, Test Equipment, Embedded Systems, Semiconductors, Semiconductor Industry, CMOS, Unix, Electronics, Networking, IC, Windows, Characterization, Test Automation, C, System Architecture, Design of Experiments, AIX, Product Engineering, Programming, DB2
Education
ITT Technical Institute 1979 — 1981
AS, Electronic Engineering Technology
Ohio University 1977 — 1978
Business
Chris Verne's IBM Microelectronics Experience 2000 - 2001
Job Executive Director, EBG at Lenovo
Industry Computer Hardware
Experience
Lenovo October 2014 - Present
IBM June 2010 - September 2014
IBM April 2007 - June 2010
IBM Microelectronics 2000 - 2001
Skills
Cloud Computing, Storage, Virtualization, Data Center, Integration, IT Strategy, Storage Area Networks, Solution Architecture, Software Development, Hardware, Enterprise Architecture, Enterprise Software, Business Intelligence, Agile Methodologies
Education
North Carolina State University 1984 — 1989
BS, Electrical Engineering
Lenovo October 2014 - Present
IBM June 2010 - September 2014
IBM April 2007 - June 2010
IBM Microelectronics 2000 - 2001
Skills
Cloud Computing, Storage, Virtualization, Data Center, Integration, IT Strategy, Storage Area Networks, Solution Architecture, Software Development, Hardware, Enterprise Architecture, Enterprise Software, Business Intelligence, Agile Methodologies
Education
North Carolina State University 1984 — 1989
BS, Electrical Engineering
Ahmad Ansari's IBM Microelectronics Experience November 1994 - December 1997
Job Principal Engineer at Xilinx
Industry Semiconductors
Experience
Xilinx June 2000 - Present
NEC Electronics, Inc. 1997 - 2000
IBM Microelectronics November 1994 - December 1997
High-Speed Digital Architecture Laboratory, Univerisity of Florida June 1988 - November 1994
Skills
SoC, RTL design, Semiconductors, Processors, Verilog, Low-power Design, ASIC, FPGA, Hardware Architecture, Embedded Systems, Integrated Circuit..., Digital Signal..., Parallel Processing
Education
University of Florida
Ph.D., Computer Architecture
Xilinx June 2000 - Present
NEC Electronics, Inc. 1997 - 2000
IBM Microelectronics November 1994 - December 1997
High-Speed Digital Architecture Laboratory, Univerisity of Florida June 1988 - November 1994
Skills
SoC, RTL design, Semiconductors, Processors, Verilog, Low-power Design, ASIC, FPGA, Hardware Architecture, Embedded Systems, Integrated Circuit..., Digital Signal..., Parallel Processing
Education
University of Florida
Ph.D., Computer Architecture
Brian Oltman's IBM Microelectronics Experience May 2006 - August 2006
Job Strategic Buyer at Tyco International
Industry Logistics and Supply Chain
Experience
Tyco International April 2010 - Present
HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES August 2007 - April 2010
IBM MICROELECTRONICS May 2006 - August 2006
John Deere May 2005 - August 2005
Skills
Six Sigma, Supply Management, SAP, Cross-functional Team..., Purchasing, Strategic Sourcing, Outsourcing, Global Sourcing, Supply Chain, Strategy, Procurement, MRP, Supply Chain..., Materials Management, Management, Process Improvement
Education
Winthrop University 2010 — 2013
MBA
Universität Paderborn / University of Paderborn 2007 — 2007
Western Michigan University - Haworth College of Business 2003 — 2007
Bachelor of Business Administration, Integrated Supply Management
Tyco International April 2010 - Present
HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES August 2007 - April 2010
IBM MICROELECTRONICS May 2006 - August 2006
John Deere May 2005 - August 2005
Skills
Six Sigma, Supply Management, SAP, Cross-functional Team..., Purchasing, Strategic Sourcing, Outsourcing, Global Sourcing, Supply Chain, Strategy, Procurement, MRP, Supply Chain..., Materials Management, Management, Process Improvement
Education
Winthrop University 2010 — 2013
MBA
Universität Paderborn / University of Paderborn 2007 — 2007
Western Michigan University - Haworth College of Business 2003 — 2007
Bachelor of Business Administration, Integrated Supply Management
Wenjun Chen's IBM Microelectronics Experience July 2000 - October 2002
Job Senior RF Test Engineer at CSR
Industry
Experience
CSR July 2010 - Present
MaxLinear January 2010 - July 2010
TI October 2002 - May 2009
IBM Microelectronics July 2000 - October 2002
Skills
IC, Mixed Signal, Semiconductors, Analog Circuit Design, Analog, Cadence Virtuoso, Testing, CMOS, Electronics, RF, Circuit Design, Verilog, PCB design, Power Management, PLL, Debugging, ASIC, SoC, DFT
Education
University of Maryland College Park
Doctor of Philosophy (Ph.D.), Electrical and Electronics Engineering
CSR July 2010 - Present
MaxLinear January 2010 - July 2010
TI October 2002 - May 2009
IBM Microelectronics July 2000 - October 2002
Skills
IC, Mixed Signal, Semiconductors, Analog Circuit Design, Analog, Cadence Virtuoso, Testing, CMOS, Electronics, RF, Circuit Design, Verilog, PCB design, Power Management, PLL, Debugging, ASIC, SoC, DFT
Education
University of Maryland College Park
Doctor of Philosophy (Ph.D.), Electrical and Electronics Engineering
Alexander Cherkassky, PhD's IBM Microelectronics Experience September 1989 - September 1992
Job Sr Analog Mixed Signal RFIC Design Engineer at Texas Instruments
Industry Electrical/Electronic Manufacturing
Experience
Texas Instruments 2008 - Present
Linear Technology 2006 - 2008
Qualcomm QCT 2004 - 2006
Hughes Electronics 2000 - 2004
IBM Microelectronics September 1989 - September 1992
Skills
Mixed Signal, Analog Circuit Design, Analog, PLL, Integrated Circuit..., Signal Processing, SERDES, ADCs, RF design, Filters, Physics, IC, Power Management, ASIC, CMOS
Education
Massachusetts Institute of Technology 1987 — 1998
BS, MS '95, PhD '98, Electrical Engineering
University of California, Berkeley 2002 — 2004
Electrical Engineering
Texas Instruments 2008 - Present
Linear Technology 2006 - 2008
Qualcomm QCT 2004 - 2006
Hughes Electronics 2000 - 2004
IBM Microelectronics September 1989 - September 1992
Skills
Mixed Signal, Analog Circuit Design, Analog, PLL, Integrated Circuit..., Signal Processing, SERDES, ADCs, RF design, Filters, Physics, IC, Power Management, ASIC, CMOS
Education
Massachusetts Institute of Technology 1987 — 1998
BS, MS '95, PhD '98, Electrical Engineering
University of California, Berkeley 2002 — 2004
Electrical Engineering
Ward Engbrecht's IBM Microelectronics Experience June 2007 - July 2010
Job Manager, 14SOI/14nm FEOL Integration at IBM
Industry Semiconductors
Experience
IBM July 2014 - Present
IBM July 2010 - Present
IBM Microelectronics June 2007 - July 2010
Texas Instruments March 2004 - June 2007
International SEMATECH May 2004 - February 2006
Kraft Foods 1996 - 1999
Skills
Process Integration, Semiconductors, CMOS, JMP, Design of Experiments, ASIC, CVD, Process Simulation, Nanotechnology, IC, Characterization
Education
The University of Texas at Austin 1999 — 2004
PhD, Chemical Engineering
University of Illinois at Urbana-Champaign 1991 — 1995
BS, Chemical Engineering
IBM July 2014 - Present
IBM July 2010 - Present
IBM Microelectronics June 2007 - July 2010
Texas Instruments March 2004 - June 2007
International SEMATECH May 2004 - February 2006
Kraft Foods 1996 - 1999
Skills
Process Integration, Semiconductors, CMOS, JMP, Design of Experiments, ASIC, CVD, Process Simulation, Nanotechnology, IC, Characterization
Education
The University of Texas at Austin 1999 — 2004
PhD, Chemical Engineering
University of Illinois at Urbana-Champaign 1991 — 1995
BS, Chemical Engineering
Ray Chen's IBM Microelectronics Experience June 2000 - September 2000
Job Analog / RF / MixedSignal (AMS) IC Design and Management
Industry Semiconductors
Experience
Marvell Semiconductor August 2010 - Present
SiBEAM February 2010 - August 2010
Linear Technology October 2006 - January 2010
IBM Microelectronics June 2000 - September 2000
Department of Defense July 1997 - June 1999
Skills
Mixed Signal, RF circuits, Analog Circuit Design, Mixed-Signal IC Design, Analog, RF, IC, ASIC, Semiconductors, Signal Processing, Circuit Design, CMOS, SoC, Verilog
Education
Stanford University 1999 — 2006
Ph. D., Electrical Engineering
National Chiao Tung University 1993 — 1997
BS, Electronics Engineering
Marvell Semiconductor August 2010 - Present
SiBEAM February 2010 - August 2010
Linear Technology October 2006 - January 2010
IBM Microelectronics June 2000 - September 2000
Department of Defense July 1997 - June 1999
Skills
Mixed Signal, RF circuits, Analog Circuit Design, Mixed-Signal IC Design, Analog, RF, IC, ASIC, Semiconductors, Signal Processing, Circuit Design, CMOS, SoC, Verilog
Education
Stanford University 1999 — 2006
Ph. D., Electrical Engineering
National Chiao Tung University 1993 — 1997
BS, Electronics Engineering
Paul Gramann's IBM Microelectronics Experience 2008 - December 2012
Job Senior Engineer / Scientist at IBM
Industry Information Technology and Services
Experience
IBM August 2012 - Present
IBM Microelectronics 2008 - December 2012
Skills
Processors, Debugging, Logic Design, Embedded Systems, PowerPC, Embedded Software, Processor Modelling, Hardware Architecture, Computer Architecture, ARM, VHDL, Software Engineering, Linux, Software Development, Semiconductors, SoC, ASIC, System Architecture, Firmware, C, Functional Verification, System Design, Unix, High Performance..., C++, Technical Leadership, IC, Device Drivers, VLSI, Hardware, Verilog, FPGA, Microprocessors, Testing
Education
University of Minnesota-Twin Cities 1987 — 1995
MS, Computer Science
University of Virginia 1980 — 1984
BS, Electrical Engineering
IBM August 2012 - Present
IBM Microelectronics 2008 - December 2012
Skills
Processors, Debugging, Logic Design, Embedded Systems, PowerPC, Embedded Software, Processor Modelling, Hardware Architecture, Computer Architecture, ARM, VHDL, Software Engineering, Linux, Software Development, Semiconductors, SoC, ASIC, System Architecture, Firmware, C, Functional Verification, System Design, Unix, High Performance..., C++, Technical Leadership, IC, Device Drivers, VLSI, Hardware, Verilog, FPGA, Microprocessors, Testing
Education
University of Minnesota-Twin Cities 1987 — 1995
MS, Computer Science
University of Virginia 1980 — 1984
BS, Electrical Engineering
Mark LePrevost's IBM Microelectronics Experience February 2013 - July 2015
Job Facilities Engineer at GLOBALFOUNDRIES
Industry Semiconductors
Experience
GLOBALFOUNDRIES July 2015 - Present
IBM Microelectronics February 2013 - July 2015
IBM Microelectronics June 1984 - October 2011
Education
State University of New York at Delhi
GLOBALFOUNDRIES July 2015 - Present
IBM Microelectronics February 2013 - July 2015
IBM Microelectronics June 1984 - October 2011
Education
State University of New York at Delhi
Chung Lau's IBM Microelectronics Experience January 1995 - August 1997
Job Principal Engineer at Juniper Networks
Industry Computer Networking
Experience
Juniper Networks August 2000 - Present
Sun Microsystems 1997 - 2000
IBM Microelectronics January 1995 - August 1997
Skills
Network Processors, TCL, Multicast, JUNOS, Ethernet, VPLS, L2VPN, QoS, IPv6, SNMP, IXIA, FCoE, TCP/IP, RSVP, Routing, ASIC, SystemVerilog, RTL design, Debugging, RTL Design
Education
Stanford University
Master of Science (M.S.), Electrical and Electronics Engineering
University of Hawaii
Bachelor of Science (B.S.), Electrical and Electronics Engineering
Juniper Networks August 2000 - Present
Sun Microsystems 1997 - 2000
IBM Microelectronics January 1995 - August 1997
Skills
Network Processors, TCL, Multicast, JUNOS, Ethernet, VPLS, L2VPN, QoS, IPv6, SNMP, IXIA, FCoE, TCP/IP, RSVP, Routing, ASIC, SystemVerilog, RTL design, Debugging, RTL Design
Education
Stanford University
Master of Science (M.S.), Electrical and Electronics Engineering
University of Hawaii
Bachelor of Science (B.S.), Electrical and Electronics Engineering
albert vanorman's IBM Microelectronics Experience 1999 - 2001
Job Semiconductors Professional
Industry Semiconductors
Experience
ibm microelectronics 1999 - 2001
Education
Rochester Institute of Technology
ibm microelectronics 1999 - 2001
Education
Rochester Institute of Technology
Stephen Braunstein's IBM Microelectronics Experience 2000 - 2001
Job C++ Developer
Industry Computer Software
Experience
Unisoft 2004 - Present
GLOBALFOUNDRIES 2012 - 2013
FlexiInternational Software 2006 - 2012
Jackson National Life July 2005 - November 2005
Compliant Document Solutions 2003 - 2004
IBM Global Finance 2002 - 2003
Reader's Digest 2001 - 2002
IBM Microelectronics 2000 - 2001
IBM Global Systems 1997 - 1999
IBM Healthcare/IBM Research 1995 - 1997
Skills
C++, C, UNIX, Windows, Databases, C#, Unix, Testing, Software Development, Visual Basic, Troubleshooting, Oracle, Microsoft SQL Server, Agile Methodologies, SQL
Education
MIT
Bachelor of Science (BS), Mathematics
Unisoft 2004 - Present
GLOBALFOUNDRIES 2012 - 2013
FlexiInternational Software 2006 - 2012
Jackson National Life July 2005 - November 2005
Compliant Document Solutions 2003 - 2004
IBM Global Finance 2002 - 2003
Reader's Digest 2001 - 2002
IBM Microelectronics 2000 - 2001
IBM Global Systems 1997 - 1999
IBM Healthcare/IBM Research 1995 - 1997
Skills
C++, C, UNIX, Windows, Databases, C#, Unix, Testing, Software Development, Visual Basic, Troubleshooting, Oracle, Microsoft SQL Server, Agile Methodologies, SQL
Education
MIT
Bachelor of Science (BS), Mathematics
Andrew Pond's IBM Microelectronics Experience 1991 - 2013
Job Statistican and Data Analytics Expert
Industry Information Technology and Services
Experience
IBM 1992 - 2013
IBM Microelectronics 1991 - 2013
Skills
SAS, SPSS, SQL, Data Analysis, Analytics, Forecasting, Capacity Planning, Statistical Modeling, Statistics, Data Mining, Design of Experiments, SAS programming, Predictive Modeling, SAS Programming, Predictive Analytics, Cross-functional Team..., Simulations, Project Management, Integration
Education
University of Vermont 1990 — 1993
Master of Science (MS), Statistics
Middlebury College 1969 — 1973
Bachelor's degree, Geography
IBM 1992 - 2013
IBM Microelectronics 1991 - 2013
Skills
SAS, SPSS, SQL, Data Analysis, Analytics, Forecasting, Capacity Planning, Statistical Modeling, Statistics, Data Mining, Design of Experiments, SAS programming, Predictive Modeling, SAS Programming, Predictive Analytics, Cross-functional Team..., Simulations, Project Management, Integration
Education
University of Vermont 1990 — 1993
Master of Science (MS), Statistics
Middlebury College 1969 — 1973
Bachelor's degree, Geography
Michael Brodfuehrer's IBM Microelectronics Experience February 2001 - Present
Job Functional Characterization at IBM Microelectronics
Industry Electrical/Electronic Manufacturing
Experience
IBM Microelectronics February 2001 - Present
Lockheed Martin 1984 - 2000
Education
State University of New York at Buffalo 1996 — 2000
Bachelor of Science (BS), Electrical and Electronics Engineering
IBM Microelectronics February 2001 - Present
Lockheed Martin 1984 - 2000
Education
State University of New York at Buffalo 1996 — 2000
Bachelor of Science (BS), Electrical and Electronics Engineering